JPH01127250U - - Google Patents

Info

Publication number
JPH01127250U
JPH01127250U JP1988022479U JP2247988U JPH01127250U JP H01127250 U JPH01127250 U JP H01127250U JP 1988022479 U JP1988022479 U JP 1988022479U JP 2247988 U JP2247988 U JP 2247988U JP H01127250 U JPH01127250 U JP H01127250U
Authority
JP
Japan
Prior art keywords
protrusion
heat
projections
conductive pattern
heat conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988022479U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988022479U priority Critical patent/JPH01127250U/ja
Publication of JPH01127250U publication Critical patent/JPH01127250U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Description

【図面の簡単な説明】
第１図は本考案の一実施例に係るヒートシンク
付集積回路ケースを示す断面図である。 １：ＩＣチツプ、２：放熱フイン、３：ヒート
シンク、４：接続端子、５：絶縁基板、６：導体
パターン、７：チツプ接続端子、８：接続線、９
：突起、１０：クランプ、１１：突起付熱伝体、
１２：保護キヤツプ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 導体パターンとこの導体パターンの一端に取付
    けられた信号入出力用接続端子とを有する絶縁基
    板と、該絶縁基板に装着したＩＣチツプと、該Ｉ
    Ｃチツプの一方面と接触した状態で上記絶縁基板
    に取付けられかつ先端部に突起を有する突起付熱
    伝体と、該突起付熱伝体の突起と着脱自在に摺動
    嵌合可能なクランプと熱放散用の放熱フインとを
    有し上記クランプを突起に摺動嵌合させることに
    より上記突起付熱伝体と熱的に接触するヒートシ
    ンクとを備えてなることを特徴とするヒートシン
    ク付集積回路ケース。
JP1988022479U 1988-02-23 1988-02-23 Pending JPH01127250U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988022479U JPH01127250U (ja) 1988-02-23 1988-02-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988022479U JPH01127250U (ja) 1988-02-23 1988-02-23

Publications (1)

Publication Number Publication Date
JPH01127250U true JPH01127250U (ja) 1989-08-31

Family

ID=31240640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988022479U Pending JPH01127250U (ja) 1988-02-23 1988-02-23

Country Status (1)

Country Link
JP (1) JPH01127250U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012089549A (ja) * 2010-10-15 2012-05-10 Fujitsu Ltd 電子装置及びその製造方法、送受信装置
JP2013098328A (ja) * 2011-10-31 2013-05-20 Shinko Electric Ind Co Ltd 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012089549A (ja) * 2010-10-15 2012-05-10 Fujitsu Ltd 電子装置及びその製造方法、送受信装置
JP2013098328A (ja) * 2011-10-31 2013-05-20 Shinko Electric Ind Co Ltd 半導体装置

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