JPS505481A - - Google Patents
Info
- Publication number
- JPS505481A JPS505481A JP5456273A JP5456273A JPS505481A JP S505481 A JPS505481 A JP S505481A JP 5456273 A JP5456273 A JP 5456273A JP 5456273 A JP5456273 A JP 5456273A JP S505481 A JPS505481 A JP S505481A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5456273A JPS505481A (cg-RX-API-DMAC7.html) | 1973-05-18 | 1973-05-18 | |
| DE19742424002 DE2424002C3 (de) | 1973-05-18 | 1974-05-17 | Schwerentflammbare Mehrschicht-Leiterplatte und Verfahren zu deren Herstellung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5456273A JPS505481A (cg-RX-API-DMAC7.html) | 1973-05-18 | 1973-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS505481A true JPS505481A (cg-RX-API-DMAC7.html) | 1975-01-21 |
Family
ID=12974113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5456273A Pending JPS505481A (cg-RX-API-DMAC7.html) | 1973-05-18 | 1973-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS505481A (cg-RX-API-DMAC7.html) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50146871A (cg-RX-API-DMAC7.html) * | 1974-05-15 | 1975-11-25 | ||
| JPS5262659A (en) * | 1975-11-19 | 1977-05-24 | Matsushita Electric Industrial Co Ltd | Method of producing copper layer laminated board |
| JPS5574867A (en) * | 1978-12-04 | 1980-06-05 | Hitachi Chemical Co Ltd | Method of making copperrcoated laminated sheet |
| JPS5976250A (ja) * | 1982-10-26 | 1984-05-01 | 新神戸電機株式会社 | 金属箔張り積層板の製造法 |
| JPS5976251A (ja) * | 1982-10-26 | 1984-05-01 | 新神戸電機株式会社 | 金属箔張り積層板の製造法 |
| JPS63168439A (ja) * | 1986-12-27 | 1988-07-12 | Sumitomo Bakelite Co Ltd | 積層板用エポキシ樹脂組成物 |
-
1973
- 1973-05-18 JP JP5456273A patent/JPS505481A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50146871A (cg-RX-API-DMAC7.html) * | 1974-05-15 | 1975-11-25 | ||
| JPS5262659A (en) * | 1975-11-19 | 1977-05-24 | Matsushita Electric Industrial Co Ltd | Method of producing copper layer laminated board |
| JPS5574867A (en) * | 1978-12-04 | 1980-06-05 | Hitachi Chemical Co Ltd | Method of making copperrcoated laminated sheet |
| JPS5976250A (ja) * | 1982-10-26 | 1984-05-01 | 新神戸電機株式会社 | 金属箔張り積層板の製造法 |
| JPS5976251A (ja) * | 1982-10-26 | 1984-05-01 | 新神戸電機株式会社 | 金属箔張り積層板の製造法 |
| JPS63168439A (ja) * | 1986-12-27 | 1988-07-12 | Sumitomo Bakelite Co Ltd | 積層板用エポキシ樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2424002B2 (de) | 1976-04-15 |
| DE2424002A1 (de) | 1974-11-28 |