JP7797104B2 - 基板搬送装置、基板搬送方法、および基板処理システム - Google Patents

基板搬送装置、基板搬送方法、および基板処理システム

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Publication number
JP7797104B2
JP7797104B2 JP2021002579A JP2021002579A JP7797104B2 JP 7797104 B2 JP7797104 B2 JP 7797104B2 JP 2021002579 A JP2021002579 A JP 2021002579A JP 2021002579 A JP2021002579 A JP 2021002579A JP 7797104 B2 JP7797104 B2 JP 7797104B2
Authority
JP
Japan
Prior art keywords
substrate
processing chamber
transfer
transport
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021002579A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022107898A (ja
JP2022107898A5 (https=
Inventor
達夫 波多野
直樹 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2021002579A priority Critical patent/JP7797104B2/ja
Priority to KR1020210190678A priority patent/KR102652598B1/ko
Priority to TW110149399A priority patent/TWI890911B/zh
Priority to CN202210002402.XA priority patent/CN114765121B/zh
Priority to US17/573,387 priority patent/US12183612B2/en
Publication of JP2022107898A publication Critical patent/JP2022107898A/ja
Publication of JP2022107898A5 publication Critical patent/JP2022107898A5/ja
Application granted granted Critical
Publication of JP7797104B2 publication Critical patent/JP7797104B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
    • H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3204—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K2201/00—Specific aspects not provided for in the other groups of this subclass relating to the magnetic circuits
    • H02K2201/18—Machines moving with multiple degrees of freedom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Mechanical Conveyors (AREA)
JP2021002579A 2021-01-12 2021-01-12 基板搬送装置、基板搬送方法、および基板処理システム Active JP7797104B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021002579A JP7797104B2 (ja) 2021-01-12 2021-01-12 基板搬送装置、基板搬送方法、および基板処理システム
KR1020210190678A KR102652598B1 (ko) 2021-01-12 2021-12-29 기판 반송 장치, 기판 반송 방법, 및 기판 처리 시스템
TW110149399A TWI890911B (zh) 2021-01-12 2021-12-29 基板搬送裝置、基板搬送方法、及基板處理系統
CN202210002402.XA CN114765121B (zh) 2021-01-12 2022-01-04 基板搬送装置、基板搬送方法以及基板处理系统
US17/573,387 US12183612B2 (en) 2021-01-12 2022-01-11 Substrate transfer apparatus, substrate transfer method, and substrate processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021002579A JP7797104B2 (ja) 2021-01-12 2021-01-12 基板搬送装置、基板搬送方法、および基板処理システム

Publications (3)

Publication Number Publication Date
JP2022107898A JP2022107898A (ja) 2022-07-25
JP2022107898A5 JP2022107898A5 (https=) 2023-09-07
JP7797104B2 true JP7797104B2 (ja) 2026-01-13

Family

ID=82323252

Family Applications (1)

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JP2021002579A Active JP7797104B2 (ja) 2021-01-12 2021-01-12 基板搬送装置、基板搬送方法、および基板処理システム

Country Status (5)

Country Link
US (1) US12183612B2 (https=)
JP (1) JP7797104B2 (https=)
KR (1) KR102652598B1 (https=)
CN (1) CN114765121B (https=)
TW (1) TWI890911B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7506971B2 (ja) * 2019-07-23 2024-06-27 川崎重工業株式会社 ブレード間隔調整装置
KR102818927B1 (ko) * 2020-01-17 2025-06-11 주성엔지니어링(주) 기판 이송 방법 및 기판 이송 장치
JP7433159B2 (ja) * 2020-07-30 2024-02-19 東京エレクトロン株式会社 真空搬送装置、基板処理システム、および基板処理方法
JP7519923B2 (ja) * 2021-01-12 2024-07-22 東京エレクトロン株式会社 基板搬送装置、基板搬送方法、および基板処理システム
JP7548671B2 (ja) * 2021-03-17 2024-09-10 東京エレクトロン株式会社 開閉装置及び搬送室
JP7771651B2 (ja) * 2021-11-12 2025-11-18 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
JP7835056B2 (ja) * 2022-03-08 2026-03-25 東京エレクトロン株式会社 基板処理室内に配置される部材を搬送する装置、基板処理システム及び前記部材を搬送する方法
DE102022124050B3 (de) * 2022-09-20 2023-12-07 Syntegon Technology Gmbh Transportvorrichtung
JP2024064684A (ja) 2022-10-28 2024-05-14 東京エレクトロン株式会社 基板載置台の位置ずれ測定方法および基板処理装置
CN120225448B (zh) * 2023-04-17 2026-04-17 三菱电机株式会社 线性输送装置及线性输送装置的制造方法

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JP2004193344A (ja) 2002-12-11 2004-07-08 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法
JP2006248628A (ja) 2005-03-08 2006-09-21 Nsk Ltd 搬送装置
JP2013211317A (ja) 2012-03-30 2013-10-10 Tokyo Electron Ltd 搬送装置及び搬送方法
JP2015156437A (ja) 2014-02-20 2015-08-27 東京エレクトロン株式会社 基板処理装置、位置ずれ補正方法及び記憶媒体
JP2018504784A (ja) 2015-01-23 2018-02-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体処理設備

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JP6842934B2 (ja) 2017-01-27 2021-03-17 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、検出位置較正方法および基板処理装置
KR102099115B1 (ko) * 2018-06-08 2020-04-10 세메스 주식회사 기판 이송 장치, 이를 포함하는 기판 처리 장치 및 기판 틀어짐 보정 방법
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Publication number Priority date Publication date Assignee Title
JP2004193344A (ja) 2002-12-11 2004-07-08 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法
JP2006248628A (ja) 2005-03-08 2006-09-21 Nsk Ltd 搬送装置
JP2013211317A (ja) 2012-03-30 2013-10-10 Tokyo Electron Ltd 搬送装置及び搬送方法
JP2015156437A (ja) 2014-02-20 2015-08-27 東京エレクトロン株式会社 基板処理装置、位置ずれ補正方法及び記憶媒体
JP2018504784A (ja) 2015-01-23 2018-02-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体処理設備

Also Published As

Publication number Publication date
JP2022107898A (ja) 2022-07-25
US20220223447A1 (en) 2022-07-14
KR20220102108A (ko) 2022-07-19
CN114765121A (zh) 2022-07-19
KR102652598B1 (ko) 2024-03-28
CN114765121B (zh) 2025-05-02
TW202234562A (zh) 2022-09-01
US12183612B2 (en) 2024-12-31
TWI890911B (zh) 2025-07-21

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