JPH0150108B2 - - Google Patents

Info

Publication number
JPH0150108B2
JPH0150108B2 JP58087174A JP8717483A JPH0150108B2 JP H0150108 B2 JPH0150108 B2 JP H0150108B2 JP 58087174 A JP58087174 A JP 58087174A JP 8717483 A JP8717483 A JP 8717483A JP H0150108 B2 JPH0150108 B2 JP H0150108B2
Authority
JP
Japan
Prior art keywords
layer
pin
solder
package
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58087174A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59211253A (ja
Inventor
Koji Nose
Shigeru Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP8717483A priority Critical patent/JPS59211253A/ja
Publication of JPS59211253A publication Critical patent/JPS59211253A/ja
Publication of JPH0150108B2 publication Critical patent/JPH0150108B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8717483A 1983-05-17 1983-05-17 電子部品パツケ−ジ Granted JPS59211253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8717483A JPS59211253A (ja) 1983-05-17 1983-05-17 電子部品パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8717483A JPS59211253A (ja) 1983-05-17 1983-05-17 電子部品パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS59211253A JPS59211253A (ja) 1984-11-30
JPH0150108B2 true JPH0150108B2 (en, 2012) 1989-10-27

Family

ID=13907619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8717483A Granted JPS59211253A (ja) 1983-05-17 1983-05-17 電子部品パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS59211253A (en, 2012)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4672739A (en) * 1985-04-11 1987-06-16 International Business Machines Corporation Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate
JP2554879B2 (ja) * 1987-04-30 1996-11-20 京セラ株式会社 プラグイン型半導体素子収納用パツケ−ジの製造方法
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
EP0792519B1 (en) * 1994-11-15 2003-03-26 Formfactor, Inc. Interconnection elements for microelectronic components
EP0792517B1 (en) * 1994-11-15 2003-10-22 Formfactor, Inc. Electrical contact structures from flexible wire
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51106058A (ja) * 1975-03-14 1976-09-20 Citizen Watch Co Ltd Seramitsukukiban
JPS5544749A (en) * 1978-09-25 1980-03-29 Nec Corp Substrate for mounting semiconductor device
JPS5778651U (en, 2012) * 1980-10-30 1982-05-15
JPS599951A (ja) * 1982-07-09 1984-01-19 Hitachi Ltd 多層セラミツク基板のリ−ドピン取付構造

Also Published As

Publication number Publication date
JPS59211253A (ja) 1984-11-30

Similar Documents

Publication Publication Date Title
KR100239406B1 (ko) 표면 실장형 반도체 패키지 및 그 제조 방법
US5438165A (en) Integrated circuit interconnect leads releasably mounted on film
JP2915888B1 (ja) 配線基板及びその製造方法
US5196268A (en) Integrated circuit interconnect leads releasably mounted on film
JPH0150108B2 (en, 2012)
EP0384586A2 (en) High reliability plastic package for integrated circuits
JP3068224B2 (ja) 半導体装置
KR100591235B1 (ko) 반도체 장치
JPH02278743A (ja) インジウム半田の接合構造
JPS61242051A (ja) 半導体装置
JP2974819B2 (ja) 半導体装置およびその製造方法
JP2000124356A (ja) 半導体パッケ―ジ用部材，半導体パッケ―ジ及び半導体パッケ―ジ製造方法
JPH05144821A (ja) 半導体装置
JPS62131526A (ja) 金めつきされた電子部品
JP2623952B2 (ja) 集積回路パッケージ
JP3067364B2 (ja) 金属突起電極付き半導体装置
JP2000208548A (ja) 半導体装置
JPS6276744A (ja) 集積回路用容器
JP3622160B2 (ja) セラミック基板およびその製造方法
JP2679197B2 (ja) 樹脂封止型半導体装置
JPS5940539A (ja) 半導体装置およびその製造方法
JPS5844597Y2 (ja) Ｉｃパツケ−ジ用リ−ド構造
JPS6080230A (ja) 半導体装置およびその製法
JPH05175408A (ja) 半導体素子の実装用材料および実装方法
JPH09148334A (ja) バンプ、バンプを有する半導体チップ及びパッケージ並びに実装方法及び半導体装置