JPH0138080B2 - - Google Patents
Info
- Publication number
- JPH0138080B2 JPH0138080B2 JP58246512A JP24651283A JPH0138080B2 JP H0138080 B2 JPH0138080 B2 JP H0138080B2 JP 58246512 A JP58246512 A JP 58246512A JP 24651283 A JP24651283 A JP 24651283A JP H0138080 B2 JPH0138080 B2 JP H0138080B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon carbide
- substrate
- single crystal
- type silicon
- carbide single
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/931—Silicon carbide semiconductor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58246512A JPS60145992A (ja) | 1983-12-29 | 1983-12-29 | 炭化珪素単結晶基板の製造方法 |
US06/683,651 US5037502A (en) | 1983-12-29 | 1984-12-19 | Process for producing a single-crystal substrate of silicon carbide |
DE19843446956 DE3446956A1 (de) | 1983-12-29 | 1984-12-21 | Verfahren zum herstellen eines einkristall-substrates aus siliciumcarbid |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58246512A JPS60145992A (ja) | 1983-12-29 | 1983-12-29 | 炭化珪素単結晶基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60145992A JPS60145992A (ja) | 1985-08-01 |
JPH0138080B2 true JPH0138080B2 (en, 2012) | 1989-08-10 |
Family
ID=17149491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58246512A Granted JPS60145992A (ja) | 1983-12-29 | 1983-12-29 | 炭化珪素単結晶基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5037502A (en, 2012) |
JP (1) | JPS60145992A (en, 2012) |
DE (1) | DE3446956A1 (en, 2012) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09263497A (ja) * | 1996-03-29 | 1997-10-07 | Denso Corp | 炭化珪素単結晶の製造方法 |
US9212305B2 (en) * | 2009-03-02 | 2015-12-15 | Nalco Company | Compositions for inhibiting the formation of hydrate agglomerates |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61243000A (ja) * | 1985-04-18 | 1986-10-29 | Sharp Corp | 炭化珪素単結晶基板の製造方法 |
US5319220A (en) * | 1988-01-20 | 1994-06-07 | Sharp Kabushiki Kaisha | Silicon carbide semiconductor device |
DE4109005C1 (en, 2012) * | 1991-03-19 | 1992-09-10 | Cs Halbleiter- Und Solartechnologie Gmbh, 8000 Muenchen, De | |
JPH04292499A (ja) * | 1991-03-22 | 1992-10-16 | Sharp Corp | 炭化珪素単結晶の製造方法 |
DE4121798A1 (de) * | 1991-07-02 | 1993-01-14 | Daimler Benz Ag | Mehrschichtige, monokristallines siliziumkarbid enthaltene zusammensetzung |
JP3214868B2 (ja) * | 1991-07-19 | 2001-10-02 | ローム株式会社 | ヘテロ接合バイポーラトランジスタの製造方法 |
US5433167A (en) * | 1992-02-04 | 1995-07-18 | Sharp Kabushiki Kaisha | Method of producing silicon-carbide single crystals by sublimation recrystallization process using a seed crystal |
DE4234508C2 (de) * | 1992-10-13 | 1994-12-22 | Cs Halbleiter Solartech | Verfahren zur Herstellung eines Wafers mit einer monokristallinen Siliciumcarbidschicht |
TW337513B (en) * | 1992-11-23 | 1998-08-01 | Cvd Inc | Chemical vapor deposition-produced silicon carbide having improved properties and preparation process thereof |
CA2113336C (en) * | 1993-01-25 | 2001-10-23 | David J. Larkin | Compound semi-conductors and controlled doping thereof |
SE9502288D0 (sv) † | 1995-06-26 | 1995-06-26 | Abb Research Ltd | A device and a method for epitaxially growing objects by CVD |
SE9503428D0 (sv) † | 1995-10-04 | 1995-10-04 | Abb Research Ltd | A method for epitaxially growing objects and a device for such a growth |
US5944890A (en) * | 1996-03-29 | 1999-08-31 | Denso Corporation | Method of producing single crystals and a seed crystal used in the method |
US6110279A (en) * | 1996-03-29 | 2000-08-29 | Denso Corporation | Method of producing single-crystal silicon carbide |
JP3524679B2 (ja) * | 1996-06-21 | 2004-05-10 | 東芝セラミックス株式会社 | 高純度CVD−SiC質の半導体熱処理用部材及びその製造方法 |
US6217662B1 (en) * | 1997-03-24 | 2001-04-17 | Cree, Inc. | Susceptor designs for silicon carbide thin films |
KR20000068834A (ko) | 1997-08-27 | 2000-11-25 | 모리시타 요이찌 | 탄화규소기판 및 그 제조방법, 및 탄화규소기판을 사용한 반도체소자 |
JP2891978B1 (ja) * | 1998-02-17 | 1999-05-17 | 日本ピラー工業株式会社 | 炭化珪素質構造体 |
US6706114B2 (en) * | 2001-05-21 | 2004-03-16 | Cree, Inc. | Methods of fabricating silicon carbide crystals |
JP3978494B2 (ja) * | 2003-06-12 | 2007-09-19 | 国立大学法人東北大学 | Si薄膜の作製方法 |
TWD104755S1 (zh) * | 2003-11-04 | 2005-05-21 | 東京威力科創股份有限公司 | 半導體製造裝置之處理管 |
TWD105531S1 (zh) * | 2003-11-04 | 2005-07-11 | 東京威力科創股份有限公司 | 半導體製造裝置之處理管 |
USD520467S1 (en) * | 2003-11-04 | 2006-05-09 | Tokyo Electron Limited | Process tube for semiconductor device manufacturing apparatus |
CN101517028B (zh) | 2006-09-27 | 2013-07-17 | H.B.富勒公司 | 包含植物蜡的热熔融压敏粘合剂组合物以及包含其的制品 |
TWD125601S (zh) * | 2007-05-08 | 2008-10-21 | 東京威力科創股份有限公司 | 半導體製造用加工處理管 |
USD724551S1 (en) * | 2011-11-18 | 2015-03-17 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
USD720308S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
USD725053S1 (en) * | 2011-11-18 | 2015-03-24 | Tokyo Electron Limited | Outer tube for process tube for manufacturing semiconductor wafers |
FR3103962B1 (fr) * | 2019-11-29 | 2021-11-05 | Soitec Silicon On Insulator | Procede de fabrication d’une structure composite comprenant une couche mince en sic monocristallin sur un substrat support en sic cristallin |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6814915A (en, 2012) * | 1968-10-18 | 1970-04-21 | ||
JPS5213656B2 (en, 2012) * | 1972-09-20 | 1977-04-15 | ||
DE2364989C3 (de) * | 1973-12-28 | 1979-10-18 | Consortium Fuer Elektrochemische Industrie Gmbh, 8000 Muenchen | Verfahren zur Herstellung von Schichten aus Siliciumcarbid auf einem Siliciumsubstrat |
US3956032A (en) * | 1974-09-24 | 1976-05-11 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Process for fabricating SiC semiconductor devices |
US4455385A (en) * | 1975-06-30 | 1984-06-19 | General Electric Company | Silicon carbide sintered body |
JPS5443200A (en) * | 1977-09-13 | 1979-04-05 | Sharp Corp | Production of silicon carbide substrate |
JPS6045159B2 (ja) * | 1978-02-03 | 1985-10-08 | シャープ株式会社 | 炭化珪素結晶層の製造方法 |
DE3002671C2 (de) * | 1979-01-25 | 1983-04-21 | Sharp K.K., Osaka | Verfahren zur Herstellung eines Siliciumcarbidsubstrats |
JPS5812238B2 (ja) * | 1979-02-27 | 1983-03-07 | シャープ株式会社 | 炭化珪素結晶層の製造方法 |
JPS56140021A (en) * | 1980-03-31 | 1981-11-02 | Mitsubishi Electric Corp | Manufacture of silicon carbide thin film |
US4512825A (en) * | 1983-04-12 | 1985-04-23 | The United States Of America As Represented By The Secretary Of The Navy | Recovery of fragile layers produced on substrates by chemical vapor deposition |
JPS59203799A (ja) * | 1983-04-28 | 1984-11-17 | Sharp Corp | 炭化珪素単結晶基板の製造方法 |
-
1983
- 1983-12-29 JP JP58246512A patent/JPS60145992A/ja active Granted
-
1984
- 1984-12-19 US US06/683,651 patent/US5037502A/en not_active Expired - Lifetime
- 1984-12-21 DE DE19843446956 patent/DE3446956A1/de active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09263497A (ja) * | 1996-03-29 | 1997-10-07 | Denso Corp | 炭化珪素単結晶の製造方法 |
US9212305B2 (en) * | 2009-03-02 | 2015-12-15 | Nalco Company | Compositions for inhibiting the formation of hydrate agglomerates |
Also Published As
Publication number | Publication date |
---|---|
DE3446956A1 (de) | 1985-07-11 |
JPS60145992A (ja) | 1985-08-01 |
US5037502A (en) | 1991-08-06 |
DE3446956C2 (en, 2012) | 1992-09-24 |
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