JPS55127044A - Electric circuit substrate and its manufacture - Google Patents
Electric circuit substrate and its manufactureInfo
- Publication number
- JPS55127044A JPS55127044A JP3437279A JP3437279A JPS55127044A JP S55127044 A JPS55127044 A JP S55127044A JP 3437279 A JP3437279 A JP 3437279A JP 3437279 A JP3437279 A JP 3437279A JP S55127044 A JPS55127044 A JP S55127044A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- coefficient
- plated
- copper
- carbon fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To obtain a radiating substrate almost equal to an insulating substrate in coefficient of thermal expansion by impregnating a carbon fiber net with a matrix metal and a wetting metallic coat formed on the surface with a matrix metal of high thermal conductivity.
CONSTITUTION: An electric circuit substrate consists of a ceramic insulating substrate 11 and a radiating substrate 15 fixed with the substrate 11 through Ni-plated layer 12, solder layer 13 and Ni-plated layer 14. The substrate 15 then consists of a carbon fiber 15b with copper plated 15a on the surface, another carbon fiber 15d crossing with the fiber 15b and plated with copper 15c on the surface, and a matrix metal 15e consisting of a copper-silver alloy of high thermal conductivity, with which both fibers 15b, 15d are impregnated. Coefficient of thermal expansion of the substrate 15 can now be made equal to coefficient of thermal expansion of the substrate 11, therefore the thickness of the substrate 11 can be made thin, and a heat generated by a circuit element fixed on the substrate 11 can be radiated effectively.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3437279A JPS55127044A (en) | 1979-03-26 | 1979-03-26 | Electric circuit substrate and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3437279A JPS55127044A (en) | 1979-03-26 | 1979-03-26 | Electric circuit substrate and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55127044A true JPS55127044A (en) | 1980-10-01 |
Family
ID=12412332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3437279A Pending JPS55127044A (en) | 1979-03-26 | 1979-03-26 | Electric circuit substrate and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55127044A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58164287A (en) * | 1982-03-24 | 1983-09-29 | 株式会社日立製作所 | Substrate for integrated circuit |
| JPS5946036A (en) * | 1982-09-09 | 1984-03-15 | Hitachi Ltd | Insulating type semiconductor device |
| JPS6065537A (en) * | 1983-09-20 | 1985-04-15 | Sumitomo Electric Ind Ltd | Substrate material for semiconductor device |
| JPS6141538A (en) * | 1984-08-06 | 1986-02-27 | 株式会社日立製作所 | Ceramic substrate and manufacture thereof |
| JPH01130592U (en) * | 1988-02-29 | 1989-09-05 | ||
| US6479095B1 (en) | 1997-02-14 | 2002-11-12 | Ngk Insulators, Ltd. | Composite material for heat sinks for semiconductor devices and method for producing the same |
-
1979
- 1979-03-26 JP JP3437279A patent/JPS55127044A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58164287A (en) * | 1982-03-24 | 1983-09-29 | 株式会社日立製作所 | Substrate for integrated circuit |
| JPS5946036A (en) * | 1982-09-09 | 1984-03-15 | Hitachi Ltd | Insulating type semiconductor device |
| JPS6065537A (en) * | 1983-09-20 | 1985-04-15 | Sumitomo Electric Ind Ltd | Substrate material for semiconductor device |
| JPS6141538A (en) * | 1984-08-06 | 1986-02-27 | 株式会社日立製作所 | Ceramic substrate and manufacture thereof |
| JPH0214189B2 (en) * | 1984-08-06 | 1990-04-06 | Hitachi Ltd | |
| JPH01130592U (en) * | 1988-02-29 | 1989-09-05 | ||
| US6479095B1 (en) | 1997-02-14 | 2002-11-12 | Ngk Insulators, Ltd. | Composite material for heat sinks for semiconductor devices and method for producing the same |
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