JPH01316936A - 半導体基板エッチング処理装置 - Google Patents
半導体基板エッチング処理装置Info
- Publication number
- JPH01316936A JPH01316936A JP14959788A JP14959788A JPH01316936A JP H01316936 A JPH01316936 A JP H01316936A JP 14959788 A JP14959788 A JP 14959788A JP 14959788 A JP14959788 A JP 14959788A JP H01316936 A JPH01316936 A JP H01316936A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- etching
- semiconductor substrate
- end surface
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 94
- 238000005530 etching Methods 0.000 title claims abstract description 87
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000011282 treatment Methods 0.000 title abstract description 7
- 238000004140 cleaning Methods 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000012545 processing Methods 0.000 claims description 16
- 238000007599 discharging Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 33
- 238000000034 method Methods 0.000 abstract description 14
- 230000002093 peripheral effect Effects 0.000 abstract description 9
- 238000001035 drying Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 241000125205 Anethum Species 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000010129 solution processing Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14959788A JPH01316936A (ja) | 1988-06-17 | 1988-06-17 | 半導体基板エッチング処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14959788A JPH01316936A (ja) | 1988-06-17 | 1988-06-17 | 半導体基板エッチング処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01316936A true JPH01316936A (ja) | 1989-12-21 |
| JPH0529305B2 JPH0529305B2 (enrdf_load_stackoverflow) | 1993-04-30 |
Family
ID=15478687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14959788A Granted JPH01316936A (ja) | 1988-06-17 | 1988-06-17 | 半導体基板エッチング処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01316936A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244167A (ja) * | 1993-02-18 | 1994-09-02 | M Setetsuku Kk | ウェハーエッジの加工方法とその装置 |
| US6516815B1 (en) | 1999-07-09 | 2003-02-11 | Applied Materials, Inc. | Edge bead removal/spin rinse dry (EBR/SRD) module |
| US6770565B2 (en) | 2002-01-08 | 2004-08-03 | Applied Materials Inc. | System for planarizing metal conductive layers |
| US6824612B2 (en) | 2001-12-26 | 2004-11-30 | Applied Materials, Inc. | Electroless plating system |
-
1988
- 1988-06-17 JP JP14959788A patent/JPH01316936A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244167A (ja) * | 1993-02-18 | 1994-09-02 | M Setetsuku Kk | ウェハーエッジの加工方法とその装置 |
| US6516815B1 (en) | 1999-07-09 | 2003-02-11 | Applied Materials, Inc. | Edge bead removal/spin rinse dry (EBR/SRD) module |
| US6824612B2 (en) | 2001-12-26 | 2004-11-30 | Applied Materials, Inc. | Electroless plating system |
| US6770565B2 (en) | 2002-01-08 | 2004-08-03 | Applied Materials Inc. | System for planarizing metal conductive layers |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0529305B2 (enrdf_load_stackoverflow) | 1993-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |