JP7797093B2 - 粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法 - Google Patents

粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法

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Publication number
JP7797093B2
JP7797093B2 JP2019552637A JP2019552637A JP7797093B2 JP 7797093 B2 JP7797093 B2 JP 7797093B2 JP 2019552637 A JP2019552637 A JP 2019552637A JP 2019552637 A JP2019552637 A JP 2019552637A JP 7797093 B2 JP7797093 B2 JP 7797093B2
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Japan
Prior art keywords
meth
weight
acrylate
monomer
adhesive
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JP2019552637A
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English (en)
Japanese (ja)
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JPWO2019244595A1 (ja
Inventor
絢 足立
徳之 内田
智 土居
勇樹 岩井
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Publication of JPWO2019244595A1 publication Critical patent/JPWO2019244595A1/ja
Priority to JP2024155040A priority Critical patent/JP2024166298A/ja
Application granted granted Critical
Publication of JP7797093B2 publication Critical patent/JP7797093B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/354—Applications of adhesives in processes or use of adhesives in the form of films or foils for automotive applications
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C09J2400/243—Presence of a foam in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2493/00—Presence of natural resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2019552637A 2018-06-19 2019-05-30 粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法 Active JP7797093B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024155040A JP2024166298A (ja) 2018-06-19 2024-09-09 粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018116222 2018-06-19
JP2018116222 2018-06-19
PCT/JP2019/021534 WO2019244595A1 (ja) 2018-06-19 2019-05-30 粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024155040A Division JP2024166298A (ja) 2018-06-19 2024-09-09 粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法

Publications (2)

Publication Number Publication Date
JPWO2019244595A1 JPWO2019244595A1 (ja) 2021-05-13
JP7797093B2 true JP7797093B2 (ja) 2026-01-13

Family

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Family Applications (2)

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JP2019552637A Active JP7797093B2 (ja) 2018-06-19 2019-05-30 粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法
JP2024155040A Pending JP2024166298A (ja) 2018-06-19 2024-09-09 粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法

Family Applications After (1)

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Country Status (6)

Country Link
US (1) US20210395575A1 (enExample)
JP (2) JP7797093B2 (enExample)
KR (2) KR20240134397A (enExample)
CN (1) CN111868194A (enExample)
TW (1) TWI862497B (enExample)
WO (1) WO2019244595A1 (enExample)

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JP7386609B2 (ja) * 2018-12-27 2023-11-27 日東電工株式会社 粘着剤組成物
DE202019100588U1 (de) * 2019-01-31 2019-03-21 Certoplast Technische Klebebänder Gmbh Klebeband, insbesondere Wickelband
KR20260036594A (ko) * 2019-12-18 2026-03-17 세키스이가가쿠 고교가부시키가이샤 점착제, 점착 테이프, 전자 제품, 차재 부재, 및 고정 방법
EP4079823A4 (en) * 2019-12-18 2023-08-02 Sekisui Chemical Co., Ltd. Adhesive agent composition, adhesive tape, affixing method for electronic device component or in-vehicle component, and production method for electronic device component or in-vehicle component
JP7784837B2 (ja) * 2020-07-09 2025-12-12 積水化学工業株式会社 粘着テープ
WO2022092149A1 (ja) * 2020-10-28 2022-05-05 積水化学工業株式会社 粘着テープ
JP7599985B2 (ja) * 2021-02-12 2024-12-16 日本カーバイド工業株式会社 粘着剤組成物及び粘着シート
EP4174148A4 (en) * 2021-03-22 2024-01-24 Sekisui Chemical Co., Ltd. ADHESIVE TAPE, METHOD FOR IMMOBILIZING AN ELECTRONIC DEVICE COMPONENT OR INTERNAL VEHICLE DEVICE COMPONENT, METHOD FOR PRODUCING AN ELECTRONIC DEVICE OR INTERNAL VEHICLE DEVICE
WO2022210579A1 (ja) * 2021-03-29 2022-10-06 三菱ケミカル株式会社 粘着剤組成物、およびそれを用いてなる粘着剤、粘着シート、ならびに積層体
JP2023003414A (ja) * 2021-06-23 2023-01-11 積水化学工業株式会社 粘着テープ、電子機器及び車載部材
JP2023003416A (ja) * 2021-06-23 2023-01-11 積水化学工業株式会社 粘着テープ、電化製品、車載部材及び固定方法
JP7826127B2 (ja) * 2021-06-23 2026-03-09 積水化学工業株式会社 粘着テープ
WO2022270567A1 (ja) * 2021-06-23 2022-12-29 積水化学工業株式会社 粘着テープ
CN116867868A (zh) * 2021-06-23 2023-10-10 积水化学工业株式会社 粘合剂组合物及粘合带
JP7723510B2 (ja) * 2021-06-23 2025-08-14 積水化学工業株式会社 粘着テープ
WO2022270566A1 (ja) * 2021-06-23 2022-12-29 積水化学工業株式会社 粘着テープ
CN117413034A (zh) * 2021-08-30 2024-01-16 三菱化学株式会社 粘合片、层叠片及挠性图像显示装置
JP7807217B2 (ja) * 2021-11-29 2026-01-27 日本カーバイド工業株式会社 粘着剤組成物及び粘着テープ
JP7321329B1 (ja) * 2022-07-04 2023-08-04 日東電工株式会社 粘着シート
JP7387824B1 (ja) * 2022-07-04 2023-11-28 日東電工株式会社 粘着シート
JP7308342B1 (ja) * 2022-09-13 2023-07-13 日東電工株式会社 粘着シート
JP2024049356A (ja) * 2022-09-28 2024-04-09 積水化学工業株式会社 粘着テープ
JP2024089907A (ja) * 2022-12-22 2024-07-04 Dic株式会社 粘着剤組成物、粘着層、及び粘着シート
JP2024094179A (ja) * 2022-12-27 2024-07-09 ライオン・スペシャリティ・ケミカルズ株式会社 粘着剤組成物及びそれを用いた粘着シート
CN120418374A (zh) * 2023-02-27 2025-08-01 东友精细化工有限公司 粘着剂组合物、粘着片和包含其的显示器
JP2024126596A (ja) * 2023-03-07 2024-09-20 日榮新化株式会社 両面粘着テープ
CN120813663A (zh) * 2023-03-14 2025-10-17 综研化学株式会社 粘合剂组合物以及粘合剂层的制造方法
JP7387216B1 (ja) 2023-07-11 2023-11-28 サイデン化学株式会社 再剥離用粘着剤組成物及び粘着シート
DE102023118445A1 (de) 2023-07-12 2025-01-16 Tesa Se Elektrisch leitfähiges Klebeband mit hohem biogenem Kohlenstoffanteil
JP7622796B1 (ja) 2023-10-27 2025-01-28 ａｒｔｉｅｎｃｅ株式会社 粘着剤組成物および粘着シート
WO2025244115A1 (ja) * 2024-05-23 2025-11-27 積水化学工業株式会社 粘着剤組成物、及び、粘着テープ

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JP2012514083A (ja) 2008-12-24 2012-06-21 スリーエム イノベイティブ プロパティズ カンパニー 微小球感圧接着剤組成物
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JP2016521306A (ja) 2013-04-15 2016-07-21 スリーエム イノベイティブ プロパティズ カンパニー （メタ）アクリレート基及びオレフィン基を有する架橋剤を含む接着剤並びに方法
WO2016203935A1 (ja) 2015-06-15 2016-12-22 綜研化学株式会社 偏光板用の粘着剤組成物、粘着剤層および粘着シート、ならびに粘着剤層付き偏光板

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KR20210022521A (ko) 2021-03-03
US20210395575A1 (en) 2021-12-23
JPWO2019244595A1 (ja) 2021-05-13
KR20240134397A (ko) 2024-09-09
JP2024166298A (ja) 2024-11-28
CN111868194A (zh) 2020-10-30
TW202000836A (zh) 2020-01-01
TWI862497B (zh) 2024-11-21
WO2019244595A1 (ja) 2019-12-26

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