JPS62192650U - - Google Patents
Info
- Publication number
- JPS62192650U JPS62192650U JP1986082314U JP8231486U JPS62192650U JP S62192650 U JPS62192650 U JP S62192650U JP 1986082314 U JP1986082314 U JP 1986082314U JP 8231486 U JP8231486 U JP 8231486U JP S62192650 U JPS62192650 U JP S62192650U
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- integrated circuit
- hybrid integrated
- main surface
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Description
第１図は本考案の混成集積回路素子の一実施例
を示す断面図、第２図は第１図の絶縁基板下面に
被着した金属層の平面図、第３図は従来の混成集
積回路素子の断面図である。 １：絶縁基板、２：配線導体、３：受動部品、
４：半導体部品、５：金属層、６：放熱部材、７
：溝部。
を示す断面図、第２図は第１図の絶縁基板下面に
被着した金属層の平面図、第３図は従来の混成集
積回路素子の断面図である。 １：絶縁基板、２：配線導体、３：受動部品、
４：半導体部品、５：金属層、６：放熱部材、７
：溝部。
Claims (1)
- 電気絶縁基板の一主面上に配線導体、受動部品
及び半導体部品を取着搭載し、他の主面に放熱部
材がロウ付けされる金属層を設けて成る混成集積
回路素子において、前記金属層に外気に通じる溝
部を形成し、金属層を複数の区画に区分したこと
を特徴とする混成集積回路素子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986082314U JPS62192650U (ja) | 1986-05-29 | 1986-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986082314U JPS62192650U (ja) | 1986-05-29 | 1986-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62192650U true JPS62192650U (ja) | 1987-12-08 |
Family
ID=30934855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986082314U Pending JPS62192650U (ja) | 1986-05-29 | 1986-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62192650U (ja) |
-
1986
- 1986-05-29 JP JP1986082314U patent/JPS62192650U/ja active Pending