JPH0211032B2 - - Google Patents

Info

Publication number
JPH0211032B2
JPH0211032B2 JP58165936A JP16593683A JPH0211032B2 JP H0211032 B2 JPH0211032 B2 JP H0211032B2 JP 58165936 A JP58165936 A JP 58165936A JP 16593683 A JP16593683 A JP 16593683A JP H0211032 B2 JPH0211032 B2 JP H0211032B2
Authority
JP
Japan
Prior art keywords
wiring board
layer
conductive pattern
multilayer wiring
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58165936A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6057999A (ja
Inventor
Masafumi Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58165936A priority Critical patent/JPS6057999A/ja
Publication of JPS6057999A publication Critical patent/JPS6057999A/ja
Publication of JPH0211032B2 publication Critical patent/JPH0211032B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP58165936A 1983-09-09 1983-09-09 多層配線板 Granted JPS6057999A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58165936A JPS6057999A (ja) 1983-09-09 1983-09-09 多層配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58165936A JPS6057999A (ja) 1983-09-09 1983-09-09 多層配線板

Publications (2)

Publication Number Publication Date
JPS6057999A JPS6057999A (ja) 1985-04-03
JPH0211032B2 true JPH0211032B2 (US07922777-20110412-C00004.png) 1990-03-12

Family

ID=15821825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58165936A Granted JPS6057999A (ja) 1983-09-09 1983-09-09 多層配線板

Country Status (1)

Country Link
JP (1) JPS6057999A (US07922777-20110412-C00004.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0540128U (ja) * 1991-10-29 1993-05-28 昭和電工株式会社 折りたたみコンテナー

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62156847A (ja) * 1985-12-28 1987-07-11 Ibiden Co Ltd 多層プリント配線板の製造方法
JPH02106874U (US07922777-20110412-C00004.png) * 1989-02-10 1990-08-24
CN1094717C (zh) 1995-11-16 2002-11-20 松下电器产业株式会社 印刷电路板的安装体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187998A (en) * 1981-05-14 1982-11-18 Nippon Electric Co High density multilayer circuit board
JPS5868952A (ja) * 1981-10-20 1983-04-25 Citizen Watch Co Ltd 配線接続用電極端子
JPS59201449A (ja) * 1983-03-09 1984-11-15 プリンテツド・サ−キツツ・インタ−ナシヨナル・インコ−ポレイテツド ヒ−トシンクを有する半導体チツプ担体パツケ−ジ及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943026Y2 (ja) * 1976-10-25 1984-12-18 シャープ株式会社 タオル掛け付き電気洗濯機
JPS58640Y2 (ja) * 1977-10-13 1983-01-07 ヤンマーディーゼル株式会社 トロ−リング装置の誤操作防止装置
JPS59107139U (ja) * 1983-01-07 1984-07-19 セイコーエプソン株式会社 回路基板のicチップ実装構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187998A (en) * 1981-05-14 1982-11-18 Nippon Electric Co High density multilayer circuit board
JPS5868952A (ja) * 1981-10-20 1983-04-25 Citizen Watch Co Ltd 配線接続用電極端子
JPS59201449A (ja) * 1983-03-09 1984-11-15 プリンテツド・サ−キツツ・インタ−ナシヨナル・インコ−ポレイテツド ヒ−トシンクを有する半導体チツプ担体パツケ−ジ及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0540128U (ja) * 1991-10-29 1993-05-28 昭和電工株式会社 折りたたみコンテナー

Also Published As

Publication number Publication date
JPS6057999A (ja) 1985-04-03

Similar Documents

Publication Publication Date Title
JPS5826826B2 (ja) 集積回路用セラミック・パッケ−ジ
US7180182B2 (en) Semiconductor component
US5691569A (en) Integrated circuit package that has a plurality of staggered pins
JP3745176B2 (ja) プリント配線板
JPH0211032B2 (US07922777-20110412-C00004.png)
JPS63114299A (ja) プリント配線板
JPH02301182A (ja) 薄型実装構造の回路基板
JPH05218228A (ja) 電子部品搭載用基板
JPH03233991A (ja) プリント配線板
JPH0750476A (ja) 多層印刷配線板
JPH04291984A (ja) プリント板ユニット構造
JP2766361B2 (ja) 半導体装置
JP3184090B2 (ja) 集積回路搭載用基板
JP2526205Y2 (ja) Icソケットアダプタ
JPS59163842A (ja) 集積回路ソケツト積重ね実装構造
JPH05259214A (ja) 半導体装置
JPS6125240B2 (US07922777-20110412-C00004.png)
JPH03263841A (ja) 電子部品搭載用基板
JPH0432291A (ja) 電子回路基板の実装方法
JPH05267851A (ja) 多層印刷配線板
JPS61189695A (ja) 多層プリント板の配線パタ−ン構造
JPH03293757A (ja) フィルムを使用した電子部品搭載用基板
JPH0685164A (ja) ハイブリッドic基板の実装構造
JPH03250788A (ja) 混成機能実装回路装置
JPS5920675U (ja) 印刷配線板の積層構造