JPS644094A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE:To make it possible to form a solder resist layer of high quality with an inexpensive means by previously making the thickness of the land sections thicker than the other sections, applying a solder resist on the whole surface, and thereafter removing the solder resist by a predetermined thickness so as to expose only the land sections. CONSTITUTION:A plating resist 3 is formed on a material constructed by stick ing copper foils 2 on both sides of an insulating board 1. Then, when copper plating is applied to this and plating resist is removed, a structure is formed in which only the land sections 4 are plated. An etching resist 5 is formed on this to form a conductor 6, and when the unnecessary copper foil part is etched to remove the resist, the land sections 4 and the conductor 6 are formed. Subsequently, a solder resist 7 is applied on the whole surface with, for instance, a roll coater and dried. Thereafter, by removing the solder resist 7 by a predeter mined thickness by the use of a mechanical or chemical method, the land sections 4 having a large conductor thickness are exposed. When a fixing hole 8 is cut in the center of this section, a printed wiring board is obtained in which the parts other than the land sections 4 are covered with the solder resist 7.