JPS5488885A - Insulator target for sputtering device - Google Patents

Insulator target for sputtering device

Info

Publication number
JPS5488885A
JPS5488885A JP16075877A JP16075877A JPS5488885A JP S5488885 A JPS5488885 A JP S5488885A JP 16075877 A JP16075877 A JP 16075877A JP 16075877 A JP16075877 A JP 16075877A JP S5488885 A JPS5488885 A JP S5488885A
Authority
JP
Japan
Prior art keywords
plate
solder
fitting
layer
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16075877A
Other languages
Japanese (ja)
Inventor
Keizaburo Kuramasu
Sumio Maekawa
Masaji Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16075877A priority Critical patent/JPS5488885A/en
Publication of JPS5488885A publication Critical patent/JPS5488885A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To preven cracking of the title target and increase sputtering efficiency by metallizing one side of an insulator target body; forming a solder layer on the metallized layer; and bonding the body to a fitting metal plate covered with a solder layer by melting both the solder layers. CONSTITUTION:One side of insulator target body 7 is metallized 8, and the metallized layer is plated with solder 9. The part of fitting metal plate 10 which part is to be bonded to body 7 is coated with solder to form solder layer 11. Fitting holes 10a are made in plate 10 to screw plate 10 to a fitting stand. Body 7 is then fixed into recess 10b of plate 10 and heated, whereby solder layers 9, 11 are melted to form solder layer 12 and the whole surface of body 7 is bonded to plate 10. The resulting target is screwed to a fitting stand, and the side of plate 10 is directly cooled with water. Thus, body 7 is efficiently cooled, preventing cracking even if high sputtering power is supplied.
JP16075877A 1977-12-26 1977-12-26 Insulator target for sputtering device Pending JPS5488885A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16075877A JPS5488885A (en) 1977-12-26 1977-12-26 Insulator target for sputtering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16075877A JPS5488885A (en) 1977-12-26 1977-12-26 Insulator target for sputtering device

Publications (1)

Publication Number Publication Date
JPS5488885A true JPS5488885A (en) 1979-07-14

Family

ID=15721820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16075877A Pending JPS5488885A (en) 1977-12-26 1977-12-26 Insulator target for sputtering device

Country Status (1)

Country Link
JP (1) JPS5488885A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57145981A (en) * 1981-03-03 1982-09-09 Toshiba Corp Target for sputtering device
JPS57188680A (en) * 1981-05-16 1982-11-19 Kemisuton:Kk Target for sputtering and production thereof
JPS5923870A (en) * 1982-07-09 1984-02-07 バリアン・アソシエイツ・インコ−ポレイテツド Target assembly of specific material for sputter coating device
JPS5921661U (en) * 1982-07-28 1984-02-09 日本真空技術株式会社 sputtering cathode
JPS5956971A (en) * 1982-09-27 1984-04-02 Tanaka Kikinzoku Kogyo Kk Production of target for sputtering
JPS6277461A (en) * 1985-09-30 1987-04-09 Shinku Kikai Kogyo Kk Backing plate for high frequency sputtering electrode
JPS62222060A (en) * 1986-03-20 1987-09-30 Hitachi Metals Ltd Target for sputtering

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57145981A (en) * 1981-03-03 1982-09-09 Toshiba Corp Target for sputtering device
JPH0215631B2 (en) * 1981-03-03 1990-04-12 Tokyo Shibaura Electric Co
JPS57188680A (en) * 1981-05-16 1982-11-19 Kemisuton:Kk Target for sputtering and production thereof
JPS5923870A (en) * 1982-07-09 1984-02-07 バリアン・アソシエイツ・インコ−ポレイテツド Target assembly of specific material for sputter coating device
JPH0251981B2 (en) * 1982-07-09 1990-11-09 Varian Associates
JPS5921661U (en) * 1982-07-28 1984-02-09 日本真空技術株式会社 sputtering cathode
JPS623387Y2 (en) * 1982-07-28 1987-01-26
JPS5956971A (en) * 1982-09-27 1984-04-02 Tanaka Kikinzoku Kogyo Kk Production of target for sputtering
JPH0140711B2 (en) * 1982-09-27 1989-08-30 Tanaka Precious Metal Ind
JPS6277461A (en) * 1985-09-30 1987-04-09 Shinku Kikai Kogyo Kk Backing plate for high frequency sputtering electrode
JPS62222060A (en) * 1986-03-20 1987-09-30 Hitachi Metals Ltd Target for sputtering

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