JPH02131351U - - Google Patents

Info

Publication number
JPH02131351U
JPH02131351U JP1989040367U JP4036789U JPH02131351U JP H02131351 U JPH02131351 U JP H02131351U JP 1989040367 U JP1989040367 U JP 1989040367U JP 4036789 U JP4036789 U JP 4036789U JP H02131351 U JPH02131351 U JP H02131351U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation fins
copper block
semiconductor chip
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989040367U
Other languages
English (en)
Other versions
JPH0727635Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989040367U priority Critical patent/JPH0727635Y2/ja
Publication of JPH02131351U publication Critical patent/JPH02131351U/ja
Application granted granted Critical
Publication of JPH0727635Y2 publication Critical patent/JPH0727635Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の高周波混成集積回路の一実
施例を示す斜視図、第２図は、第１図のＡ−Ａ線
の断面図、第３図は従来の高周波混成集積回路の
斜視図、第４図は、第３図のＢ−Ｂ線の断面図を
示す。 図において、１は基板、２は銅ブロツク、３は
半導体チツプ、４は回路パターン、５は接地パタ
ーン、６は放熱フイン、７はワイヤ、９は放熱フ
インの断面Ｌ字形の曲げ部を示す。なお、各図中
の同一符号は同一または相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板上に接地パターンと回路パターンが形成さ
    れ、裏面に放熱フインが取り付けられ、さらに、
    前記接地パターン上に載置された銅ブロツク上に
    半導体チツプが載置され、前記半導体チツプの共
    通端子と前記銅ブロツクおよび回路パターンとが
    それぞれワイヤにより接続された混成集積回路に
    おいて、前記半導体チツプ−放熱フイン間の熱抵
    抗を下げるための前記銅ブロツクを前記基板外部
    に突出せしめ、前記放熱フインを断面Ｌ字形に形
    成し、前記銅ブロツクと放熱フインとが直接接触
    する構造としたことを特徴とする高周波混成集積
    回路。
JP1989040367U 1989-04-04 1989-04-04 高周波混成集積回路 Expired - Lifetime JPH0727635Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989040367U JPH0727635Y2 (ja) 1989-04-04 1989-04-04 高周波混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989040367U JPH0727635Y2 (ja) 1989-04-04 1989-04-04 高周波混成集積回路

Publications (2)

Publication Number Publication Date
JPH02131351U true JPH02131351U (ja) 1990-10-31
JPH0727635Y2 JPH0727635Y2 (ja) 1995-06-21

Family

ID=31550095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989040367U Expired - Lifetime JPH0727635Y2 (ja) 1989-04-04 1989-04-04 高周波混成集積回路

Country Status (1)

Country Link
JP (1) JPH0727635Y2 (ja)

Also Published As

Publication number Publication date
JPH0727635Y2 (ja) 1995-06-21

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