JPH049B2 - - Google Patents

Info

Publication number
JPH049B2
JPH049B2 JP33066387A JP33066387A JPH049B2 JP H049 B2 JPH049 B2 JP H049B2 JP 33066387 A JP33066387 A JP 33066387A JP 33066387 A JP33066387 A JP 33066387A JP H049 B2 JPH049 B2 JP H049B2
Authority
JP
Japan
Prior art keywords
resin
printed circuit
mold release
release material
based printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP33066387A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01171822A (ja
Inventor
Naomiki Sato
Shigeo Ono
Norio Gunji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUN ALUMINIUM IND
Original Assignee
SUN ALUMINIUM IND
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUN ALUMINIUM IND filed Critical SUN ALUMINIUM IND
Priority to JP33066387A priority Critical patent/JPH01171822A/ja
Publication of JPH01171822A publication Critical patent/JPH01171822A/ja
Publication of JPH049B2 publication Critical patent/JPH049B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
JP33066387A 1987-12-26 1987-12-26 樹脂ベースプリント基板用離型材 Granted JPH01171822A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33066387A JPH01171822A (ja) 1987-12-26 1987-12-26 樹脂ベースプリント基板用離型材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33066387A JPH01171822A (ja) 1987-12-26 1987-12-26 樹脂ベースプリント基板用離型材

Publications (2)

Publication Number Publication Date
JPH01171822A JPH01171822A (ja) 1989-07-06
JPH049B2 true JPH049B2 (OSRAM) 1992-01-06

Family

ID=18235194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33066387A Granted JPH01171822A (ja) 1987-12-26 1987-12-26 樹脂ベースプリント基板用離型材

Country Status (1)

Country Link
JP (1) JPH01171822A (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745176B2 (ja) * 1990-11-22 1995-05-17 三協化成株式会社 ホットプレスによる熱可塑性プラスチック板の艶出し方法
CA2330162A1 (en) * 2000-11-06 2002-05-06 Copper To Copper North America, Llc Hardened aluminum alloy for use in the manufacture of printed circuit boards

Also Published As

Publication number Publication date
JPH01171822A (ja) 1989-07-06

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