JPS59136319A - 難燃性基板エポキシ樹脂組成物 - Google Patents

難燃性基板エポキシ樹脂組成物

Info

Publication number
JPS59136319A
JPS59136319A JP1037683A JP1037683A JPS59136319A JP S59136319 A JPS59136319 A JP S59136319A JP 1037683 A JP1037683 A JP 1037683A JP 1037683 A JP1037683 A JP 1037683A JP S59136319 A JPS59136319 A JP S59136319A
Authority
JP
Japan
Prior art keywords
epoxy resin
flame retardant
average particle
laminate
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1037683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6226648B2 (enrdf_load_stackoverflow
Inventor
Koji Yokomichi
横道　孝二
Susumu Suda
進 須田
Nobuaki Komasa
向當　宣昭
Takeo Moro
健夫 毛呂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Priority to JP1037683A priority Critical patent/JPS59136319A/ja
Publication of JPS59136319A publication Critical patent/JPS59136319A/ja
Publication of JPS6226648B2 publication Critical patent/JPS6226648B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP1037683A 1983-01-25 1983-01-25 難燃性基板エポキシ樹脂組成物 Granted JPS59136319A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1037683A JPS59136319A (ja) 1983-01-25 1983-01-25 難燃性基板エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1037683A JPS59136319A (ja) 1983-01-25 1983-01-25 難燃性基板エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS59136319A true JPS59136319A (ja) 1984-08-04
JPS6226648B2 JPS6226648B2 (enrdf_load_stackoverflow) 1987-06-10

Family

ID=11748409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1037683A Granted JPS59136319A (ja) 1983-01-25 1983-01-25 難燃性基板エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS59136319A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59170115A (ja) * 1983-03-17 1984-09-26 Kanegafuchi Chem Ind Co Ltd 難燃性液状エポキシ樹脂組成物およびそれを用いる電気用積層板の製造法
JPS62153373A (ja) * 1985-12-27 1987-07-08 Mitsui Toatsu Chem Inc フレキシブル印刷回路基板用難燃性接着剤組成物
WO1999040150A1 (en) * 1998-02-05 1999-08-12 Minnesota Mining And Manufacturing Company Adhesive composition and precursor thereof
WO2006045407A3 (en) * 2004-10-21 2007-08-16 Hexion Specialty Chemicals Res Amines-epoxy compositions with high chemical resistance properties

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59170115A (ja) * 1983-03-17 1984-09-26 Kanegafuchi Chem Ind Co Ltd 難燃性液状エポキシ樹脂組成物およびそれを用いる電気用積層板の製造法
JPS62153373A (ja) * 1985-12-27 1987-07-08 Mitsui Toatsu Chem Inc フレキシブル印刷回路基板用難燃性接着剤組成物
WO1999040150A1 (en) * 1998-02-05 1999-08-12 Minnesota Mining And Manufacturing Company Adhesive composition and precursor thereof
WO2006045407A3 (en) * 2004-10-21 2007-08-16 Hexion Specialty Chemicals Res Amines-epoxy compositions with high chemical resistance properties

Also Published As

Publication number Publication date
JPS6226648B2 (enrdf_load_stackoverflow) 1987-06-10

Similar Documents

Publication Publication Date Title
US10400099B2 (en) Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same
TWI532784B (zh) A halogen-free resin composition and use thereof
CN105358624B (zh) 树脂组合物、预浸料和层压板
CN103547634B (zh) 热固化性树脂组合物、预浸料、层压板、覆金属箔层压板以及电路基板
CN103992622B (zh) 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
KR20100044231A (ko) 에폭시 수지 조성물, 그 에폭시 수지 조성물을 이용한 프리프레그, 금속 클래드 적층판, 및 프린트 배선판
EP2896653B1 (en) Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the composition
CN102093672A (zh) 一种无卤无磷阻燃环氧树脂类组合物及其在粘结片和覆铜板中的应用
WO2015101233A1 (zh) 一种无卤环氧树脂组合物及其用途
CN105131597A (zh) 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
WO2019082698A1 (ja) 熱硬化性樹脂組成物、プリプレグ、金属張積層板、プリント配線板、樹脂付きフィルム及び樹脂付き金属箔
CN105801814A (zh) 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
CN105802128A (zh) 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
US20140039094A1 (en) Epoxy resin composition, and prepreg and printed circuit board using the same
US20140349120A1 (en) Epoxy Resin Composition and High Frequency Circuit Board Manufactured by Using the Same
JPS59136319A (ja) 難燃性基板エポキシ樹脂組成物
JP5712488B2 (ja) 絶縁性樹脂フィルム及びそれを用いた積層板、配線板
WO2015188310A1 (zh) 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
CN102838842A (zh) 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板
JPS6296521A (ja) エポキシ樹脂組成物
JP2005002227A (ja) 積層板用樹脂組成物、有機基材プリプレグ、積層板及びプリント配線板
JP5779962B2 (ja) パッケージ基板用樹脂組成物並びにこれを用いたプリプレグ及び積層板
KR100765898B1 (ko) 인쇄배선판용 수지 조성물, 프리프레그 및 이를 이용한적층판
EP3040356B1 (en) Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same
JPS60260618A (ja) 難燃性エポキシ樹脂組成物