TWI890911B - 基板搬送裝置、基板搬送方法、及基板處理系統 - Google Patents

基板搬送裝置、基板搬送方法、及基板處理系統

Info

Publication number
TWI890911B
TWI890911B TW110149399A TW110149399A TWI890911B TW I890911 B TWI890911 B TW I890911B TW 110149399 A TW110149399 A TW 110149399A TW 110149399 A TW110149399 A TW 110149399A TW I890911 B TWI890911 B TW I890911B
Authority
TW
Taiwan
Prior art keywords
substrate
transport
transfer
chamber
processing chamber
Prior art date
Application number
TW110149399A
Other languages
English (en)
Chinese (zh)
Other versions
TW202234562A (zh
Inventor
波多野達夫
樹
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202234562A publication Critical patent/TW202234562A/zh
Application granted granted Critical
Publication of TWI890911B publication Critical patent/TWI890911B/zh

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
    • H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3204—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K2201/00—Specific aspects not provided for in the other groups of this subclass relating to the magnetic circuits
    • H02K2201/18—Machines moving with multiple degrees of freedom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Mechanical Conveyors (AREA)
TW110149399A 2021-01-12 2021-12-29 基板搬送裝置、基板搬送方法、及基板處理系統 TWI890911B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021002579A JP7797104B2 (ja) 2021-01-12 2021-01-12 基板搬送装置、基板搬送方法、および基板処理システム
JP2021-002579 2021-01-12

Publications (2)

Publication Number Publication Date
TW202234562A TW202234562A (zh) 2022-09-01
TWI890911B true TWI890911B (zh) 2025-07-21

Family

ID=82323252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110149399A TWI890911B (zh) 2021-01-12 2021-12-29 基板搬送裝置、基板搬送方法、及基板處理系統

Country Status (5)

Country Link
US (1) US12183612B2 (https=)
JP (1) JP7797104B2 (https=)
KR (1) KR102652598B1 (https=)
CN (1) CN114765121B (https=)
TW (1) TWI890911B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7506971B2 (ja) * 2019-07-23 2024-06-27 川崎重工業株式会社 ブレード間隔調整装置
KR102818927B1 (ko) * 2020-01-17 2025-06-11 주성엔지니어링(주) 기판 이송 방법 및 기판 이송 장치
JP7433159B2 (ja) * 2020-07-30 2024-02-19 東京エレクトロン株式会社 真空搬送装置、基板処理システム、および基板処理方法
JP7519923B2 (ja) * 2021-01-12 2024-07-22 東京エレクトロン株式会社 基板搬送装置、基板搬送方法、および基板処理システム
JP7548671B2 (ja) * 2021-03-17 2024-09-10 東京エレクトロン株式会社 開閉装置及び搬送室
JP7771651B2 (ja) * 2021-11-12 2025-11-18 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
JP7835056B2 (ja) * 2022-03-08 2026-03-25 東京エレクトロン株式会社 基板処理室内に配置される部材を搬送する装置、基板処理システム及び前記部材を搬送する方法
DE102022124050B3 (de) * 2022-09-20 2023-12-07 Syntegon Technology Gmbh Transportvorrichtung
JP2024064684A (ja) 2022-10-28 2024-05-14 東京エレクトロン株式会社 基板載置台の位置ずれ測定方法および基板処理装置
CN120225448B (zh) * 2023-04-17 2026-04-17 三菱电机株式会社 线性输送装置及线性输送装置的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130177857A1 (en) * 2011-12-29 2013-07-11 Nikon Corporation Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
US20150019004A1 (en) * 2012-03-30 2015-01-15 Tokyo Electron Limited Transfer device and transfer method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120317A (ja) * 1992-03-20 1994-04-28 Ulvac Japan Ltd 真空装置用ウエハ搬送機構
AU8747698A (en) * 1997-08-21 1999-03-16 Nikon Corporation Positioning device, driving unit, and aligner equipped with the device
JP2000286318A (ja) * 1999-01-27 2000-10-13 Shinko Electric Co Ltd 搬送システム
JP2003264214A (ja) 2002-03-07 2003-09-19 Hitachi High-Technologies Corp 真空処理装置及び真空処理方法
JP2004193344A (ja) 2002-12-11 2004-07-08 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法
JP4711216B2 (ja) 2005-03-08 2011-06-29 日本精工株式会社 搬送装置
US8760629B2 (en) * 2008-12-19 2014-06-24 Nikon Corporation Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
JP2013187432A (ja) * 2012-03-09 2013-09-19 Nikon Corp 移動体装置、露光装置、及びデバイス製造方法
KR101989366B1 (ko) 2012-07-04 2019-06-14 도쿄엘렉트론가부시키가이샤 기판 처리 장치
JP6199199B2 (ja) 2014-02-20 2017-09-20 東京エレクトロン株式会社 基板処理装置、位置ずれ補正方法及び記憶媒体
TWI676227B (zh) 2015-01-23 2019-11-01 美商應用材料股份有限公司 半導體工藝設備
JP6842934B2 (ja) 2017-01-27 2021-03-17 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、検出位置較正方法および基板処理装置
KR102099115B1 (ko) * 2018-06-08 2020-04-10 세메스 주식회사 기판 이송 장치, 이를 포함하는 기판 처리 장치 및 기판 틀어짐 보정 방법
JP7158238B2 (ja) 2018-10-10 2022-10-21 東京エレクトロン株式会社 基板処理システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130177857A1 (en) * 2011-12-29 2013-07-11 Nikon Corporation Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
US20150019004A1 (en) * 2012-03-30 2015-01-15 Tokyo Electron Limited Transfer device and transfer method

Also Published As

Publication number Publication date
JP2022107898A (ja) 2022-07-25
US20220223447A1 (en) 2022-07-14
KR20220102108A (ko) 2022-07-19
CN114765121A (zh) 2022-07-19
KR102652598B1 (ko) 2024-03-28
CN114765121B (zh) 2025-05-02
JP7797104B2 (ja) 2026-01-13
TW202234562A (zh) 2022-09-01
US12183612B2 (en) 2024-12-31

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