JPS649694A - Multilayer interconnection circuit board and manufacture thereof - Google Patents

Multilayer interconnection circuit board and manufacture thereof

Info

Publication number
JPS649694A
JPS649694A JP16559987A JP16559987A JPS649694A JP S649694 A JPS649694 A JP S649694A JP 16559987 A JP16559987 A JP 16559987A JP 16559987 A JP16559987 A JP 16559987A JP S649694 A JPS649694 A JP S649694A
Authority
JP
Japan
Prior art keywords
circuits
insulating material
material layer
circuit board
multilayer interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16559987A
Other languages
Japanese (ja)
Inventor
Yoshinaga Yamakawa
Nobuyuki Takahashi
Toshiyuki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Toyo Giken Kogyo KK
Original Assignee
Toyo Giken Kogyo KK
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Giken Kogyo KK, Matsushita Electric Works Ltd filed Critical Toyo Giken Kogyo KK
Priority to JP16559987A priority Critical patent/JPS649694A/en
Publication of JPS649694A publication Critical patent/JPS649694A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To make it possible to form circuits of a high density and high reliability by forming the circuit of the outermost layer by a plating method in a multilayer interconnection circuit board in which circuits of two or more layers are formed on one surface of the base material. CONSTITUTION:After lower circuits 2 are formed on the surface of a base material 1 by a plating method, circuit connecting sections 4 are formed on the lower circuits 2 and an insulating material layer 5 is formed so as to cover the lower circuits 2 and the circuit connecting sections 4. Then, after removing the surface layer of the insulating material layer 5 to expose the circuit connecting sections 4, upper circuits 3 are formed on the surface of the insulating material layer 5 by plating. The circuits 3 are formed by plating copper or the like, and it is preferred to employ a semi-additive method. Thus, in forming the upper circuits 3, the formation of the circuits 3 can be performed on the surface of the insulating material layer 5 which has become a planar surface. For this, micro patterns can be formed easily and very precisely.
JP16559987A 1987-07-01 1987-07-01 Multilayer interconnection circuit board and manufacture thereof Pending JPS649694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16559987A JPS649694A (en) 1987-07-01 1987-07-01 Multilayer interconnection circuit board and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16559987A JPS649694A (en) 1987-07-01 1987-07-01 Multilayer interconnection circuit board and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS649694A true JPS649694A (en) 1989-01-12

Family

ID=15815410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16559987A Pending JPS649694A (en) 1987-07-01 1987-07-01 Multilayer interconnection circuit board and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS649694A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4894866A (en) * 1972-03-15 1973-12-06
JPS52145773A (en) * 1976-05-29 1977-12-05 Tokyo Shibaura Electric Co Method of producing multilayer printed circuit board
JPS55158697A (en) * 1979-05-30 1980-12-10 Nippon Electric Co Multilayer wiring substrate
JPS5662398A (en) * 1979-10-26 1981-05-28 Nippon Electric Co Method of manufacturing high density multilayer board
JPS5762593A (en) * 1980-10-02 1982-04-15 Hitachi Condenser Method of producing multilayer printed circuit board
JPS61127196A (en) * 1984-11-26 1986-06-14 旭化成株式会社 Manufacture of multilayer wiring board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4894866A (en) * 1972-03-15 1973-12-06
JPS52145773A (en) * 1976-05-29 1977-12-05 Tokyo Shibaura Electric Co Method of producing multilayer printed circuit board
JPS55158697A (en) * 1979-05-30 1980-12-10 Nippon Electric Co Multilayer wiring substrate
JPS5662398A (en) * 1979-10-26 1981-05-28 Nippon Electric Co Method of manufacturing high density multilayer board
JPS5762593A (en) * 1980-10-02 1982-04-15 Hitachi Condenser Method of producing multilayer printed circuit board
JPS61127196A (en) * 1984-11-26 1986-06-14 旭化成株式会社 Manufacture of multilayer wiring board

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