JPH0139236B2 - - Google Patents

Info

Publication number
JPH0139236B2
JPH0139236B2 JP54138342A JP13834279A JPH0139236B2 JP H0139236 B2 JPH0139236 B2 JP H0139236B2 JP 54138342 A JP54138342 A JP 54138342A JP 13834279 A JP13834279 A JP 13834279A JP H0139236 B2 JPH0139236 B2 JP H0139236B2
Authority
JP
Japan
Prior art keywords
plating
photoresist
layer
pattern
noble metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54138342A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5662398A (en
Inventor
Shoji Nakakita
Hikari Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP13834279A priority Critical patent/JPS5662398A/ja
Publication of JPS5662398A publication Critical patent/JPS5662398A/ja
Publication of JPH0139236B2 publication Critical patent/JPH0139236B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP13834279A 1979-10-26 1979-10-26 Method of manufacturing high density multilayer board Granted JPS5662398A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13834279A JPS5662398A (en) 1979-10-26 1979-10-26 Method of manufacturing high density multilayer board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13834279A JPS5662398A (en) 1979-10-26 1979-10-26 Method of manufacturing high density multilayer board

Publications (2)

Publication Number Publication Date
JPS5662398A JPS5662398A (en) 1981-05-28
JPH0139236B2 true JPH0139236B2 (enrdf_load_stackoverflow) 1989-08-18

Family

ID=15219669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13834279A Granted JPS5662398A (en) 1979-10-26 1979-10-26 Method of manufacturing high density multilayer board

Country Status (1)

Country Link
JP (1) JPS5662398A (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58119694A (ja) * 1982-01-12 1983-07-16 株式会社日立製作所 配線基板の製造方法
JPS58121698A (ja) * 1982-01-12 1983-07-20 株式会社日立製作所 多層配線基板
JPS58128797A (ja) * 1982-01-27 1983-08-01 日本電気株式会社 多層セラミツク基板の製造方法
JPH0695543B2 (ja) * 1984-09-26 1994-11-24 株式会社日立製作所 半導体装置及びその製造方法
JPS61121392A (ja) * 1984-11-19 1986-06-09 日本電信電話株式会社 多層配線の製造方法
JPS649694A (en) * 1987-07-01 1989-01-12 Toyo Giken Kogyo Kk Multilayer interconnection circuit board and manufacture thereof
JP2001007529A (ja) * 1999-06-23 2001-01-12 Ibiden Co Ltd 多層プリント配線板及び多層プリント配線板の製造方法、半導体チップ及び半導体チップの製造方法
JP5455116B2 (ja) * 2009-10-24 2014-03-26 京セラＳｌｃテクノロジー株式会社 配線基板およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5064767A (enrdf_load_stackoverflow) * 1973-10-12 1975-06-02
JPS51145853A (en) * 1975-06-10 1976-12-15 Nippon Electric Co Method of fabricating ceramic membrane
JPS5346666A (en) * 1976-10-07 1978-04-26 Nippon Electric Co Method of producing multilayer circuit substrate
JPS5392465A (en) * 1977-01-24 1978-08-14 Nippon Electric Co Electronic circuit element board

Also Published As

Publication number Publication date
JPS5662398A (en) 1981-05-28

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