JPH0127100B2 - - Google Patents

Info

Publication number
JPH0127100B2
JPH0127100B2 JP55097439A JP9743980A JPH0127100B2 JP H0127100 B2 JPH0127100 B2 JP H0127100B2 JP 55097439 A JP55097439 A JP 55097439A JP 9743980 A JP9743980 A JP 9743980A JP H0127100 B2 JPH0127100 B2 JP H0127100B2
Authority
JP
Japan
Prior art keywords
weight
component
epoxy resin
parts
epichlorohydrin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55097439A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5628238A (en
Inventor
Goorudoin Robinson Jeemuzu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS5628238A publication Critical patent/JPS5628238A/ja
Publication of JPH0127100B2 publication Critical patent/JPH0127100B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/14Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H01B3/084Glass or glass wool in binder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/034Organic insulating material consisting of one material containing halogen
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/101Glass fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/306Resistant to heat
    • B32B2307/3065Flame resistant or retardant, fire resistant or retardant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/012Flame-retardant; Preventing of inflammation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP9743980A 1979-07-17 1980-07-16 Refractory glass base epoxy resin laminate Granted JPS5628238A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5819279A 1979-07-17 1979-07-17

Publications (2)

Publication Number Publication Date
JPS5628238A JPS5628238A (en) 1981-03-19
JPH0127100B2 true JPH0127100B2 (enrdf_load_stackoverflow) 1989-05-26

Family

ID=22015276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9743980A Granted JPS5628238A (en) 1979-07-17 1980-07-16 Refractory glass base epoxy resin laminate

Country Status (7)

Country Link
JP (1) JPS5628238A (enrdf_load_stackoverflow)
BR (1) BR8004419A (enrdf_load_stackoverflow)
DE (2) DE3051170C2 (enrdf_load_stackoverflow)
FR (1) FR2461735B1 (enrdf_load_stackoverflow)
GB (1) GB2055842B (enrdf_load_stackoverflow)
MX (2) MX171029B (enrdf_load_stackoverflow)
NL (1) NL185937C (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621128A (en) * 1983-09-09 1986-11-04 Skw Trostberg Aktiengesellschaft Hardener solution for epoxide resin masses
DE3332553C2 (de) * 1983-09-09 1987-01-15 Skw Trostberg Ag, 8223 Trostberg Härterlösung für Epoxidharzmassen
DE3420042C1 (de) * 1984-05-29 1985-03-14 Dynamit Nobel Ag Zeichenfolie
JPS63168439A (ja) * 1986-12-27 1988-07-12 Sumitomo Bakelite Co Ltd 積層板用エポキシ樹脂組成物
JPH0228243A (ja) * 1988-07-15 1990-01-30 Toshiba Chem Corp 積層板用樹脂組成物
JPH02117912A (ja) * 1988-10-26 1990-05-02 Toshiba Chem Corp 績層板用樹脂組成物
US5019605A (en) * 1989-03-15 1991-05-28 Minnesota Mining And Manufacturing Company Low density, self-extinguishing epoxide composition
IE80526B1 (en) * 1994-02-10 1998-08-26 Belfield Mfg Ltd A process for producing limited fire hazard epoxide glass laminates
BE1011624A4 (fr) * 1997-12-17 1999-11-09 Laude Lucien Diego Supports de circuit electrique.
EP2137740A1 (en) * 2007-04-20 2009-12-30 ABB Research LTD An impregnation medium

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2997527A (en) * 1957-01-09 1961-08-22 Gen Electric Electrical apparatus having insulation for eliminating creepage tracking
US3214324A (en) * 1962-05-11 1965-10-26 Gen Mills Inc Fibrous materials impregnated with a partial reaction product derived from fatty guanamines and epoxy resins
DE1955524C2 (de) * 1969-11-05 1980-10-02 Siemens Ag, Berlin Und Muenchen, 8000 Muenchen GieDharzformmassen zur Herstellung von nichtbrennbaren elektrischen Bauteilen
US4101693A (en) * 1971-08-05 1978-07-18 General Electric Company Method of preparing epoxy-glass prepregs
JPS5010635U (enrdf_load_stackoverflow) * 1973-06-01 1975-02-03
JPS5180354A (ja) * 1975-01-10 1976-07-13 Hitachi Ltd Toransuchukeiyojushisoseibutsu
JPS5840990B2 (ja) * 1977-06-09 1983-09-09 松下電器産業株式会社 難燃性樹脂組成物

Also Published As

Publication number Publication date
GB2055842B (en) 1983-12-07
MX171029B (es) 1993-09-27
FR2461735A1 (fr) 1981-02-06
GB2055842A (en) 1981-03-11
DE3026709A1 (de) 1981-02-05
MX154944A (es) 1988-01-08
DE3026709C2 (enrdf_load_stackoverflow) 1991-07-25
JPS5628238A (en) 1981-03-19
NL185937C (nl) 1990-08-16
DE3051170C2 (enrdf_load_stackoverflow) 1991-07-11
BR8004419A (pt) 1981-01-27
NL8003959A (nl) 1981-01-20
FR2461735B1 (fr) 1986-05-09

Similar Documents

Publication Publication Date Title
KR910008866B1 (ko) 난연성기판
CN102361903B (zh) 环氧树脂组合物、预浸料、树脂涂覆的金属箔、树脂片、层压板和多层板
US6361866B1 (en) Prepreg and laminated board
JPH0127100B2 (enrdf_load_stackoverflow)
WO2015101233A1 (zh) 一种无卤环氧树脂组合物及其用途
JP4747608B2 (ja) ポリフェニレン樹脂組成物を含有するプリプレグ及び積層体
JPH0925349A (ja) プリプレグ及び積層板
US3378434A (en) Fire-resistant paper-base epoxy resin laminates
JPS6159330B2 (enrdf_load_stackoverflow)
JP2002194119A (ja) プリプレグ及び金属箔張り積層板
JP2000290490A (ja) 難燃硬化性樹脂組成物
JP2005015616A (ja) 積層板用樹脂組成物、有機基材プリプレグ、金属箔張り積層板及びプリント配線板
JPH06246871A (ja) エポキシ樹脂銅張り積層板
JP3720337B2 (ja) 有機基材プリプレグ、積層板及びプリント配線板
KR102212721B1 (ko) 무할로겐 무인 무질소 난연 수지 조성물, 그를 포함하는 프리프레그 및 금속박 적층판
JPH0476019A (ja) 硬化性ポリフェニレンエーテル・エポキシ樹脂組成物
JPH05293929A (ja) エポキシ樹脂銅張り積層板
JP3735911B2 (ja) エポキシ樹脂組成物及びそれを用いた積層板
JPS6018341A (ja) 難燃性エポキシ樹脂銅張積層板
JP3374317B2 (ja) エポキシ樹脂組成物および銅張り積層板
JPH0261507B2 (enrdf_load_stackoverflow)
JPS6226648B2 (enrdf_load_stackoverflow)
JPS6341937B2 (enrdf_load_stackoverflow)
JPS6221814B2 (enrdf_load_stackoverflow)
JPS6365091B2 (enrdf_load_stackoverflow)