JPH0142346Y2 - - Google Patents

Info

Publication number
JPH0142346Y2
JPH0142346Y2 JP1983190689U JP19068983U JPH0142346Y2 JP H0142346 Y2 JPH0142346 Y2 JP H0142346Y2 JP 1983190689 U JP1983190689 U JP 1983190689U JP 19068983 U JP19068983 U JP 19068983U JP H0142346 Y2 JPH0142346 Y2 JP H0142346Y2
Authority
JP
Japan
Prior art keywords
wire
pellet
bonding pad
semiconductor device
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983190689U
Other languages
English (en)
Other versions
JPS6099536U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983190689U priority Critical patent/JPS6099536U/ja
Publication of JPS6099536U publication Critical patent/JPS6099536U/ja
Application granted granted Critical
Publication of JPH0142346Y2 publication Critical patent/JPH0142346Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4901—Structure
    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4905—Shape
    • H01L2224/49051—Connectors having different shapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【考案の詳細な説明】 (イ) 産業上の利用分野 本考案は、半導体装置に係り、特に、ペレツト
上に形成されたボンデイングパツドと所定の端子
とを、ワイヤで接続した半導体装置に関する。
(ロ) 従来技術 通常、ボンデイングパツドはペレツト端辺に形
成されている。しかし、半導体装置の集積化を図
る為等によりペレツト表面積を小さくした場合、
パターンレイアウトの関係上、一部のボンデイン
グパツドをペレツト端辺にまで導出できないこと
がある。そのため、ペレツト端辺から遠くのボン
デイングパツドと端子とを接続するワイヤが長く
なる結果、後述するような下具合を生じている。
第１図は前記従来の半導体装置の一部斜視図で
ある。第２図は第１図のワイヤのループ状態を示
した説明図である。
第１図及び第２図において、１００は表面にア
イランド１２０及び端子１３０が厚膜形成された
セラミツク基板である。１１０はアイランド１２
０上に固着されたペレツトである。このペレツト
１１０には、端辺側に近いボンデイングパツド１
１１と、端辺側から離れたボンデイングパツド１
１２が形成されている。このボンデイングパツド
１１１及び１１２と端子１３０との間は同じ太さ
のワイヤ１４０及び１５０で接続されている。
第２図ａで示すように、短いワイヤ１４０は撓
んだり、変形することはない、しかし、第２図
ｂ，ｃで示すように、長いワイヤ１５０は撓み易
く、ペレツト１１０の端辺に接触したり、あるい
は、変形して隣り合う短いワイヤ１４０と接触す
る場合等がある。そのためシヨート不良等を発生
し、半導体装置の歩留りや信頼性を下げる原因と
なる。
(ハ) 目的 本考案は、ワイヤの変形及び撓みによるシヨー
ト不良を防止する半導体装置を提供することを目
的としている。
(ニ) 構成 本考案に係る半導体装置は、ペレツト端辺に近
いボンデイングパツドと所定の端子とを細いワイ
ヤで、又ペレツト端辺から遠いボンデイングパツ
ドと所定の端子とを太いワイヤでそれぞれ接続し
たことを特徴としている。
(ホ) 実施例 第３図は第１図と対応した本考案装置の一実施
例を示す一部斜視図である。第４図は第３図の太
いワイヤのループ状態を、従来の細いワイヤのル
ープ状態との比較で示した断面図である。
第３図、第４図において、第１図と同一部分は
同一符号で示している。
１２０，１３０はセラミツク基板１００上に厚
膜形成された導電膜よりなるアイランド及び複数
個の端子である。アイランド１２０の上部に導電
性エポキシ樹脂よりなるプリフオーム材を介して
ペレツト１１０がダイボンデイングされている。
ボンデイングパツド１１１は、ペレツト１１０の
端辺寄りに形成されている。ボンデイングパツド
１１２は、ペレツト１１０の端辺から遠くに、し
かもボンデイングパツド１１１よりも大きく形成
される。
該端子１３０とボンデイングパツド１１１は細
い金線１４０でワイヤボンデイングされている。
又、別の端子１３０とボンデイングパツド１１２
は太い金線１６０でワイヤボンデイングされてい
る。
第４図に示すように、太いワイヤ１６０は、破
線で示した細いワイヤ１５０と比較して、撓み及
び変形等が発生しにくい。
尚、アイランド等を厚膜形成したセヤミツク基
板を用いた半導体装置を例にとつて説明したが、
本考案はこれに限定されず、例えば、リードフレ
ーム等を用いるものであつてもよい。
(ヘ) 効果 本考案は、ペレツト端辺から遠いボンデイング
パツドと端子とを太いワイヤで接続させたので、
ワイヤの撓み及び変形を防止できる。
従つて、本考案によれば、シヨート不良を防止
できるので、半導体装置の集積化を図り得るとと
もに歩留り及び信頼性の向上を図ることができ
る。
【図面の簡単な説明】
第１図は従来の半導体装置の一部斜視図、第２
図は第１図のワイヤのループ状態を示した説明
図、第３図は第１図と対応した本考案装置の一実
施例を示す一部斜視図、第４図は第３図の太いワ
イヤのループ状態を、細いワイヤのループ状態と
の比較で示した断面図である。 １１０……ペレツト、１１１，１１２……ボン
デイングパツド、１３０……端子、１４０……細
いワイヤ、１６０……太いワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. ペレツト端辺に近いボンデイングパツドと所定
    の端子とを細いワイヤで、又ペレツト端辺から遠
    いボンデイングパツドと所定の端子とを太いワイ
    ヤで、それぞれ接続したことを特徴とする半導体
    装置。
JP1983190689U 1983-12-10 1983-12-10 半導体装置 Granted JPS6099536U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983190689U JPS6099536U (ja) 1983-12-10 1983-12-10 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983190689U JPS6099536U (ja) 1983-12-10 1983-12-10 半導体装置

Publications (2)

Publication Number Publication Date
JPS6099536U JPS6099536U (ja) 1985-07-06
JPH0142346Y2 true JPH0142346Y2 (ja) 1989-12-12

Family

ID=30410812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983190689U Granted JPS6099536U (ja) 1983-12-10 1983-12-10 半導体装置

Country Status (1)

Country Link
JP (1) JPS6099536U (ja)

Also Published As

Publication number Publication date
JPS6099536U (ja) 1985-07-06

Similar Documents

Publication Publication Date Title
JPH08222681A (ja) 樹脂封止型半導体装置
JPH0142346Y2 (ja)
JP2000243880A (ja) 半導体装置とその製造方法
JPH0546098B2 (ja)
JPH0256942A (ja) 半導体装置
JP3172472B2 (ja) 半導体装置
JP2665061B2 (ja) ワイヤーボンディング方法
JPS63152161A (ja) 半導体装置
JP2954109B2 (ja) 半導体装置及びその製造方法
JP2732731B2 (ja) リードフレーム及びそれを用いた半導体装置とその製造方法
JP2707659B2 (ja) 樹脂封止型半導体装置
KR100218335B1 (ko) 칩 사이즈 패키지
JP2819614B2 (ja) 樹脂封止型半導体装置
JPH0513490A (ja) 樹脂封止型半導体装置
JPS6155770B2 (ja)
JPH05211268A (ja) 半導体装置
JP2529366Y2 (ja) 半導体装置
JPS60101938A (ja) 半導体装置
JPH0547464Y2 (ja)
JP3664566B2 (ja) 半導体装置およびその製造方法
JPH10303233A (ja) 半導体装置の製造方法
JPH077023A (ja) 樹脂封止型半導体装置
JPH11150134A (ja) 半導体装置
JPH0595074A (ja) 半導体装置
JPS60200534A (ja) 半導体装置