WO2015101233A1 - 一种无卤环氧树脂组合物及其用途 - Google Patents

一种无卤环氧树脂组合物及其用途 Download PDF

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WO2015101233A1
WO2015101233A1 PCT/CN2014/095204 CN2014095204W WO2015101233A1 WO 2015101233 A1 WO2015101233 A1 WO 2015101233A1 CN 2014095204 W CN2014095204 W CN 2014095204W WO 2015101233 A1 WO2015101233 A1 WO 2015101233A1
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epoxy resin
halogen
resin composition
free epoxy
weight
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PCT/CN2014/095204
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English (en)
French (fr)
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吴奕辉
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广东生益科技股份有限公司
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Publication of WO2015101233A1 publication Critical patent/WO2015101233A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/06—Copolymers with vinyl aromatic monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Definitions

  • the invention relates to a halogen-free epoxy resin composition and a use thereof, in particular to a halogen-free epoxy resin composition and a resin glue liquid, prepreg, laminate, copper-clad laminate and high prepared therefrom Frequency circuit board.
  • the traditional copper-clad laminate for printed circuit is mainly made of brominated epoxy resin, and the flame-retardant function of the plate is realized by bromine.
  • carcinogens such as dioxins and dibenzofurans have been detected in the combustion products of electrical and electronic equipment wastes containing halogens such as bromine and chlorine, and halogen-containing products may release highly toxic substances during combustion. Hydrogen halide.
  • the EU's two environmental protection directives, the Waste Electrical and Electronic Equipment Directive and the Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment were officially implemented.
  • the first approach is to use phosphorus-containing epoxy resin as the main resin, and then dicyandiamide or phenolic resin.
  • a curing agent adding a certain amount of inorganic filler such as aluminum hydroxide, using dicyandiamide as a curing agent for the phosphorus-containing epoxy resin, the sheet has poor heat resistance and high water absorption; and the phenolic resin is used as a curing agent for the phosphorus-containing epoxy resin.
  • the prepreg has a poor appearance, and the plate has a large brittleness and poor workability.
  • benzoxazine resin As the main resin, add appropriate amount of phosphorus-containing epoxy resin or phosphorus-containing, nitrogen-containing curing agent, and then add appropriate amount of organic or inorganic filler, benzoxazine resin has good Heat resistance and low water absorption, but the brittleness is large and the processing properties of the sheet are poor.
  • the traditional electronic product application frequency is mostly concentrated below 1GHz, the traditional FR-4 material
  • the Dk/Df characteristics of the material are sufficient to meet its requirements. Even if it is not met, it can be achieved by changing the circuit design.
  • the application frequency is increasing, 3-6GHz will become the mainstream, and the substrate material will no longer play the role of mechanical support in the traditional sense, but will become PCB and electronic components together.
  • high Dk will slow down the signal transmission rate
  • high Df will convert the signal part into thermal energy loss in the substrate material, so reducing Dk/Df has become a hot spot for substrate manufacturers.
  • cyanate resin with excellent dielectric properties has become one of the hot spots.
  • cyanate resin has poor heat and humidity resistance and is explosive under high temperature conditions.
  • Japanese Patent Laid-Open No. Sho-50-132099 and JP-A-57-143320 propose a bisphenol A type epoxy resin, a brominated bisphenol A type epoxy resin, a phenol novolak type epoxy resin, and the like.
  • Hei 11-60692 propose an epoxy resin containing a naphthalene ring, a biphenyl-containing epoxy resin, and a lower alkyl-substituted phenol salicylate.
  • a specific epoxy resin such as a novolac type epoxy resin and an epoxy resin containing dicyclopentadiene is mixed with a cyanate ester, and the mixture has improved dielectric properties as compared with the above general epoxy resin composition.
  • the crosslinking density of the epoxy resin is lowered, the glass transition temperature of the resin composition is greatly lowered.
  • CN201080049278.8 adopts a resin composition scheme in which a cyanate ester, a condensed phosphate ester of a specific structure and styrene maleic anhydride are mixed and copolymerized together, and an appropriate amount of epoxy resin is used to realize a halogen-free copper-clad board.
  • a high glass transition temperature while having good dielectric properties, can significantly reduce the significant reduction in the dielectric loss factor of the composition.
  • the overall heat and humidity resistance is not stable when the amount is large in the composition, and the amount of cyanate ester is unstable. When less, the dielectric properties of the composition are not improved.
  • a halogen-free epoxy resin composition capable of providing excellent dielectric properties and high glass transition temperature required for a high-frequency circuit substrate. It also has stable moisture and heat resistance and halogen-free properties.
  • a halogen-free epoxy resin composition comprising, by weight of an organic solid, comprising:
  • component (D) Cyanate or/and cyanate prepolymer, and the weight ratio of component (D) to component (B) styrene to maleic anhydride copolymer is from 0.5 to 3:1.
  • the component (A) halogen-free epoxy resin is an epoxy resin having a benzene ring or a thick benzene structure.
  • the structure has a benzene ring or a thick benzene structure.
  • the epoxy resin is any one or a mixture of at least two of a biphenyl type epoxy resin, a fluorene type epoxy resin, or a naphthol type epoxy resin.
  • the mixture is, for example, a mixture of a biphenyl type epoxy resin and a fluorene type epoxy resin, a mixture of a naphthol type epoxy resin and a biphenyl type epoxy resin, a bismuth type epoxy resin and a naphthol type epoxy resin.
  • the mixture a mixture of a biphenyl type epoxy resin, a fluorene type epoxy resin, and a naphthol type epoxy resin, preferably a naphthol type epoxy resin, more preferably any one of the naphthol type epoxy resins having the following structural formula; Or a mixture of at least two:
  • n and n are each independently 1 or 2
  • q is an integer of 1 to 10
  • R is H or a substituted or unsubstituted C1-C5 alkyl group.
  • the q is, for example, 2, 3, 4, 5, 6, 7, 8, or 9.
  • the epoxy resin having a rigid structure of thick benzene has a large proportion of aromatic rings in the structure, and has good flame retardancy.
  • the content of the component (B) styrene and maleic anhydride copolymer (SMA) is 50 to 300 parts by weight, for example, 60 parts by weight based on 100 parts by weight of the halogen-free epoxy resin. 70 parts by weight, 80 parts by weight, 100 parts by weight, 120 parts by weight, 140 parts by weight, 160 parts by weight, 180 parts by weight, 200 parts by weight, 240 parts by weight, 260 parts by weight, 270 parts by weight, 280 parts by weight or 290 Parts by weight.
  • the addition of SMA improves the electrical properties of the halogen-free epoxy resin composition and its articles.
  • the SMA may be used singly or in combination, and the amount of use is preferably 50 to 300 parts by weight. If the amount is too small, the dielectric properties of the sheet are lowered, and if too much, the heat and humidity resistance of the sheet is improved, preferably 100 to 200 parts by weight. .
  • the styrene and maleic anhydride copolymer has the following structural formula:
  • n 1 1 : 1, 2 : 1, 3 : 1, 4 : 1, 6 : 1 or 8 : 1.
  • the weight average molecular weight of the styrene and maleic anhydride copolymer is from 1300 to 50,000, and the styrene and maleic anhydride copolymers are, for example, commercially available SMA1000, SMA2000, SMA EF-30, SMA EF- 40, SMA EF-60, SMA EF-80, etc.
  • the content of the component (C) phosphorus-containing compound is 1.0 to 20 parts by weight, for example, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, based on 100 parts by weight of the halogen-free epoxy resin. Parts by weight, 7 parts by weight, 8 parts by weight, 9 parts by weight, 10 parts by weight, 11 parts by weight, 12 parts by weight, 13 parts by weight, 14 parts by weight, 15 parts by weight, 16 parts by weight, 17 parts by weight, 18 parts by weight Or 19 parts by weight.
  • This level is advantageous for increasing the heat and humidity resistance required for the composition to be made. Since the system contains a copolymer of styrene and maleic anhydride, the composition has poor heat and humidity resistance.
  • the amount of phosphorus-containing compound is too small, and the phosphorus-containing compound cannot form an effective co-curing with styrene and maleic anhydride, and the wet heat resistance of the composition cannot be effectively improved. If the amount is too large, the water absorption becomes large, which is also unfavorable for the resin composition. The heat and humidity resistance is improved.
  • the component (C) phosphorus-containing compound is not limited, and any phosphorus-containing compound can be used in the present invention, and the phosphorus-containing compound can be produced according to a method well known to those skilled in the art, for example, CN1960997.
  • the phosphorus-containing compound of the component (C) as the second curing agent has the following structural formula:
  • the phenolic hydroxyl group in the phosphorus-containing compound may undergo a ring-opening crosslinking reaction with the epoxy and co-cure the epoxy with the acid anhydride.
  • the cyanate ester or/and cyanate prepolymer containing at least 2 cyanooxy groups in the molecule of component (D) can effectively increase the glass transition temperature of the composition and lower the dielectric constant and dielectric loss factor.
  • the invention adopts a composite curing agent composed of a copolymer of styrene and maleic anhydride and a compound containing phosphorus, which effectively improves the heat and humidity resistance, reduces the dielectric constant of the composition and the dielectric loss factor, and makes the glass transition temperature higher.
  • the amount is preferably from 0.5 to 3:1 by weight of the component (D) and the component (B) SMA, for example, 0.6:1, 0.8:1, 1:1, 1.2:1, 1.4. 1: 1, 1.6: 1, 1.8: 1, 2: 1, 2.2: 1, 2.4: 1, 2.6: 1, or 2.8: 1.
  • the cyanate ester is selected from the group consisting of cyanate esters having the formula (III) or the formula (IV) or a combination thereof:
  • R 1 is -CH 2 , or R 2 , R 3 , R 4 and R 5 are each independently a hydrogen atom or a substituted or unsubstituted C1-C4 alkyl group, and R 2 , R 3 , R 4 and R 5 are the same or different;
  • R 6 , R 7 and R 8 are each independently a hydrogen atom or a substituted or unsubstituted C1-C4 alkyl group, and R6, R 7 and R 8 are the same or different, and m 2 is from 1 to 7. Any integer, m 2 is, for example, 2, 3, 4, 5 or 6.
  • the component (D) may be selected from a cyanate ester having a structural formula (III) or a structural formula (IV) or a combination thereof, or a prepolymer thereof, or a mixture of both a cyanate ester and a cyanate ester prepolymer.
  • the component (D) is selected from the group consisting of 2,2-bis(4-cyanooxyphenyl)propane and bis(4-cyanooxyphenyl)B.
  • Alkane bis(3,5-dimethyl-4-cyanooxyphenyl)methane, 2,2-bis(4-cyanooxyphenyl)-1,1,1,3,3,3-hexa Fluoropropane, ⁇ , ⁇ '-bis(4-cyanooxyphenyl)-di-diiso Propyl benzene, cyclopentadiene type cyanate, phenol novolac type cyanate, cresol novolac type cyanate, 2,2-bis(4-cyanooxyphenyl)propane prepolymer, double (4 -Cyanooxyphenyl)ethane prepolymer, bis(3,5-dimethyl-4-cyanooxyphenyl)methane prepolymer, 2,2-bis(4-cyano
  • the halogen-free epoxy resin composition further comprises a component (E) phosphorus-containing flame retardant for improving the cured resin and the copper-clad thereof Flame retardant properties of foil laminates.
  • the phosphorus-containing flame retardant is any one of a phosphate ester, a phenoxyphosphazene compound or a phosphine phenanthrene and a derivative thereof, or a mixture of at least two .
  • the phosphorus-containing flame retardant is preferably not reduced in dielectric constant, and the phosphorus-containing flame retardant is preferably a phenoxyphosphazene compound or/and a phosphate ester, etc., which may be independently or according to a synergistic flame retardant effect with a naphthol epoxy resin or Mixed use.
  • the amount of the flame retardant of the invention can be appropriately added according to the flame retardant condition of the composition, so that the flame retardant grade of the composition is V0, and if the amount is too much, the flame retardant effect is excessive, and the amount is too small, then the flame retardant The effect is declining.
  • the optional halogen-free flame retardants are SPB-100, PX-200, PX-202, FR-700, OP-930, OP-935, but are not limited to the above selection.
  • the halogen-free epoxy resin composition further comprises a component (F) curing accelerator based on the technical solution provided by the present invention.
  • the curing accelerator is any accelerator known to accelerate the curing speed of the thermosetting resin, and preferably any one of an imidazole compound, a tertiary amine compound or a quaternary amine compound. Or a mixture of at least two, further preferably any one of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole or benzyldimethylamine Or a mixture of at least two, further preferably 2-ethyl-4-methylimidazole.
  • the (F) curing accelerator is added in an amount of 0.001 to 1%, for example, 0.005%, 0.01%, 0.05%, based on the total weight of the halogen-free epoxy resin composition. 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8% or 0.9%, preferably 0.05% to 0.5%.
  • the halogen-free epoxy resin composition further comprises a component (G) filler based on the technical solution provided by the present invention.
  • the addition of fillers is mainly used to adjust some physical properties of the composition, such as lowering the coefficient of thermal expansion (CTE), increasing the thermal conductivity, and the like.
  • CTE coefficient of thermal expansion
  • the mixing amount of the filler can be appropriately added according to the desired technical effect. When the amount is increased, the CTE is lowered, but the workability of the composition is deteriorated. On the contrary, the CTE is large, but the processability of the composition is good.
  • the filler is an organic or inorganic filler based on the technical solution provided by the present invention.
  • the inorganic filler is selected from the group consisting of crystalline silica, fused silica, spherical silica, hollow silica, glass powder, aluminum nitride, and nitrided. Any one or a mixture of at least two of boron, silicon carbide, aluminum hydroxide, titanium dioxide, barium titanate, barium titanate, alumina, barium sulfate, talc, calcium silicate, calcium carbonate or mica.
  • the organic filler is selected from any one of a polytetrafluoroethylene powder, a polyphenylene sulfide or a polyethersulfone powder or a mixture of at least two.
  • An exemplary halogen-free epoxy resin composition based on parts by weight of the organic solids, comprising:
  • the content of the styrene and maleic anhydride copolymer is 50 to 300 parts by weight based on the resin;
  • component (D) cyanate or / and cyanate prepolymer, and the weight ratio of component (D) to component (B) styrene and maleic anhydride copolymer is 0.5 ⁇ 3: 1;
  • An exemplary halogen-free epoxy resin composition based on parts by weight of the organic solids, comprising:
  • the molecular structure of styrene and maleic anhydride copolymer is
  • component (D) cyanate or / and cyanate prepolymer, and the weight ratio of component (D) to component (B) styrene and maleic anhydride copolymer is 0.5 ⁇ 3: 1;
  • An exemplary halogen-free epoxy resin composition based on parts by weight of the organic solids, comprising:
  • the molecular structure of styrene and maleic anhydride copolymer is
  • the cyanate ester is selected from the group consisting of cyanate esters having the formula (III) or the formula (IV) or a combination thereof:
  • R 1 is -CH 2
  • R 2 , R 3 , R 4 and R 5 are each independently a hydrogen atom or a substituted or unsubstituted C1-C4 alkyl group
  • R 6 , R 7 and R 8 are each independently a hydrogen atom or a substituted or unsubstituted C1-C4 alkyl group, and m 2 is an arbitrary integer of from 1 to 7;
  • An exemplary halogen-free epoxy resin composition based on parts by weight of the organic solids, comprising:
  • halogen-free epoxy resin selected from any one or a mixture of at least two of a naphthol type epoxy resin having the following structural formula:
  • the molecular structure of styrene and maleic anhydride copolymer is
  • a phosphorus-containing compound as a second curing agent is contained in an amount of 1.0 to 20 parts by weight based on 100 parts by weight of the halogen-free epoxy resin, and the phosphorus-containing compound is selected from the following structural formula:
  • the phosphorus content of the halogen-free epoxy resin composition is controlled to be 1 to 5% by weight based on 100% by weight of the total weight of the halogen-free epoxy resin composition.
  • the nitrogen content is controlled at 1 to 5% by weight, such as 1.3% by weight, 1.6% by weight, 2% by weight, 2.3% by weight, 2.6% by weight, 3% by weight, 3.3% by weight, 3.6% by weight, 4% by weight, 4.3% by weight or 4.7% by weight.
  • the phosphorus content and the nitrogen content are too low to achieve a good flame retardant effect, and if the phosphorus content and the nitrogen content are too high, the water absorption becomes large, which is disadvantageous to the improvement of the moist heat resistance of the resin composition
  • the halogen content of the halogen-free epoxy resin composition is controlled to be less than 0.09% by weight based on 100% by weight of the total weight of the halogen-free epoxy resin composition.
  • the halogen-free epoxy resin composition may further contain various additives, and specific examples thereof include a flame retardant, an antioxidant, a heat stabilizer, an antistatic agent, an ultraviolet absorber, a pigment, a colorant, or Lubricants, etc. These various additives may be used singly or in combination of two or more. use.
  • the halogen-free epoxy resin, the copolymer of styrene and maleic anhydride, the phosphorus-containing compound, and cyanic acid can be blended, stirred, and mixed by a known method. It is prepared by using an ester or/and a cyanate prepolymer, a phosphorus-containing flame retardant and a curing accelerator, and various additives.
  • the solvent in the present invention is not particularly limited, and specific examples thereof include alcohols such as methanol, ethanol, and butanol, ethyl cellosolve, butyl cellosolve, ethylene glycol-methyl ether, carbitol, and butyl.
  • Ethers such as carbitol, ketones such as acetone, methyl ethyl ketone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and mesitylene; An ester such as ethyl acetate or ethyl acetate; a nitrogen-containing solvent such as N,N-dimethylformamide, N,N-dimethylacetamide or N-methyl-2-pyrrolidone. These solvents may be used alone or in combination of two or more.
  • aromatic hydrocarbon solvents such as toluene, xylene, and mesitylene, and acetone, methyl ethyl ketone, methyl ethyl ketone, and methyl group.
  • a ketone flux such as butyl ketone or cyclohexanone is used in combination.
  • the amount of the solvent to be used can be selected by a person skilled in the art according to his own experience, so that the obtained resin glue can reach a viscosity suitable for use.
  • An emulsifier may be added during the process of dissolving or dispersing the halogen-free epoxy resin composition as described above in a solvent. By dispersing by an emulsifier, the filler or the like can be uniformly dispersed in the glue.
  • An exemplary method of preparing the prepreg of the present invention is:
  • the epoxy resin composition of the present invention is made into a certain concentration of glue, and the material is impregnated by impregnation. Thereafter, it is dried at a certain temperature, the solvent is removed, and the resin composition is cured to obtain a prepreg.
  • the reinforcing material is a reinforcing material disclosed in the prior art, such as a fiberglass cloth or the like.
  • a fourth object of the present invention is to provide a laminate comprising at least one prepreg as described above.
  • a fifth object of the present invention is to provide a copper clad laminate comprising at least one laminated prepreg as described above and laminated on one side of the laminated prepreg Or copper foil on both sides.
  • a sixth object of the present invention is to provide a high-frequency circuit substrate comprising at least one laminated prepreg as described above and copper laminated on both sides of the laminated prepreg Foil. It has excellent dielectric properties, high glass transition temperature, stable moisture and heat resistance, and halogen-free properties.
  • An exemplary copper-clad laminate of the present invention is prepared by laminating one or more of the prepregs described above in a certain order, and respectively pressing the copper foil on the prepreg which is superposed on each other. One or both sides of the material are solidified in a hot press to obtain a copper clad laminate having a curing temperature of 150 to 250 ° C and a curing pressure of 25 to 60 kg/cm 2 .
  • the present invention has the following beneficial effects:
  • the halogen-free epoxy resin composition of the present invention uses a copolymer of styrene and maleic anhydride, a phosphorus-containing compound as a composite curing agent, and a cyanate ester or/and a cyanate ester prepolymer, which functions as a cyanate ester.
  • the glass transition temperature is high and the dielectric properties are good, and the defects of poor heat and humidity resistance are well overcome.
  • the epoxy resin composition of the invention is composed of a copolymer of styrene and maleic anhydride and a compound containing phosphorus.
  • the curing agent fully exerts the advantage that the reaction between styrene and maleic anhydride does not form a polar group in the reaction with the epoxy, and the dielectric property is superior, and the cyanate ester is used as a modifier, which is superior in the original. Based on the dielectric properties, the dielectric properties are further improved, and the phosphorus-containing compound is used as a co-solid.
  • the agent effectively improves the poor heat and humidity resistance of styrene and maleic anhydride and cyanate ester blending; 3 the invention fully utilizes the composite curing of styrene and maleic anhydride copolymer and phosphorus compound Characteristics, with cyanate ester with good dielectric properties, and using the synergistic properties of naphthol type epoxy resin and phosphorus-containing flame retardant to improve flame retardant performance, halogen content is below 0.09%, thereby achieving environmental protection effect;
  • the prepreg prepared by using the above halogen-free epoxy resin composition and the copper-clad laminate thereof have excellent dielectric properties, high glass transition temperature, stable heat and humidity resistance, and halogen-free properties. .
  • A1 NC-7700L, naphthol type novolac epoxy resin (Japanese medicine);
  • A2 EPR627MEK80, bisphenol A type multifunctional epoxy resin (Mitu Chemical);
  • A3 NPEP-204, DOPO modified o-cresol novolac epoxy resin (Taiwan South Asia);
  • SMA EF-40 a copolymer of styrene and maleic anhydride (American sartomer);
  • F1 2E4MZ, 2-ethyl-4-methylimidazole (formerly developed by Shikoku, Japan);
  • F2 zinc octoate
  • Comparative example 1 Comparative example 2 Comparative example 3 A1 0 0 100 A2 0 0 0 A3 100 100 0 B 15 80 150 C1 0 0 0 C2 0 150 0 D1 150 150 100 D2 0 0 0 E1 0 50 0 E2 40 0 0 E3 0 0 50 F1 Moderate amount Moderate amount Moderate amount F2 Moderate amount Moderate amount Moderate amount G 15 20 20 20 Glass transition temperature (Tg, °C) 170 197 199 Dielectric constant, 1 GHz 4.0 3.7 3.7 Dielectric loss, 1 GHz 0.007 0.004 0.004 Heat and humidity resistance 0/5 0/5 0/5 Drilling wear ⁇ x ⁇ Flame retardancy V-0 V-0 V-0 Halogen content, % 0.03 0.03 0.03 0.03
  • Glass transition temperature (Tg) Measured according to the DMA test method specified in IPC-TM-6502.4.24 using a DMA test.
  • halogen content of the copper-clad laminate was measured by an oxygen cylinder combustion method and an ion chromatography method in accordance with JPCA-ES-01-2002 "Halogen-free copper-clad laminate test method".
  • Comparative Example 1 had poor heat and humidity resistance
  • Comparative Example 2 had poor heat and humidity resistance
  • drilled wear was poor
  • Comparative Example 3 introduced condensed phosphate PX200, which had good dielectric properties, but due to the system.
  • the cyanate esters present and the copolymers of styrene and maleic anhydride are not fully co-cured, so that the heat and humidity resistance of the system is still poor.
  • the copper-clad laminate produced by the resin of the invention has good moist heat resistance and processing properties, and also has excellent high-frequency dielectric properties, and can satisfy the halogen-free high-frequency high-speed field for printed circuit boards. Requirements.

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Abstract

本发明公开了一种无卤环氧树脂组合物以及其用途，该环氧树脂组合物包含以下成分：（A）无卤环氧树脂；（B）作为第一固化剂的苯乙烯与马来酸酐共聚物（SMA）；（C）作为第二固化剂的含磷化合物；（D）氰酸酯或/和氰酸酯预聚物。使用该环氧树脂组合物的高频电路基板，包括一张或数张相互叠合的预浸料、及分别压覆于其两侧的铜箔，预浸料包括基材及通过含浸干燥之后附着在基材上的上述无卤环氧树脂组合物。

Description

一种无卤环氧树脂组合物及其用途 技术领域
本发明涉及一种无卤环氧树脂组合物及其用途，具体涉及一种无卤环氧树脂组合物及用其制备的树脂胶液、预浸料、层压板、覆铜箔层压板以及高频电路基板。
背景技术
传统的印制电路用覆铜箔层压板，主要采用溴化环氧树脂，通过溴来实现板材的阻燃功能。但近年来，在含溴、氯等卤素的电子电气设备废弃物的燃烧产物中检验出二噁英、二苯并呋喃等致癌物质，并且含卤产品在燃烧过程中有可能释放出剧毒物质卤化氢。2006年7月1日，欧盟的两份环保指令《关于报废电气电子设备指令》和《关于在电气电子设备中限制使用某些有害物质指令》正式实施。这两份指令的实施使无卤阻燃覆铜箔层压板的开发成为业界的热点。各覆铜箔层压板的厂家都纷纷推出自己的无卤阻燃覆铜箔层压板。
经过数年的发展，目前，实现覆铜箔层压板无卤阻燃的主要技术途径有两种，第一种途径，采用含磷环氧树脂为主体树脂，然后采用双氰胺或酚醛树脂为固化剂，添加一定量的氢氧化铝等无机填料，采用双氰胺作为含磷环氧树脂的固化剂，板材的耐热性差，吸水性大；采用酚醛树脂作为含磷环氧树脂的固化剂，半固化片的表观差，板材的脆性大，加工性差。第二种途径，采用苯并噁嗪树脂为主体树脂，加入适量的含磷环氧树脂或含磷、含氮的固化剂，再添加适量的有机或无机填料，苯并噁嗪树脂有好的耐热性能及低的吸水率，但是脆性大，板材的加工性能差。
另一方面，传统的电子产品应用频率大多集中在1GHz以下，传统FR-4材 料的Dk/Df特性足以满足其要求。即使不能满足，也可以通过改变线路设计从而达到要求。但随着电子产品信息处理的高速化和多功能化，应用频率不断提高，3-6GHz将成为主流，基板材料不再是扮演传统意义下的机械支撑角色，而将与电子组件一起成为PCB和终端厂商设计者提升产品性能的一个重要途径。因为高Dk会使信号传递速率变慢，高Df会使信号部分转化为热能损耗在基板材料中，因而降低Dk/Df已成为基板业者的追逐热点。在此背景下，介电性能优异的氰酸酯树脂成了备受瞩目的热点之一。但氰酸酯树脂由于其自身的局限性，耐湿热性能较差，高温条件下易爆板。
日本专利特开昭50-132099号公报以及特开昭57-143320号公报提出过如下方案，即将双酚A型环氧树脂、溴化双酚A型环氧树脂、苯酚酚醛型环氧树脂以及甲酚酚醛型环氧树脂等一般环氧树脂混合于氰酸酯树脂中的树脂组合物方案，这一方案和氰酸酯单独体系相比，能进一步改善耐湿热性，但是这些树脂组合物因受环氧树脂的影响，其大幅度牺牲了氰酸酯树脂的介电性能。日本专利特开平8-176273号公报、特开平8-176274号公报以及特开平11-60692号公报提出选择含有萘环的环氧树脂、含有联苯结构环氧树脂、低级烷基取代苯酚水杨酚醛型环氧树脂、以及含有二环戊二烯的环氧树脂等特定的环氧树脂混合于氰酸酯，此混合物较上述一般的环氧树脂组合物相比改善了介电性能。但是由于环氧树脂的交联密度降低，大大降低了树脂组合物的玻璃化转变温度。
CN201080049278.8采用将氰酸酯、特定结构的缩合磷酸酯以及苯乙烯马来酸酐混合在一起共聚的树脂组合物方案，并搭配适量环氧树脂，实现了覆铜箔板的无卤化，具有较高的玻璃化转变温度，同时具有良好的介电性能，可显著降低组合物的介电损耗因子的显著减少。然而，由于氰酸酯固有的吸潮性大的问题，其在组合物中用量较大时，整体耐湿热性能并不稳定，而氰酸酯用量 较少时，组合物的介电性能又无法得到较好的改善。
发明内容
针对已有技术中存在的问题，本发明的目的之一在于提供一种无卤环氧树脂组合物，其能够提供高频电路基板所需的优良的介电性能、高的玻璃化转变温度，同时具有稳定的耐湿热性能，并且具备无卤特性。
为了达到上述目的，本发明采用了如下技术方案：
一种无卤环氧树脂组合物，以有机固形物重量份计，其包含：
(A)100重量份的无卤环氧树脂；
(B)苯乙烯与马来酸酐共聚物作为第一固化剂，以100重量份的无卤环氧树脂为基准，该苯乙烯与马来酸酐共聚物的含量为50～300重量份；
(C)含磷化合物为第二固化剂，以100重量份的无卤环氧树脂为基准，该含磷化合物的含量为1.0～20重量份，所述含磷化合物是由含有选自H-P＝O、P-H或P-OH基团的至少一种有机磷化合物与至少一种具有化学结构式[K’(Y)a’]a(X-O-R”)b的化合物反应而得；其中，K’是有机基团，Y选自羟基、羧酸、羧酸酯、酸酐、胺、-SH、-SO3H、-CONH2、-NHCOOR1、亚膦酸酯和磷酸酯的官能团；X是亚烃基；R”是氢或具有1-8个碳原子的取代或未取代的烃基；R1是具有1至12个碳原子的取代或未取代的烷基或芳基，且a’、a和b各自独立地为≥1的整数，例如2、3、4、5、6、7、8或9等；
(D)氰酸酯或/和氰酸酯预聚物，且组分(D)与组分(B)苯乙烯与马来酸酐共聚物的重量比为0.5～3∶1。
优选地，在本发明提供的技术方案的基础上，所述组分(A)无卤环氧树脂是具有苯环或稠苯结构的环氧树脂。
优选地，在本发明提供的技术方案的基础上，所述具有苯环或稠苯结构的 环氧树脂为联苯型环氧树脂、蒽醌型环氧树脂或萘酚型环氧树脂中的任意一种或者至少两种的混合物。所述混合物例如联苯型环氧树脂和蒽醌型环氧树脂的混合物，萘酚型环氧树脂和联苯型环氧树脂的混合物，蒽醌型环氧树脂和萘酚型环氧树脂的混合物，联苯型环氧树脂、蒽醌型环氧树脂和萘酚型环氧树脂的混合物，优选萘酚型环氧树脂，进一步优选具有如下结构式的萘酚型环氧树脂中的任意一种或者至少两种的混合物：
Figure PCTCN2014095204-appb-000001
其中，m、n各自独立地为1或2，q为1～10的整数，R为H或取代或未取代的C1～C5的烷基。所述q例如为2、3、4、5、6、7、8或9。
具有稠苯刚性结构的环氧树脂由于结构中芳香环占有较大的比例，阻燃性好。
以100重量份的无卤环氧树脂为基准，所述组分(B)苯乙烯与马来酸酐共聚物(Styrene-Maleic anhydride Copolymer，SMA)的含量为50～300重量份，例如60重量份、70重量份、80重量份、100重量份、120重量份、140重量份、160重量份、180重量份、200重量份、240重量份、260重量份、270重量份、280重量份或290重量份。SMA的添加可以改善无卤环氧树脂组合物及其制品的电性能。所述SMA可以单独或者混合使用，使用量建议为50～300重量份为宜，用量太少板材的介电性能降低，太多则影响板材的耐湿热性能提高等，优选为100～200重量份。
优选地，所述苯乙烯与马来酸酐共聚物具有如下结构式：
Figure PCTCN2014095204-appb-000002
其中，m1∶n1＝1∶1、2∶1、3∶1、4∶1、6∶1或8∶1。
优选地，所述苯乙烯与马来酸酐共聚物的重均分子量为1300～50000，所述苯乙烯与马来酸酐共聚物例如为商业可得的SMA1000，SMA2000，SMA EF-30，SMA EF-40，SMA EF-60，SMA EF-80等。
以100重量份的无卤环氧树脂为基准，所述组分(C)含磷化合物的含量为1.0～20重量份，例如2重量份、3重量份、4重量份、5重量份、6重量份、7重量份、8重量份、9重量份、10重量份、11重量份、12重量份、13重量份、14重量份、15重量份、16重量份、17重量份、18重量份或19重量份。该含量有利于提高其制成的组合物所需的耐湿热性能的提高。由于体系中含有苯乙烯与马来酸酐共聚物，组合物的耐湿热性能较差。含磷化合物用量太少，含磷化合物无法与苯乙烯与马来酸酐形成有效的共固化，无法有效提高组合物的耐湿热性能，用量太多，则吸水性变大，同样不利于树脂组合物的耐湿热性能的提高。
组分(C)含磷化合物并无限制，且任一含磷化合物皆可用于本发明，含磷化合物可根据熟悉此项技术的人员熟知的方法进行制备，例如：CN1960997。
优选地，所述组分(C)作为第二固化剂的含磷化合物具有如下结构式：
Figure PCTCN2014095204-appb-000003
含磷化合物中的酚羟基可以与环氧发生开环交联反应，并与酸酐共同固化环氧。所述组分(D)分子中含有至少2个氰氧基的氰酸酯或/和氰酸酯预聚物，能有效提升组合物的玻璃化转变温度，降低介电常数和介质损耗因数，但是其耐湿热性能相对较差，主要原因是残留氰酸酯基团和固化生成的三嗪环结构的在湿热条件下的分解，而用量太少则三嗪环量太少，对于降低介电常数和介质损耗因数效果不明显，用量太多则使得组合物的耐湿热性能显著下降。本发明采用苯乙烯与马来酸酐共聚物与含磷化合物组成复合固化剂，有效的改善了耐湿热性能，同时降低了组合物的介电常数以及介质损耗因数，并且使得玻璃化转变温度较高，其用量最佳以组分(D)与组分(B)SMA之间的重量比为0.5～3∶1为宜，例如0.6∶1、0.8∶1、1∶1、1.2∶1、1.4∶1、1.6∶1、1.8∶1、2∶1、2.2∶1、2.4∶1、2.6∶1或2.8∶1。
优选地，在本发明提供的技术方案的基础上，所述氰酸酯为选自具有结构式(III)或结构式(IV)的氰酸酯或其组合：
Figure PCTCN2014095204-appb-000004
式(III)中，R1为-CH2、
Figure PCTCN2014095204-appb-000005
或
Figure PCTCN2014095204-appb-000006
R2、R3、R4和R5各自独立地为氢原子或者取代或未取代的C1～C4的烷基，R2、R3、R4和R5相同或不同；
Figure PCTCN2014095204-appb-000007
式(IV)中，R6、R7和R8各自独立地为氢原子或者取代或未取代的C1～C4的烷基，R6、R7和R8相同或不同，m2为1～7的任意整数，m2例如为2、3、4、5或6。
即组分(D)可以为选自具有结构式(III)或结构式(IV)的氰酸酯或其组合，或其预聚物，或者氰酸酯和氰酸酯预聚物两者的混合物。
优选地，在本发明提供的技术方案的基础上，所述组分(D)选自2，2-双(4-氰氧基苯基)丙烷、双(4-氰氧基苯基)乙烷、双(3，5-二甲基-4-氰氧基苯基)甲烷、2，2-双(4-氰氧基苯基)-1，1，1，3，3，3-六氟丙烷、α，α′-双(4-氰氧基苯基)-间二异 丙基苯、环戊二烯型氰酸酯、苯酚酚醛型氰酸酯、甲酚酚醛型氰酸酯、2，2-双(4-氰氧基苯基)丙烷预聚物、双(4-氰氧基苯基)乙烷预聚物、双(3，5-二甲基-4-氰氧基苯基)甲烷预聚物、2，2-双(4-氰氧基苯基)-1，1，1，3，3，3-六氟丙烷预聚物、α，α′-双(4-氰氧基苯基)-间二异丙基苯预聚物、环戊二烯型氰酸酯预聚物、苯酚酚醛型氰酸酯预聚物或甲酚酚醛型氰酸酯预聚物中的任意一种或者至少两种的混合物，优选2，2-双(4-氰氧基苯基)丙烷、α，α′-双(4-氰氧基苯基)-间二异丙基苯、双(3，5-二甲基-4-氰氧基苯基)甲烷、2，2-双(4-氰氧基苯基)丙烷预聚物、α，α′-双(4-氰氧基苯基)-间二异丙基苯预聚物或双(3，5-二甲基-4-氰氧基苯基)甲烷预聚物中的任意一种或者至少两种的混合物。
优选地，在本发明提供的技术方案的基础上，所述无卤环氧树脂组合物还包括组分(E)含磷阻燃剂，其用于提高固化后树脂及其制成的覆铜箔层压板的阻燃性能。
优选地，在本发明提供的技术方案的基础上，所述含磷阻燃剂为磷酸酯、苯氧基磷腈化合物或膦菲类及其衍生物中的任意一种或者至少两种的混合物。该含磷阻燃剂以不降低介电常数为佳，含磷阻燃剂优选苯氧基磷腈化合物或/和磷酸脂等，其可根据与萘酚环氧树脂的协同阻燃效果单独或者混合使用。本发明的阻燃剂用量可根据组合物的阻燃情况进行适量辅助性添加，使得组合物的阻燃等级为V0即可，用量太多，则阻燃效果过剩，用量太少，则阻燃效果下降。可选择的无卤阻燃剂有SPB-100，PX-200，PX-202，FR-700，OP-930，OP-935，但并不限于以上选择。
优选地，在本发明提供的技术方案的基础上，所述无卤环氧树脂组合物还包括组分(F)固化促进剂。所述固化促进剂为已知任何可以加快热固性树脂固化速度的促进剂，优选咪唑类化合物、叔胺化合物或季胺化合物中的任意一种 或者至少两种的混合物，进一步优选2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-十一烷基咪唑或苄基二甲胺中的任意一种或者至少两种的混合物，进一步优选2-乙基-4-甲基咪唑。
优选地，在本发明提供的技术方案的基础上，所述(F)固化促进剂的添加量占无卤环氧树脂组合物总重量的0.001～1％，例如0.005％、0.01％、0.05％、0.1％、0.2％、0.3％、0.4％、0.5％、0.6％、0.7％、0.8％或0.9％，优选0.05～0.5％。
优选地，在本发明提供的技术方案的基础上，所述无卤环氧树脂组合物还包括组分(G)填料。填料的加入主要用来调整组合物的一些物性效果，如降低热膨胀系数(CTE)，提高热导率等。填料的混合量可根据想要达到的技术效果进行适量添加，用量增加，则CTE降低，但是组合物的加工性恶化，反之，则CTE较大，但是组合物的加工性较好。
优选地，在本发明提供的技术方案的基础上，所述填料为有机或无机填料。
优选地，在本发明提供的技术方案的基础上，所述无机填料选自结晶型二氧化硅、熔融二氧化硅、球形二氧化硅、空心二氧化硅、玻璃粉、氮化铝、氮化硼、碳化硅、氢氧化铝、二氧化钛、钛酸锶、钛酸钡、氧化铝、硫酸钡、滑石粉、硅酸钙、碳酸钙或云母中的任意一种或者至少两种的混合物。
优选地，在本发明提供的技术方案的基础上，所述有机填料选自聚四氟乙烯粉末、聚苯硫醚或聚醚砜粉末中的任意一种或者至少两种的混合物。
示例性的一种无卤环氧树脂组合物，以有机固形物重量份计，其包含：
(A)100重量份的无卤环氧树脂；
(B)苯乙烯与马来酸酐共聚物作为第一固化剂，以100重量份的无卤环氧 树脂为基准，该苯乙烯与马来酸酐共聚物的含量为50～300重量份；
(C)含磷化合物为第二固化剂，以100重量份的无卤环氧树脂为基准，该含磷化合物的含量为1.0～20重量份，所述含磷化合物是由含有选自H-P＝O、P-H或P-OH基团的至少一种有机磷化合物与至少一种具有化学结构式[K’(Y)a’]a(X-O-R”)b的化合物反应而得；其中，K’是有机基团，Y选自羟基、羧酸、羧酸酯、酸酐、胺、-SH、-SO3H、-CONH2、-NHCOOR1、亚膦酸酯和磷酸酯的官能团；X是亚烃基；R”是氢或具有1-8个碳原子的取代或未取代的烃基；R1是具有1至12个碳原子的取代或未取代的烷基或芳基，且a’、a和b各自独立地为≥1的整数；
(D)氰酸酯或/和氰酸酯预聚物，且组分(D)与组分(B)苯乙烯与马来酸酐共聚物的重量比为0.5～3∶1；
(E)含磷阻燃剂；
(F)固化促进剂；
(G)填料。
示例性的一种无卤环氧树脂组合物，以有机固形物重量份计，其包含：
(A)100重量份的无卤环氧树脂；
(B)苯乙烯与马来酸酐共聚物作为第一固化剂，以100重量份的无卤环氧树脂为基准，该苯乙烯与马来酸酐共聚物的含量为50～300重量份，所述苯乙烯与马来酸酐共聚物的分子结构式为
Figure PCTCN2014095204-appb-000008
其中，m1∶n1＝1∶1、2∶1、3∶1、4∶1、6∶1或8∶1，所述苯乙烯与马来酸酐共聚 物的重均分子量为1300～50000；
(C)含磷化合物为第二固化剂，以100重量份的无卤环氧树脂为基准，该含磷化合物的含量为1.0～20重量份，所述含磷化合物是由含有选自H-P＝O、P-H或P-OH基团的至少一种有机磷化合物与至少一种具有化学结构式[K’(Y)a’]a(X-O-R”)b的化合物反应而得；其中，K’是有机基团，Y选自羟基、羧酸、羧酸酯、酸酐、胺、-SH、-SO3H、-CONH2、-NHCOOR1、亚膦酸酯和磷酸酯的官能团；X是亚烃基；R”是氢或具有1-8个碳原子的取代或未取代的烃基；R1是具有1至12个碳原子的取代或未取代的烷基或芳基，且a’、a和b各自独立地为≥1的整数；
(D)氰酸酯或/和氰酸酯预聚物，且组分(D)与组分(B)苯乙烯与马来酸酐共聚物的重量比为0.5～3∶1；
(E)含磷阻燃剂；
(F)固化促进剂；
(G)填料。
示例性的一种无卤环氧树脂组合物，以有机固形物重量份计，其包含：
(A)100重量份的无卤环氧树脂；
(B)苯乙烯与马来酸酐共聚物作为第一固化剂，以100重量份的无卤环氧树脂为基准，该苯乙烯与马来酸酐共聚物的含量为50～300重量份，所述苯乙烯与马来酸酐共聚物的分子结构式为
Figure PCTCN2014095204-appb-000009
其中，m1∶n1＝1∶1、2∶1、3∶1、4∶1、6∶1或8∶1，所述苯乙烯与马来酸酐共聚 物的重均分子量为1300～50000；
(C)含磷化合物为第二固化剂，以100重量份的无卤环氧树脂为基准，该含磷化合物的含量为1.0～20重量份，所述含磷化合物是由含有选自H-P＝O、P-H或P-OH基团的至少一种有机磷化合物与至少一种具有化学结构式[K’(Y)a’]a(X-O-R”)b的化合物反应而得；其中，K’是有机基团，Y选自羟基、羧酸、羧酸酯、酸酐、胺、-SH、-SO3H、-CONH2、-NHCOOR1、亚膦酸酯和磷酸酯的官能团；X是亚烃基；R”是氢或具有1-8个碳原子的取代或未取代的烃基；R1是具有1至12个碳原子的取代或未取代的烷基或芳基，且a’、a和b各自独立地为≥1的整数；
(D)氰酸酯或/和氰酸酯预聚物，组分(D)与苯乙烯与马来酸酐共聚物的重量比为0.5～3∶1；
所述氰酸酯为选自具有结构式(III)或结构式(IV)的氰酸酯或其组合：
Figure PCTCN2014095204-appb-000010
式(III)中，R1为-CH2、
Figure PCTCN2014095204-appb-000011
或
Figure PCTCN2014095204-appb-000012
R2、R3、R4和R5各自独立地为氢原子或者取代或未取代的C1～C4的烷基；
Figure PCTCN2014095204-appb-000013
式(IV)中，R6、R7和R8各自独立地为氢原子或者取代或未取代的C1～C4的烷基，m2为1～7的任意整数；
(E)含磷阻燃剂；
(F)固化促进剂；
(G)填料。
示例性的一种无卤环氧树脂组合物，以有机固形物重量份计，其包含：
(A)100重量份的无卤环氧树脂，其选自具有如下结构式的萘酚型环氧树脂中的任意一种或者至少两种的混合物：
Figure PCTCN2014095204-appb-000014
(B)苯乙烯与马来酸酐共聚物作为第一固化剂，以100重量份的无卤环氧树脂为基准，该苯乙烯与马来酸酐共聚物的含量为50～300重量份，所述苯乙烯与马来酸酐共聚物的分子结构式为
Figure PCTCN2014095204-appb-000015
其中，m1∶n1＝1∶1、2∶1、3∶1、4∶1、6∶1或8∶1，所述苯乙烯与马来酸酐共聚物的重均分子量为1300～50000；
(C)含磷化合物作为第二固化剂，以100重量份的无卤环氧树脂为基准，该含磷化合物的含量为1.0～20重量份，所述含磷化合物选具有如下结构式：
Figure PCTCN2014095204-appb-000016
(D)氰酸酯或/和氰酸酯预聚物，其选自2，2-双(4-氰氧基苯基)丙烷、α，α′-双(4-氰氧基苯基)-间二异丙基苯、双(3，5-二甲基-4-氰氧基苯基)甲烷、2，2-双(4-氰氧基苯基)丙烷预聚物、α，α′-双(4-氰氧基苯基)-间二异丙基苯预聚物或双(3，5- 二甲基-4-氰氧基苯基)甲烷预聚物中的任意一种或者至少两种的混合物，且组分(D)与组分(B)苯乙烯与马来酸酐共聚物的重量比为0.5～3∶1；
(E)含磷阻燃剂；
(F)固化促进剂，其添加量占无卤环氧树脂组合物总重量的0.001～1％；
(G)填料。
优选地，在本发明提供的技术方案的基础上，以无卤环氧树脂组合物的总重量为100重量％计，所述无卤环氧树脂组合物的磷含量控制在1～5重量％，例如1.3重量％、1.6重量％、2重量％、2.3重量％、2.6重量％、3重量％、3.3重量％、3.6重量％、4重量％、4.3重量％或4.7重量％，氮含量控制在1～5重量％，例如1.3重量％、1.6重量％、2重量％、2.3重量％、2.6重量％、3重量％、3.3重量％、3.6重量％、4重量％、4.3重量％或4.7重量％。磷含量和氮含量太低，无法达到较好的阻燃效果，磷含量和氮含量太高，则吸水性变大，不利于树脂组合物的耐湿热性能的提高。
优选地，在本发明提供的技术方案的基础上，以无卤环氧树脂组合物的总重量为100重量％计，所述无卤环氧树脂组合物的卤素含量控制在0.09重量％以下，例如0.01重量％、0.02重量％、0.03重量％、0.04重量％、0.05重量％、0.06重量％、0.07重量％或0.08重量％。
本发明所述的“包括”，意指其除所述组份外，还可以包括其他组份，这些其他组份赋予所述无卤环氧树脂组合物不同的特性。除此之外，本发明所述的“包括”，还可以替换为封闭式的“为”或“由……组成”。
例如，所述无卤环氧树脂组合物还可以含有各种添加剂，作为具体例，可以举出阻燃剂、抗氧剂、热稳定剂、抗静电剂、紫外线吸收剂、颜料、着色剂或润滑剂等。这些各种添加剂可以单独使用，也可以两种或者两种以上混合使 用。
作为本发明无卤环氧树脂组合物之一的制备方法，可以通过公知的方法配合、搅拌、混合所述的无卤环氧树脂、苯乙烯与马来酸酐共聚物、含磷化合物、氰酸酯或/和氰酸酯预聚物、含磷阻燃剂和固化促进剂，以及各种添加剂，来制备。
本发明的目的之二在于提供一种树脂胶液，其是将如上所述的无卤环氧树脂组合物溶解或分散在溶剂中得到。
作为本发明中的溶剂，没有特别限定，作为具体例，可以举出甲醇、乙醇、丁醇等醇类，乙基溶纤剂、丁基溶纤剂、乙二醇-甲醚、卡必醇、丁基卡必醇等醚类，丙酮、丁酮、甲基乙基甲酮、甲基异丁基甲酮、环己酮等酮类，甲苯、二甲苯、均三甲苯等芳香族烃类，乙氧基乙基乙酸酯、醋酸乙酯等酯类，N，N-二甲基甲酰胺、N，N-二甲基乙酰胺、N-甲基-2-吡咯烷酮等含氮类溶剂。上述溶剂可以单独使用一种，也可以两种或者两种以上混合使用，优选甲苯、二甲苯、均三甲苯等芳香族烃类溶剂与丙酮、丁酮、甲基乙基甲酮、甲基异丁基甲酮、环己酮等酮类熔剂混合使用。所述溶剂的使用量本领域技术人员可以根据自己的经验来选择，使得到的树脂胶液达到适于使用的粘度即可。
在如上所述的无卤环氧树脂组合物溶解或分散在溶剂的过程中，可以添加乳化剂。通过乳化剂进行分散，可以使填料等在胶液中分散均匀。
本发明的目的之三在于提供一种预浸料，其包括增强材料及通过含浸干燥后附着在增强材料上的如上所述的无卤环氧树脂组合物。所述预浸料具有良好介电性能，加工性良好，工艺操作简便，并且具有良好的耐湿热性能。
示例性的本发明预浸料的制备方法为：
将本发明的环氧树脂组合物制成一定浓度的胶液，通过浸渍增强材料，然 后在一定的温度下烘干，除去溶剂并使树脂组合物进行固化，得到预浸料。
所述增强材料为已有技术中公开的增强材料，如玻纤布等。
本发明的目的之四在于提供一种层压板，所述层压板含有至少一张如上所述的预浸料。
本发明的目的之五在于提供一种覆铜箔层压板，所述覆铜箔层压板包括至少一张叠合的如上所述的预浸料及压覆在叠合后的预浸料的一侧或两侧的铜箔。
本发明的目的之六在于提供一种高频电路基板，所述高频电路基板包括至少一张叠合的如上所述的预浸料及压覆在叠合后的预浸料的两侧的铜箔。其具有优异的介电性能、高的玻璃化转变温度，同时具有稳定的耐湿热性能，并且具备无卤特性。
示例性的本发明的覆铜箔层压板的制备方法为：将上述所述的预浸料一张或多张按照一定顺序叠合在一起，将铜箔分别压覆在相互叠合的预浸料一侧或两侧，在热压机中固化制得覆铜箔层压板，其固化温度为150～250℃，固化压力为25～60kg/cm2。
与已有技术相比，本发明具有如下有益效果：
①本发明的无卤环氧树脂组合物采用苯乙烯与马来酸酐共聚物、含磷化合物作为复合固化剂，同时搭配氰酸酯或/和氰酸酯预聚物，既发挥了氰酸酯玻璃化转变温度高、介电性能好的优势，又很好地克服了其耐湿热性差的缺陷；②本发明的环氧树脂组合物采用苯乙烯与马来酸酐共聚物、含磷化合物作为复合固化剂，充分发挥了苯乙烯与马来酸酐在和环氧反应基本不生成极性基团，从而介电性能较为优异的优势，又采用了氰酸酯作为改性剂，在原本较为优异的介电性能的基础上有效的进一步提升了介电性能，而采用含磷化合物作为共固 化剂，有效的改善了苯乙烯与马来酸酐与氰酸酯共混带来的耐湿热性能较差的缺点；③本发明充分利用苯乙烯与马来酸酐共聚物与含磷化合物的复合固化特性，搭配介电性能良好的氰酸酯，并利用萘酚型环氧树脂、含磷阻燃剂等的协同特性提高阻燃性能，卤素含量在0.09％以下，从而达到环保之功效；④本发明的使用上述无卤环氧树脂组合物制备的预浸料及其覆铜箔层压板，具有优异的介电性能、高的玻璃化转变温度，同时具有稳定的耐湿热性能，并且具备无卤特性。
具体实施方式
下面通过具体实施方式来进一步说明本发明的技术方案。
本发明实施例和比较例详细说明如下，但本发明并非局限在实施例范围。下文中无特别说明，其数值代表重量份，其“％”代表“重量％”。
A：环氧树脂
A1：NC-7700L，萘酚型酚醛环氧树脂(日本化药)；
A2：EPR627MEK80，双酚A型多官能环氧树脂(迈图化工)；A3：NPEP-204，DOPO改性邻甲酚酚醛环氧树脂(台湾南亚)；
B：第一固化剂
SMA EF-40，苯乙烯与马来酸酐共聚物(美国sartomer)；
C：第二固化剂
C1：XZ-92741，含磷化合物(美国DOW化学)，DOPO取代含磷酚醛；
C2：D125，苯并噁嗪(四川东材科技集团股份有限公司)；
D：氰酸酯
D1：HF-3S，二环戊二烯类氰酸酯(上海慧峰)；
D2：PT-30，苯酚甲醛型氰酸酯(LONZA)；
E：含磷阻燃剂
E1：SPB-100(大琢化学)；
E2：PMP(聚甲基磷酸1，3-伸苯基酯)；
E3：PX200(Daihachi Chemical)；
F：固化促进剂
F1：2E4MZ，2-乙基-4-甲基咪唑(日本四国化成)；
F2：辛酸锌；
G：填料
SFP30MHE，球形硅微粉(日本电气化学)。
表1.各实施例的配方组成及其物性数据
Figure PCTCN2014095204-appb-000017
表2各比较例的配方组成及其物性数据
组分名称 比较例1 比较例2 比较例3
A1 0 0 100
A2 0 0 0
A3 100 100 0
B 15 80 150
C1 0 0 0
C2 0 150 0
D1 150 150 100
D2 0 0 0
E1 0 50 0
E2 40 0 0
E3 0 0 50
F1 适量 适量 适量
F2 适量 适量 适量
G 15 20 20
玻璃化转变温度(Tg，℃) 170 197 199
介电常数，1GHz 4.0 3.7 3.7
介电损耗，1GHz 0.007 0.004 0.004
耐湿热性 0/5 0/5 0/5
钻孔磨损 △ x ○
阻燃性 V-0 V-0 V-0
卤素含量，％ 0.03 0.03 0.03
以上特性的测试方法如下：
(1)玻璃化转变温度(Tg)：使用DMA测试，按照IPC-TM-6502.4.24所规定的DMA测试方法进行测定。
(2)介电常数和介电损耗因数：按照SPDR方法测试。
(3)耐湿热性评价：将覆铜板表面的铜箔蚀刻后，将基板放置压力锅中，在120℃、105KPa条件下处理2h；后浸渍在288℃的锡炉中，当基板分层爆板时记录相应时间；当基板在锡炉中超过5min还没出现气泡或分层时即可结束评价，共平行测试3片。
(4)阻燃性评价：依照UL94法规定。
(5)卤素含量评价：按照JPCA-ES-01-2002《无卤型覆铜板试验方法》测定，采用氧瓶燃烧法和离子色谱法测定覆铜箔层压板的卤素含量。
从表1和表2的物性数据可知，根据本发明可达到低介电常数、低介电损耗因数、高玻璃化转变温度、耐燃烧性，并且可以达到耐湿热性能良好之功效，同时板材的加工性佳，卤素含量在JPCA无卤标准要求范围内能达到难燃性试验UL94中的V-0标准；本发明充分利用苯乙烯与马来酸酐共聚物与含磷化合物的复合固化具有良好耐湿热性能的特性，搭配介电性能良好的氰酸酯以及具有较好工艺成型性能的具有苯环或稠苯结构的无卤环氧树脂，通过添加适当的含磷阻燃剂等，使得组合物具有良好的耐湿热性能和良好的介电性能，选用含有苯环结构的无卤环氧树脂时，组合物在阻燃性能上有一定不足，而通过搭配稠苯结构的无卤环氧树脂，组合物在达到阻燃V-0的同时，卤素含量在0.09％以下，从而达到环保之功效。比较例1的耐湿热效果较差，比较例2的耐湿热效果较差，同时钻孔磨损性较差，而比较例3引入了缩合磷酸酯PX200，体系具有良好的介电性能，但是由于体系中存在的氰酸酯以及苯乙烯与马来酸酐共聚物并没有得到完全的共固化，使得体系的耐湿热性能仍然不佳。
由以上分析可知，用本发明树脂制作的覆铜箔层压板具有良好的耐湿热型能和加工性能，还具有十分优异的高频介电性能，可以满足无卤高频高速领域对于印刷电路板的要求。
申请人声明，本发明通过上述实施例来说明本发明的详细方法，但本发明并不局限于上述详细方法，即不意味着本发明必须依赖上述详细方法才能实施。所属技术领域的技术人员应该明了，对本发明的任何改进，对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等，均落在本发明的保护范围和公开范围之内。

Claims (28)

  1. 一种无卤环氧树脂组合物，其特征在于，以有机固形物重量份计，其包含：
    (A)100重量份的无卤环氧树脂；
    (B)苯乙烯与马来酸酐共聚物作为第一固化剂，以100重量份的无卤环氧树脂为基准，该苯乙烯与马来酸酐共聚物的含量为50～300重量份；
    (C)含磷化合物为第二固化剂，以100重量份的无卤环氧树脂为基准，该含磷化合物的含量为1.0～20重量份，所述含磷化合物是由含有选自H-P＝O、P-H或P-OH基团的至少一种有机磷化合物与至少一种具有化学结构式[K’(Y)a，]a(X-O-R”)b的化合物反应而得；其中，K’是有机基团，Y选自羟基、羧酸、羧酸酯、酸酐、胺、-SH、-SO3H、-CONH2、-NHCOOR1、亚膦酸酯和磷酸酯的官能团；X是亚烃基；R”是氢或具有1-8个碳原子的取代或未取代的烃基；R1是具有1至12个碳原子的取代或未取代的烷基或芳基，且a’、a和b各自独立地为≥1的整数；
    (D)氰酸酯或/和氰酸酯预聚物，且组分(D)与组分(B)苯乙烯与马来酸酐共聚物的重量比为0.5～3∶1。
  2. 如权利要求1所述的无卤环氧树脂组合物，其特征在于，所述无卤环氧树脂是具有苯环或稠苯结构的环氧树脂。
  3. 如权利要求2所述的无卤环氧树脂组合物，其特征在于，所述具有苯环或稠苯结构的环氧树脂为联苯型环氧树脂、蒽醌型环氧树脂或萘酚型环氧树脂中的任意一种或者至少两种的混合物。
  4. 如权利要求3所述的无卤环氧树脂组合物，其特征在于，所述具有苯环或稠苯结构的环氧树脂为萘酚型环氧树脂。
  5. 如权利要求4所述的无卤环氧树脂组合物，其特征在于，所述具有苯环 或稠苯结构的环氧树脂为具有如下结构式的萘酚型环氧树脂中的任意一种或者至少两种的混合物：
    Figure PCTCN2014095204-appb-100001
    其中，m、n各自独立地为1或2，q为1～10的整数，R为H或取代或未取代的C1～C5的烷基。
  6. 如权利要求1所述的无卤环氧树脂组合物，其特征在于，以100重量份的无卤环氧树脂为基准，所述苯乙烯与马来酸酐共聚物的含量为100～200重量份。
  7. 如权利要求1所述的无卤环氧树脂组合物，其特征在于，所述苯乙烯与马来酸酐共聚物具有如下结构式：
    Figure PCTCN2014095204-appb-100002
    其中，m1∶n1＝1∶1、2∶1、3∶1、4∶1、6∶1或8∶1。
  8. 如权利要求1所述的无卤环氧树脂组合物，其特征在于，所述苯乙烯与马来酸酐共聚物的重均分子量为1300～50000。
  9. 如权利要求1所述的无卤环氧树脂组合物，其特征在于，所述含磷化合物具有如下结构式：
    Figure PCTCN2014095204-appb-100003
  10. 如权利要求1或2所述的无卤环氧树脂组合物，其特征在于，所述氰酸酯为选自具有结构式(III)或结构式(IV)的氰酸酯或其组合：
    Figure PCTCN2014095204-appb-100004
    式(III)中，R1为-CH2、
    Figure PCTCN2014095204-appb-100005
    Figure PCTCN2014095204-appb-100006
    R2、R3、R4和R5各自独立地为氢原子或者取代或未取代的C1～C4的烷基；
    Figure PCTCN2014095204-appb-100007
    式(IV)中，R6、R7和R8各自独立地为氢原子或者取代或未取代的C1～C4的烷基，m2为1～7的任意整数。
  11. 如权利要求1或2所述的无卤环氧树脂组合物，其特征在于，所述组分(D)选自2，2-双(4-氰氧基苯基)丙烷、双(4-氰氧基苯基)乙烷、双(3，5-二甲基-4-氰氧基苯基)甲烷、2，2-双(4-氰氧基苯基)-1，1，1，3，3，3-六氟丙烷、α，α′-双(4-氰氧基苯基)-间二异丙基苯、环戊二烯型氰酸酯、苯酚酚醛型氰酸酯、甲酚酚醛型氰酸酯、2，2-双(4-氰氧基苯基)丙烷预聚物、双(4-氰氧基苯基)乙烷预聚物、双(3，5-二甲基-4-氰氧基苯基)甲烷预聚物、2，2-双(4-氰氧基苯基)-1，1，1，3，3，3-六氟丙烷预聚物、α，α′-双(4-氰氧基苯基)-间二异丙基苯预聚物、环戊二烯型氰酸酯预聚物、苯酚酚醛型氰酸酯预聚物或甲酚酚醛型氰酸酯预聚物中的任意一种或者至少两种的混合物。
  12. 如权利要求11所述的无卤环氧树脂组合物，其特征在于，所述组分(D)选自2，2-双(4-氰氧基苯基)丙烷、α，α′-双(4-氰氧基苯基)-间二异丙基苯、双(3，5-二甲基-4-氰氧基苯基)甲烷、2，2-双(4-氰氧基苯基)丙烷预聚物、α，α′-双(4-氰氧基苯基)-间二异丙基苯预聚物或双(3，5-二甲基-4-氰氧基苯基)甲烷预聚物中的任意一种或者至少两种的混合物。
  13. 如权利要求1-3之一所述的无卤环氧树脂组合物，其特征在于，所述无卤环氧树脂组合物还包括组分(E)含磷阻燃剂。
  14. 如权利要求13所述的无卤环氧树脂组合物，其特征在于，所述含磷阻 燃剂为磷酸酯、苯氧基磷腈化合物或膦菲类及其衍生物中的任意一种或者至少两种的混合物。
  15. 如权利要求1-3之一所述的无卤环氧树脂组合物，其特征在于，所述无卤环氧树脂组合物还包括组分(F)固化促进剂。
  16. 如权利要求15所述的无卤环氧树脂组合物，其特征在于，所述固化促进剂为咪唑类化合物、叔胺化合物或季胺化合物中的任意一种或者至少两种的混合物。
  17. 如权利要求15所述的无卤环氧树脂组合物，其特征在于，所述固化促进剂的添加量占无卤环氧树脂组合物总重量的0.001～1％。
  18. 如权利要求1-4之一所述的无卤环氧树脂组合物，其特征在于，所述无卤环氧树脂组合物还包括组分(G)填料。
  19. 如权利要求18所述的无卤环氧树脂组合物，其特征在于，所述填料为有机或无机填料。
  20. 如权利要求19所述的无卤环氧树脂组合物，其特征在于，所述无机填料选自结晶型二氧化硅、熔融二氧化硅、球形二氧化硅、空心二氧化硅、玻璃粉、氮化铝、氮化硼、碳化硅、氢氧化铝、二氧化钛、钛酸锶、钛酸钡、氧化铝、硫酸钡、滑石粉、硅酸钙、碳酸钙或云母中的任意一种或者至少两种的混合物。
  21. 如权利要求19所述的无卤环氧树脂组合物，其特征在于，所述有机填料选自聚四氟乙烯粉末、聚苯硫醚或聚醚砜粉末中的任意一种或者至少两种的混合物。
  22. 如权利要求1-3之一所述的无卤环氧树脂组合物，其特征在于，所述无卤环氧树脂组合物的磷含量为1～5重量％，氮含量为1～5重量％。
  23. 如权利要求1-3之一所述的无卤环氧树脂组合物，其特征在于，所述无卤环氧树脂组合物的卤素含量为0.09重量％以下。
  24. 一种树脂胶液，其特征在于，其是将权利要求1-23之一所述的无卤环氧树脂组合物溶解或分散在溶剂中得到。
  25. 一种预浸料，其特征在于，其包括增强材料及通过含浸干燥后附着在增强材料上的权利要求1-23之一所述的无卤环氧树脂组合物。
  26. 一种层压板，其特征在于，所述层压板含有至少一张权利要求25所述的预浸料。
  27. 一种覆铜箔层压板，其特征在于，所述覆铜箔层压板包括至少一张叠合的权利要求25所述的预浸料及压覆在叠合后的预浸料的一侧或两侧的铜箔。
  28. 一种高频电路基板，其特征在于，所述高频电路基板包括至少一张叠合的权利要求25所述的预浸料及压覆在叠合后的预浸料的两侧的铜箔。
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