JPS649694A - Multilayer interconnection circuit board and manufacture thereof - Google Patents
Multilayer interconnection circuit board and manufacture thereofInfo
- Publication number
- JPS649694A JPS649694A JP16559987A JP16559987A JPS649694A JP S649694 A JPS649694 A JP S649694A JP 16559987 A JP16559987 A JP 16559987A JP 16559987 A JP16559987 A JP 16559987A JP S649694 A JPS649694 A JP S649694A
- Authority
- JP
- Japan
- Prior art keywords
- circuits
- insulating material
- material layer
- circuit board
- multilayer interconnection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To make it possible to form circuits of a high density and high reliability by forming the circuit of the outermost layer by a plating method in a multilayer interconnection circuit board in which circuits of two or more layers are formed on one surface of the base material. CONSTITUTION:After lower circuits 2 are formed on the surface of a base material 1 by a plating method, circuit connecting sections 4 are formed on the lower circuits 2 and an insulating material layer 5 is formed so as to cover the lower circuits 2 and the circuit connecting sections 4. Then, after removing the surface layer of the insulating material layer 5 to expose the circuit connecting sections 4, upper circuits 3 are formed on the surface of the insulating material layer 5 by plating. The circuits 3 are formed by plating copper or the like, and it is preferred to employ a semi-additive method. Thus, in forming the upper circuits 3, the formation of the circuits 3 can be performed on the surface of the insulating material layer 5 which has become a planar surface. For this, micro patterns can be formed easily and very precisely.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16559987A JPS649694A (en) | 1987-07-01 | 1987-07-01 | Multilayer interconnection circuit board and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16559987A JPS649694A (en) | 1987-07-01 | 1987-07-01 | Multilayer interconnection circuit board and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS649694A true JPS649694A (en) | 1989-01-12 |
Family
ID=15815410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16559987A Pending JPS649694A (en) | 1987-07-01 | 1987-07-01 | Multilayer interconnection circuit board and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS649694A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4894866A (en) * | 1972-03-15 | 1973-12-06 | ||
JPS52145773A (en) * | 1976-05-29 | 1977-12-05 | Tokyo Shibaura Electric Co | Method of producing multilayer printed circuit board |
JPS55158697A (en) * | 1979-05-30 | 1980-12-10 | Nippon Electric Co | Multilayer wiring substrate |
JPS5662398A (en) * | 1979-10-26 | 1981-05-28 | Nippon Electric Co | Method of manufacturing high density multilayer board |
JPS5762593A (en) * | 1980-10-02 | 1982-04-15 | Hitachi Condenser | Method of producing multilayer printed circuit board |
JPS61127196A (en) * | 1984-11-26 | 1986-06-14 | 旭化成株式会社 | Manufacture of multilayer wiring board |
-
1987
- 1987-07-01 JP JP16559987A patent/JPS649694A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4894866A (en) * | 1972-03-15 | 1973-12-06 | ||
JPS52145773A (en) * | 1976-05-29 | 1977-12-05 | Tokyo Shibaura Electric Co | Method of producing multilayer printed circuit board |
JPS55158697A (en) * | 1979-05-30 | 1980-12-10 | Nippon Electric Co | Multilayer wiring substrate |
JPS5662398A (en) * | 1979-10-26 | 1981-05-28 | Nippon Electric Co | Method of manufacturing high density multilayer board |
JPS5762593A (en) * | 1980-10-02 | 1982-04-15 | Hitachi Condenser | Method of producing multilayer printed circuit board |
JPS61127196A (en) * | 1984-11-26 | 1986-06-14 | 旭化成株式会社 | Manufacture of multilayer wiring board |
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