JPH01130591U - - Google Patents
Info
- Publication number
- JPH01130591U JPH01130591U JP2661588U JP2661588U JPH01130591U JP H01130591 U JPH01130591 U JP H01130591U JP 2661588 U JP2661588 U JP 2661588U JP 2661588 U JP2661588 U JP 2661588U JP H01130591 U JPH01130591 U JP H01130591U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- radiator
- circuit board
- attaching
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案になる回路基板の構造を示す斜
視図、第２図ａ及びｂは第１図に示す放熱器の側
面及正面図、第３図及び第４図は第２図ａ及びｂ
に示す放熱器の他の例を示す正面図、そして第５
図及び第６図は本考案の他の実施例を示す図であ
る。 １……基板、２……発熱性素子、３……端子、
４……配線パターン、５……導体層、６……放熱
器。
視図、第２図ａ及びｂは第１図に示す放熱器の側
面及正面図、第３図及び第４図は第２図ａ及びｂ
に示す放熱器の他の例を示す正面図、そして第５
図及び第６図は本考案の他の実施例を示す図であ
る。 １……基板、２……発熱性素子、３……端子、
４……配線パターン、５……導体層、６……放熱
器。
Claims (1)
- 発熱性素子２を基板１の主面上に形成した導体
層の上に配設した回路基板において、前記発熱性
素子２の配設箇所の近傍の基板１の主面上に放熱
器取り付け用導体層５を形成し、前記放熱器取り
付け用導体層５の上に螺旋状の金属線からなる放
熱器６を取り付けたことを特徴とする回路基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988026615U JPH0717156Y2 (ja) | 1988-02-29 | 1988-02-29 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988026615U JPH0717156Y2 (ja) | 1988-02-29 | 1988-02-29 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01130591U true JPH01130591U (ja) | 1989-09-05 |
| JPH0717156Y2 JPH0717156Y2 (ja) | 1995-04-19 |
Family
ID=31248403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988026615U Expired - Lifetime JPH0717156Y2 (ja) | 1988-02-29 | 1988-02-29 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717156Y2 (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56169573U (ja) * | 1980-05-16 | 1981-12-15 | ||
| JPS6183098U (ja) * | 1984-11-06 | 1986-06-02 |
-
1988
- 1988-02-29 JP JP1988026615U patent/JPH0717156Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56169573U (ja) * | 1980-05-16 | 1981-12-15 | ||
| JPS6183098U (ja) * | 1984-11-06 | 1986-06-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0717156Y2 (ja) | 1995-04-19 |