JPH021789A - 電気回路板 - Google Patents
電気回路板Info
- Publication number
- JPH021789A JPH021789A JP29910288A JP29910288A JPH021789A JP H021789 A JPH021789 A JP H021789A JP 29910288 A JP29910288 A JP 29910288A JP 29910288 A JP29910288 A JP 29910288A JP H021789 A JPH021789 A JP H021789A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- epoxy resin
- adhesive layer
- component
- bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 196
- 239000000853 adhesive Substances 0.000 title claims abstract description 187
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 110
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 110
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 32
- 239000002904 solvent Substances 0.000 claims abstract description 29
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 19
- 150000004820 halides Chemical class 0.000 claims abstract description 16
- 150000004985 diamines Chemical class 0.000 claims abstract description 15
- 239000004593 Epoxy Substances 0.000 claims abstract description 14
- 150000004984 aromatic diamines Chemical class 0.000 claims abstract description 10
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 10
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 10
- 238000004898 kneading Methods 0.000 claims abstract description 8
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims abstract description 7
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims abstract description 6
- 239000012790 adhesive layer Substances 0.000 claims description 104
- 239000000758 substrate Substances 0.000 claims description 32
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 12
- 230000009974 thixotropic effect Effects 0.000 claims description 12
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 11
- -1 glycidyl amines Chemical class 0.000 claims description 6
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 5
- 238000010790 dilution Methods 0.000 claims description 4
- 239000012895 dilution Substances 0.000 claims description 4
- 239000003607 modifier Substances 0.000 claims description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 3
- 239000004845 glycidylamine epoxy resin Substances 0.000 claims description 2
- 239000004843 novolac epoxy resin Substances 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 abstract description 12
- 238000002156 mixing Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 53
- 229910052751 metal Inorganic materials 0.000 description 40
- 239000002184 metal Substances 0.000 description 40
- 239000011888 foil Substances 0.000 description 28
- 230000000052 comparative effect Effects 0.000 description 19
- 239000007788 liquid Substances 0.000 description 16
- 239000004020 conductor Substances 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 10
- 230000007423 decrease Effects 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 239000004615 ingredient Substances 0.000 description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000008096 xylene Substances 0.000 description 6
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000007259 addition reaction Methods 0.000 description 4
- 239000008119 colloidal silica Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 125000005439 maleimidyl group Chemical class C1(C=CC(N1*)=O)=O 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 241000238557 Decapoda Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- WQJMUFDRKNDHSU-UHFFFAOYSA-N [amino(oxiran-2-yl)methoxy]-(oxiran-2-yl)methanamine Chemical compound C1OC1C(N)OC(N)C1CO1 WQJMUFDRKNDHSU-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- XENVCRGQTABGKY-ZHACJKMWSA-N chlorohydrin Chemical compound CC#CC#CC#CC#C\C=C\C(Cl)CO XENVCRGQTABGKY-ZHACJKMWSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 231100000171 higher toxicity Toxicity 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- IHHZKPZEXQPTAO-UHFFFAOYSA-N n,n'-dimethyl-n,n'-bis(2-methylphenyl)methanediamine Chemical compound C=1C=CC=C(C)C=1N(C)CN(C)C1=CC=CC=C1C IHHZKPZEXQPTAO-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- FIWHJQPAGLNURC-UHFFFAOYSA-N oxiran-2-ylmethyl 7,7-dimethyloctanoate Chemical compound CC(C)(C)CCCCCC(=O)OCC1CO1 FIWHJQPAGLNURC-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29910288A JPH021789A (ja) | 1988-02-24 | 1988-11-25 | 電気回路板 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4292988 | 1988-02-24 | ||
| JP63-42929 | 1988-02-24 | ||
| JP29910288A JPH021789A (ja) | 1988-02-24 | 1988-11-25 | 電気回路板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH021789A true JPH021789A (ja) | 1990-01-08 |
| JPH0529667B2 JPH0529667B2 (fr) | 1993-05-06 |
Family
ID=26382668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29910288A Granted JPH021789A (ja) | 1988-02-24 | 1988-11-25 | 電気回路板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH021789A (fr) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07122851A (ja) * | 1993-10-25 | 1995-05-12 | Hitachi Chem Co Ltd | 接着剤付き銅はく及びこの接着剤付き銅はくを用いた多層プリント配線板用銅張り積層板の製造方法 |
| JPH0967553A (ja) * | 1995-08-31 | 1997-03-11 | Sumitomo Bakelite Co Ltd | ダイボンディング用樹脂ペースト |
| EP0826755A2 (fr) * | 1996-08-24 | 1998-03-04 | Henkel Kommanditgesellschaft auf Aktien | Système adhésif pour des structures composites caoutchouc-métal |
| KR19980066134A (ko) * | 1997-01-20 | 1998-10-15 | 구광시 | 상온 보관 안정성이 우수한 이방 도전성 필름 |
| WO1999050369A1 (fr) * | 1998-03-31 | 1999-10-07 | Minnesota Mining And Manufacturing Company | Composition adhesive et precurseur de cette composition |
| WO2002086003A1 (fr) * | 2001-04-20 | 2002-10-31 | 3M Innovative Properties Company | Film adhesif thermodurcissable et structure adhesive basee sur l'utilisation de celui-ci |
| US6652962B1 (en) * | 1998-05-29 | 2003-11-25 | Mitsui Mining & Smelting Co. Ltd. | Resin-coated composite foil, production and use thereof |
| JP4520003B2 (ja) * | 2000-04-14 | 2010-08-04 | 株式会社カネカ | 硬化性組成物 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5359799A (en) * | 1976-11-10 | 1978-05-29 | Matsushita Electric Ind Co Ltd | Epoxy resin varnish |
| JPS5512175A (en) * | 1978-07-13 | 1980-01-28 | Matsushita Electric Ind Co Ltd | Resist ink |
| JPS58222108A (ja) * | 1982-06-18 | 1983-12-23 | Mitsui Petrochem Ind Ltd | エポキシ樹脂組成物の調製方法 |
| JPS59108072A (ja) * | 1982-12-11 | 1984-06-22 | Nitto Electric Ind Co Ltd | 常温粘着性を有する熱硬化性接着シ−ト |
| JPH01135884A (ja) * | 1987-11-19 | 1989-05-29 | Hitachi Chem Co Ltd | 銅張積層板用銅箔接着剤 |
-
1988
- 1988-11-25 JP JP29910288A patent/JPH021789A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5359799A (en) * | 1976-11-10 | 1978-05-29 | Matsushita Electric Ind Co Ltd | Epoxy resin varnish |
| JPS5512175A (en) * | 1978-07-13 | 1980-01-28 | Matsushita Electric Ind Co Ltd | Resist ink |
| JPS58222108A (ja) * | 1982-06-18 | 1983-12-23 | Mitsui Petrochem Ind Ltd | エポキシ樹脂組成物の調製方法 |
| JPS59108072A (ja) * | 1982-12-11 | 1984-06-22 | Nitto Electric Ind Co Ltd | 常温粘着性を有する熱硬化性接着シ−ト |
| JPH01135884A (ja) * | 1987-11-19 | 1989-05-29 | Hitachi Chem Co Ltd | 銅張積層板用銅箔接着剤 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07122851A (ja) * | 1993-10-25 | 1995-05-12 | Hitachi Chem Co Ltd | 接着剤付き銅はく及びこの接着剤付き銅はくを用いた多層プリント配線板用銅張り積層板の製造方法 |
| JPH0967553A (ja) * | 1995-08-31 | 1997-03-11 | Sumitomo Bakelite Co Ltd | ダイボンディング用樹脂ペースト |
| EP0826755A2 (fr) * | 1996-08-24 | 1998-03-04 | Henkel Kommanditgesellschaft auf Aktien | Système adhésif pour des structures composites caoutchouc-métal |
| EP0826755A3 (fr) * | 1996-08-24 | 1998-07-22 | Henkel Kommanditgesellschaft auf Aktien | Système adhésif pour des structures composites caoutchouc-métal |
| KR19980066134A (ko) * | 1997-01-20 | 1998-10-15 | 구광시 | 상온 보관 안정성이 우수한 이방 도전성 필름 |
| WO1999050369A1 (fr) * | 1998-03-31 | 1999-10-07 | Minnesota Mining And Manufacturing Company | Composition adhesive et precurseur de cette composition |
| US6652962B1 (en) * | 1998-05-29 | 2003-11-25 | Mitsui Mining & Smelting Co. Ltd. | Resin-coated composite foil, production and use thereof |
| JP4520003B2 (ja) * | 2000-04-14 | 2010-08-04 | 株式会社カネカ | 硬化性組成物 |
| WO2002086003A1 (fr) * | 2001-04-20 | 2002-10-31 | 3M Innovative Properties Company | Film adhesif thermodurcissable et structure adhesive basee sur l'utilisation de celui-ci |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0529667B2 (fr) | 1993-05-06 |
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