JPS6226648B2 - - Google Patents

Info

Publication number
JPS6226648B2
JPS6226648B2 JP1037683A JP1037683A JPS6226648B2 JP S6226648 B2 JPS6226648 B2 JP S6226648B2 JP 1037683 A JP1037683 A JP 1037683A JP 1037683 A JP1037683 A JP 1037683A JP S6226648 B2 JPS6226648 B2 JP S6226648B2
Authority
JP
Japan
Prior art keywords
epoxy resin
laminate
weight
average particle
flame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1037683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59136319A (ja
Inventor
Koji Yokomichi
Susumu Suda
Nobuaki Komasa
Takeo Moro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority to JP1037683A priority Critical patent/JPS59136319A/ja
Publication of JPS59136319A publication Critical patent/JPS59136319A/ja
Publication of JPS6226648B2 publication Critical patent/JPS6226648B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP1037683A 1983-01-25 1983-01-25 難燃性基板エポキシ樹脂組成物 Granted JPS59136319A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1037683A JPS59136319A (ja) 1983-01-25 1983-01-25 難燃性基板エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1037683A JPS59136319A (ja) 1983-01-25 1983-01-25 難燃性基板エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS59136319A JPS59136319A (ja) 1984-08-04
JPS6226648B2 true JPS6226648B2 (enrdf_load_stackoverflow) 1987-06-10

Family

ID=11748409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1037683A Granted JPS59136319A (ja) 1983-01-25 1983-01-25 難燃性基板エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS59136319A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59170115A (ja) * 1983-03-17 1984-09-26 Kanegafuchi Chem Ind Co Ltd 難燃性液状エポキシ樹脂組成物およびそれを用いる電気用積層板の製造法
JPH0657825B2 (ja) * 1985-12-27 1994-08-03 三井東圧化学株式会社 フレキシブル印刷回路基板用難燃性接着剤組成物
JPH11217553A (ja) * 1998-02-05 1999-08-10 Minnesota Mining & Mfg Co <3M> 接着剤組成物及びその前駆体
EP1650247A1 (en) * 2004-10-21 2006-04-26 Resolution Research Belgium S.A. Amines-epoxy compositions with high chemical resistance properties

Also Published As

Publication number Publication date
JPS59136319A (ja) 1984-08-04

Similar Documents

Publication Publication Date Title
US10400099B2 (en) Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same
KR101144566B1 (ko) 에폭시 수지 조성물, 그 에폭시 수지 조성물을 이용한 프리프레그, 금속 클래드 적층판, 및 프린트 배선판
TWI532784B (zh) A halogen-free resin composition and use thereof
CN103992622B (zh) 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
WO2017092482A1 (zh) 无卤环氧树脂组合物以及含有它的预浸料、层压板和印制电路板
WO2012150661A1 (ja) 熱硬化性樹脂組成物、プリプレグ、積層板、金属箔張積層板、及び回路基板
WO2015101232A1 (zh) 一种无卤环氧树脂组合物及其用途
JPH073053A (ja) 改善されたはんだ付け適性及び耐溶剤性をもつ電気積層板用の変性ポリフェニレンオキシド樹脂系の製造法
EP2952535B1 (en) Halogen-free resin composition, and prepreg and laminate for printed circuits using same
TW201823346A (zh) 一種含有苯並噁嗪的樹脂組合物的製備方法及由其製成的預浸料和層壓板
WO2015101233A1 (zh) 一种无卤环氧树脂组合物及其用途
JP3300426B2 (ja) 熱硬化性ポリフェニレンオキシド／エポキシ積層体の製造のための無溶剤高温配合法
US4529790A (en) Epoxy resin composition
CN105801814A (zh) 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
US20140039094A1 (en) Epoxy resin composition, and prepreg and printed circuit board using the same
JPS6226648B2 (enrdf_load_stackoverflow)
JP5712488B2 (ja) 絶縁性樹脂フィルム及びそれを用いた積層板、配線板
WO2015188310A1 (zh) 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
JPH0722718A (ja) 印刷配線板用エポキシ樹脂組成物、印刷配線板用プリプレグの製造方法及びコンポジット積層板の製造方法
JPS6296521A (ja) エポキシ樹脂組成物
EP0045957A1 (en) Flame-retarded curable resins
JP2001253951A (ja) 難燃性樹脂組成物を用いた積層板
JP3326862B2 (ja) プリプレグの製造方法
JPH07316267A (ja) エポキシ樹脂組成物、プリプレグ及び積層板
JPH0275676A (ja) 熱硬化性エポキシ樹脂ワニス