JPH01171822A - 樹脂ベースプリント基板用離型材 - Google Patents
樹脂ベースプリント基板用離型材Info
- Publication number
- JPH01171822A JPH01171822A JP33066387A JP33066387A JPH01171822A JP H01171822 A JPH01171822 A JP H01171822A JP 33066387 A JP33066387 A JP 33066387A JP 33066387 A JP33066387 A JP 33066387A JP H01171822 A JPH01171822 A JP H01171822A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- agent
- coating agent
- aluminum foil
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 32
- 229920005989 resin Polymers 0.000 title claims abstract description 29
- 239000011347 resin Substances 0.000 title claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 21
- 239000011888 foil Substances 0.000 claims abstract description 19
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- 238000007788 roughening Methods 0.000 claims abstract description 10
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 abstract description 10
- 230000003068 static effect Effects 0.000 abstract description 4
- 238000002845 discoloration Methods 0.000 abstract description 3
- 239000004744 fabric Substances 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 125000003700 epoxy group Chemical group 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- HEFNNWSXXWATRW-UHFFFAOYSA-N Ibuprofen Chemical compound CC(C)CC1=CC=C(C(C)C(O)=O)C=C1 HEFNNWSXXWATRW-UHFFFAOYSA-N 0.000 description 1
- LFYJSSARVMHQJB-QIXNEVBVSA-N bakuchiol Chemical compound CC(C)=CCC[C@@](C)(C=C)\C=C\C1=CC=C(O)C=C1 LFYJSSARVMHQJB-QIXNEVBVSA-N 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Paints Or Removers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33066387A JPH01171822A (ja) | 1987-12-26 | 1987-12-26 | 樹脂ベースプリント基板用離型材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33066387A JPH01171822A (ja) | 1987-12-26 | 1987-12-26 | 樹脂ベースプリント基板用離型材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01171822A true JPH01171822A (ja) | 1989-07-06 |
| JPH049B2 JPH049B2 (OSRAM) | 1992-01-06 |
Family
ID=18235194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33066387A Granted JPH01171822A (ja) | 1987-12-26 | 1987-12-26 | 樹脂ベースプリント基板用離型材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171822A (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04189123A (ja) * | 1990-11-22 | 1992-07-07 | Sankyo Kasei Kk | ホットプレスによる熱可塑性プラスチック板の艶出し方法 |
| KR20020035417A (ko) * | 2000-11-06 | 2002-05-11 | 디에터 백하우스 | 인쇄회로 기판의 제조에 사용되는 경화 알루미늄 합금 |
-
1987
- 1987-12-26 JP JP33066387A patent/JPH01171822A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04189123A (ja) * | 1990-11-22 | 1992-07-07 | Sankyo Kasei Kk | ホットプレスによる熱可塑性プラスチック板の艶出し方法 |
| KR20020035417A (ko) * | 2000-11-06 | 2002-05-11 | 디에터 백하우스 | 인쇄회로 기판의 제조에 사용되는 경화 알루미늄 합금 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH049B2 (OSRAM) | 1992-01-06 |
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