JPH0144150B2 - - Google Patents
Info
- Publication number
- JPH0144150B2 JPH0144150B2 JP57187866A JP18786682A JPH0144150B2 JP H0144150 B2 JPH0144150 B2 JP H0144150B2 JP 57187866 A JP57187866 A JP 57187866A JP 18786682 A JP18786682 A JP 18786682A JP H0144150 B2 JPH0144150 B2 JP H0144150B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- prepreg
- coupling agent
- titanate coupling
- titanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57187866A JPS5976251A (ja) | 1982-10-26 | 1982-10-26 | 金属箔張り積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57187866A JPS5976251A (ja) | 1982-10-26 | 1982-10-26 | 金属箔張り積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5976251A JPS5976251A (ja) | 1984-05-01 |
| JPH0144150B2 true JPH0144150B2 (cg-RX-API-DMAC7.html) | 1989-09-26 |
Family
ID=16213582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57187866A Granted JPS5976251A (ja) | 1982-10-26 | 1982-10-26 | 金属箔張り積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5976251A (cg-RX-API-DMAC7.html) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS505481A (cg-RX-API-DMAC7.html) * | 1973-05-18 | 1975-01-21 |
-
1982
- 1982-10-26 JP JP57187866A patent/JPS5976251A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5976251A (ja) | 1984-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69624846D1 (de) | Lösung für stromlose kupferplattierung und verfahren zur stromlosen kupferplattierung | |
| KR100442563B1 (ko) | 실란커플링제를 사용한 동박의 표면처리방법 | |
| JPH0144150B2 (cg-RX-API-DMAC7.html) | ||
| JPH0144149B2 (cg-RX-API-DMAC7.html) | ||
| KR101420542B1 (ko) | 절연필름용 에폭시수지 조성물, 인쇄회로기판용 절연필름 및 이의 제조방법, 및 이를 구비한 인쇄회로기판 | |
| CN113950204B (zh) | 一种预制电路板的制造方法及预制电路板 | |
| JP2567357B2 (ja) | プリント配線用基板 | |
| JPH02104494A (ja) | プリント配線板の半田フラックス前駆体 | |
| JPH0837359A (ja) | 部分的アディティブ法によるプリント回路導体の改善された製造法 | |
| JPH01206686A (ja) | プリント配線用基板 | |
| JPS6324695A (ja) | 多層プリント配線板の製造方法 | |
| JP2742124B2 (ja) | 印刷回路用積層板の製造方法 | |
| JPH0948092A (ja) | 接着剤付積層板 | |
| JPH08302213A (ja) | プリプレグ及びこのプリプレグを使用した多層配線板 | |
| JPS63165140A (ja) | 金属箔張り積層板の連続製造方法 | |
| JPH0489843A (ja) | 積層板の製造方法 | |
| JPH01118539A (ja) | 銅張積層板の製造法 | |
| JPS63174390A (ja) | 多層プリント配線板の処理方法 | |
| JPH069318B2 (ja) | 多層板の製造法 | |
| JPH01265594A (ja) | 多層プリント配線板 | |
| JPS63117041A (ja) | プリプレグ | |
| JPH04340786A (ja) | プリント配線板用積層板の製造方法 | |
| JPH0222891A (ja) | 銅張積層板 | |
| JPH0715141A (ja) | プリプレグ及びこのプリプレグを用いた多層積層板の製造 方法 | |
| JPS61253372A (ja) | 樹脂材料の金属メツキ方法および金属メツキされた樹脂材料 |