JPH01316936A - 半導体基板エッチング処理装置 - Google Patents

半導体基板エッチング処理装置

Info

Publication number
JPH01316936A
JPH01316936A JP14959788A JP14959788A JPH01316936A JP H01316936 A JPH01316936 A JP H01316936A JP 14959788 A JP14959788 A JP 14959788A JP 14959788 A JP14959788 A JP 14959788A JP H01316936 A JPH01316936 A JP H01316936A
Authority
JP
Japan
Prior art keywords
etching
semiconductor substrate
substrate
roller
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14959788A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0529305B2 (enrdf_load_html_response
Inventor
Kiyoshi Yoshikawa
吉川　清
Takashi Fujiwara
隆 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP14959788A priority Critical patent/JPH01316936A/ja
Publication of JPH01316936A publication Critical patent/JPH01316936A/ja
Publication of JPH0529305B2 publication Critical patent/JPH0529305B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
JP14959788A 1988-06-17 1988-06-17 半導体基板エッチング処理装置 Granted JPH01316936A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14959788A JPH01316936A (ja) 1988-06-17 1988-06-17 半導体基板エッチング処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14959788A JPH01316936A (ja) 1988-06-17 1988-06-17 半導体基板エッチング処理装置

Publications (2)

Publication Number Publication Date
JPH01316936A true JPH01316936A (ja) 1989-12-21
JPH0529305B2 JPH0529305B2 (enrdf_load_html_response) 1993-04-30

Family

ID=15478687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14959788A Granted JPH01316936A (ja) 1988-06-17 1988-06-17 半導体基板エッチング処理装置

Country Status (1)

Country Link
JP (1) JPH01316936A (enrdf_load_html_response)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244167A (ja) * 1993-02-18 1994-09-02 M Setetsuku Kk ウェハーエッジの加工方法とその装置
US6516815B1 (en) 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244167A (ja) * 1993-02-18 1994-09-02 M Setetsuku Kk ウェハーエッジの加工方法とその装置
US6516815B1 (en) 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers

Also Published As

Publication number Publication date
JPH0529305B2 (enrdf_load_html_response) 1993-04-30

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Legal Events

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