JPH0215631B2 - - Google Patents

Info

Publication number
JPH0215631B2
JPH0215631B2 JP56030208A JP3020881A JPH0215631B2 JP H0215631 B2 JPH0215631 B2 JP H0215631B2 JP 56030208 A JP56030208 A JP 56030208A JP 3020881 A JP3020881 A JP 3020881A JP H0215631 B2 JPH0215631 B2 JP H0215631B2
Authority
JP
Japan
Prior art keywords
target
target body
sputtering
cooling member
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56030208A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57145981A (en
Inventor
Katsuya Okumura
Masaaki Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP3020881A priority Critical patent/JPS57145981A/ja
Publication of JPS57145981A publication Critical patent/JPS57145981A/ja
Publication of JPH0215631B2 publication Critical patent/JPH0215631B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP3020881A 1981-03-03 1981-03-03 Target for sputtering device Granted JPS57145981A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3020881A JPS57145981A (en) 1981-03-03 1981-03-03 Target for sputtering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3020881A JPS57145981A (en) 1981-03-03 1981-03-03 Target for sputtering device

Publications (2)

Publication Number Publication Date
JPS57145981A JPS57145981A (en) 1982-09-09
JPH0215631B2 true JPH0215631B2 (enrdf_load_stackoverflow) 1990-04-12

Family

ID=12297309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3020881A Granted JPS57145981A (en) 1981-03-03 1981-03-03 Target for sputtering device

Country Status (1)

Country Link
JP (1) JPS57145981A (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59133369A (ja) * 1983-01-21 1984-07-31 Hitachi Ltd スパツタリング用のタ−ゲツト構造体
JPS59179784A (ja) * 1983-03-31 1984-10-12 Fujitsu Ltd スパツタ装置
JPS60102249U (ja) * 1983-12-19 1985-07-12 日本真空技術株式会社 スパツタリング用タ−ゲツト装置
CA1308060C (en) * 1986-04-04 1992-09-29 Tokyo Electron Limited Cathode and target design for a sputter coating apparatus
JP2635362B2 (ja) * 1988-04-15 1997-07-30 シャープ株式会社 ターゲットユニット
JPH0586465A (ja) * 1991-06-28 1993-04-06 Mitsubishi Materials Corp スパツタリング用ターゲツト及びその製造方法
JPH06108240A (ja) * 1992-09-30 1994-04-19 Shibaura Eng Works Co Ltd スパッタリング源
DE19958857B4 (de) * 1999-06-16 2014-09-25 Applied Materials Gmbh & Co. Kg Sputterkathode
JP6508774B2 (ja) * 2015-06-09 2019-05-08 株式会社高純度化学研究所 スパッタリングターゲット組立体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940682U (enrdf_load_stackoverflow) * 1972-07-13 1974-04-10
JPS5488885A (en) * 1977-12-26 1979-07-14 Matsushita Electric Ind Co Ltd Insulator target for sputtering device
JPS58697Y2 (ja) * 1978-09-04 1983-01-07 松下電器産業株式会社 スパッタ用タ−ゲット
JPS6018749B2 (ja) * 1979-01-16 1985-05-11 株式会社村田製作所 スパツタリング用タ−ゲツト
JPS5597473A (en) * 1979-01-18 1980-07-24 Murata Mfg Co Ltd Target for sputtering

Also Published As

Publication number Publication date
JPS57145981A (en) 1982-09-09

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