JPH0113222B2 - - Google Patents

Info

Publication number
JPH0113222B2
JPH0113222B2 JP53064434A JP6443478A JPH0113222B2 JP H0113222 B2 JPH0113222 B2 JP H0113222B2 JP 53064434 A JP53064434 A JP 53064434A JP 6443478 A JP6443478 A JP 6443478A JP H0113222 B2 JPH0113222 B2 JP H0113222B2
Authority
JP
Japan
Prior art keywords
basic circuit
cells
cell
circuit
grid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53064434A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54116186A (en
Inventor
Jei Zashio Jon
Shii Rai Hangu
Toshishige Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of JPS54116186A publication Critical patent/JPS54116186A/ja
Publication of JPH0113222B2 publication Critical patent/JPH0113222B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11803—Masterslice integrated circuits using field effect technology
    • H01L27/11807—CMOS gate arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP6443478A 1977-05-31 1978-05-31 Integrated circuit and method of fabricating same Granted JPS54116186A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80190777A 1977-05-31 1977-05-31
US84747877A 1977-11-01 1977-11-01

Publications (2)

Publication Number Publication Date
JPS54116186A JPS54116186A (en) 1979-09-10
JPH0113222B2 true JPH0113222B2 (fr) 1989-03-03

Family

ID=27122394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6443478A Granted JPS54116186A (en) 1977-05-31 1978-05-31 Integrated circuit and method of fabricating same

Country Status (6)

Country Link
JP (1) JPS54116186A (fr)
CA (1) CA1106980A (fr)
DE (1) DE2823555A1 (fr)
FR (1) FR2393427A1 (fr)
GB (1) GB1604550A (fr)
NL (1) NL185431C (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4295149A (en) * 1978-12-29 1981-10-13 International Business Machines Corporation Master image chip organization technique or method
FR2495834A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif a circuits integres de haute densite
US4377849A (en) * 1980-12-29 1983-03-22 International Business Machines Corporation Macro assembler process for automated circuit design
JPS5832445A (ja) * 1981-08-20 1983-02-25 Nec Corp 集積回路装置及びその製造方法
JPS5857749A (ja) * 1981-10-01 1983-04-06 Seiko Epson Corp 半導体装置
JPS5890758A (ja) * 1981-11-25 1983-05-30 Mitsubishi Electric Corp 相補形集積回路装置
JPS58111347A (ja) * 1981-12-24 1983-07-02 Matsushita Electric Ind Co Ltd 半導体装置
JPH0669142B2 (ja) * 1983-04-15 1994-08-31 株式会社日立製作所 半導体集積回路装置
US4737836A (en) * 1983-12-30 1988-04-12 International Business Machines Corporation VLSI integrated circuit having parallel bonding areas
JPH0758761B2 (ja) * 1983-12-30 1995-06-21 インターナショナル・ビジネス・マシーンズ・コーポレーション 半導体集積回路チップ
KR910005605B1 (en) * 1987-06-08 1991-07-31 Fujitsu Ltd Master-slice type semiconductor device imbeded multi gate
JP5552775B2 (ja) 2009-08-28 2014-07-16 ソニー株式会社 半導体集積回路
JP7004038B2 (ja) * 2020-07-28 2022-01-21 ソニーグループ株式会社 半導体集積回路

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50134385A (fr) * 1974-04-09 1975-10-24
JPS5314469B2 (fr) * 1974-05-17 1978-05-17

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983619A (en) * 1968-01-26 1976-10-05 Hitachi, Ltd. Large scale integrated circuit array of unit cells and method of manufacturing same
JPS492796B1 (fr) * 1969-02-28 1974-01-22
NL176029C (nl) * 1973-02-01 1985-02-01 Philips Nv Geintegreerde logische schakeling met komplementaire transistoren.
GB1440512A (en) * 1973-04-30 1976-06-23 Rca Corp Universal array using complementary transistors
CA1024661A (fr) * 1974-06-26 1978-01-17 International Business Machines Corporation Arrangement cablable de pastilles sur circuit integre planaire
US3999214A (en) * 1974-06-26 1976-12-21 Ibm Corporation Wireable planar integrated circuit chip structure
JPS5816176Y2 (ja) * 1976-07-16 1983-04-01 三洋電機株式会社 大規模集積回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50134385A (fr) * 1974-04-09 1975-10-24
JPS5314469B2 (fr) * 1974-05-17 1978-05-17

Also Published As

Publication number Publication date
FR2393427B1 (fr) 1983-09-09
GB1604550A (en) 1981-12-09
CA1106980A (fr) 1981-08-11
NL7805833A (nl) 1978-12-04
FR2393427A1 (fr) 1978-12-29
JPS54116186A (en) 1979-09-10
NL185431B (nl) 1989-11-01
NL185431C (nl) 1990-04-02
DE2823555A1 (de) 1978-12-07

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