TWI862497B - 黏著劑、黏著帶、及固定電子機器零件或車載零件之方法 - Google Patents

黏著劑、黏著帶、及固定電子機器零件或車載零件之方法 Download PDF

Info

Publication number
TWI862497B
TWI862497B TW108119467A TW108119467A TWI862497B TW I862497 B TWI862497 B TW I862497B TW 108119467 A TW108119467 A TW 108119467A TW 108119467 A TW108119467 A TW 108119467A TW I862497 B TWI862497 B TW I862497B
Authority
TW
Taiwan
Prior art keywords
adhesive
meth
weight
monomer
derived
Prior art date
Application number
TW108119467A
Other languages
English (en)
Chinese (zh)
Other versions
TW202000836A (zh
Inventor
足立絢
內田徳之
土居智
岩井勇樹
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202000836A publication Critical patent/TW202000836A/zh
Application granted granted Critical
Publication of TWI862497B publication Critical patent/TWI862497B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/354—Applications of adhesives in processes or use of adhesives in the form of films or foils for automotive applications
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C09J2400/243—Presence of a foam in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2493/00—Presence of natural resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW108119467A 2018-06-19 2019-06-05 黏著劑、黏著帶、及固定電子機器零件或車載零件之方法 TWI862497B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018116222 2018-06-19
JPJP2018-116222 2018-06-19

Publications (2)

Publication Number Publication Date
TW202000836A TW202000836A (zh) 2020-01-01
TWI862497B true TWI862497B (zh) 2024-11-21

Family

ID=68982831

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108119467A TWI862497B (zh) 2018-06-19 2019-06-05 黏著劑、黏著帶、及固定電子機器零件或車載零件之方法

Country Status (6)

Country Link
US (1) US20210395575A1 (enExample)
JP (2) JP7797093B2 (enExample)
KR (2) KR20240134397A (enExample)
CN (1) CN111868194A (enExample)
TW (1) TWI862497B (enExample)
WO (1) WO2019244595A1 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7386609B2 (ja) * 2018-12-27 2023-11-27 日東電工株式会社 粘着剤組成物
DE202019100588U1 (de) * 2019-01-31 2019-03-21 Certoplast Technische Klebebänder Gmbh Klebeband, insbesondere Wickelband
KR20260036594A (ko) * 2019-12-18 2026-03-17 세키스이가가쿠 고교가부시키가이샤 점착제, 점착 테이프, 전자 제품, 차재 부재, 및 고정 방법
EP4079823A4 (en) * 2019-12-18 2023-08-02 Sekisui Chemical Co., Ltd. Adhesive agent composition, adhesive tape, affixing method for electronic device component or in-vehicle component, and production method for electronic device component or in-vehicle component
JP7784837B2 (ja) * 2020-07-09 2025-12-12 積水化学工業株式会社 粘着テープ
WO2022092149A1 (ja) * 2020-10-28 2022-05-05 積水化学工業株式会社 粘着テープ
JP7599985B2 (ja) * 2021-02-12 2024-12-16 日本カーバイド工業株式会社 粘着剤組成物及び粘着シート
EP4174148A4 (en) * 2021-03-22 2024-01-24 Sekisui Chemical Co., Ltd. ADHESIVE TAPE, METHOD FOR IMMOBILIZING AN ELECTRONIC DEVICE COMPONENT OR INTERNAL VEHICLE DEVICE COMPONENT, METHOD FOR PRODUCING AN ELECTRONIC DEVICE OR INTERNAL VEHICLE DEVICE
WO2022210579A1 (ja) * 2021-03-29 2022-10-06 三菱ケミカル株式会社 粘着剤組成物、およびそれを用いてなる粘着剤、粘着シート、ならびに積層体
JP2023003414A (ja) * 2021-06-23 2023-01-11 積水化学工業株式会社 粘着テープ、電子機器及び車載部材
JP2023003416A (ja) * 2021-06-23 2023-01-11 積水化学工業株式会社 粘着テープ、電化製品、車載部材及び固定方法
JP7826127B2 (ja) * 2021-06-23 2026-03-09 積水化学工業株式会社 粘着テープ
WO2022270567A1 (ja) * 2021-06-23 2022-12-29 積水化学工業株式会社 粘着テープ
CN116867868A (zh) * 2021-06-23 2023-10-10 积水化学工业株式会社 粘合剂组合物及粘合带
JP7723510B2 (ja) * 2021-06-23 2025-08-14 積水化学工業株式会社 粘着テープ
WO2022270566A1 (ja) * 2021-06-23 2022-12-29 積水化学工業株式会社 粘着テープ
CN117413034A (zh) * 2021-08-30 2024-01-16 三菱化学株式会社 粘合片、层叠片及挠性图像显示装置
JP7807217B2 (ja) * 2021-11-29 2026-01-27 日本カーバイド工業株式会社 粘着剤組成物及び粘着テープ
JP7321329B1 (ja) * 2022-07-04 2023-08-04 日東電工株式会社 粘着シート
JP7387824B1 (ja) * 2022-07-04 2023-11-28 日東電工株式会社 粘着シート
JP7308342B1 (ja) * 2022-09-13 2023-07-13 日東電工株式会社 粘着シート
JP2024049356A (ja) * 2022-09-28 2024-04-09 積水化学工業株式会社 粘着テープ
JP2024089907A (ja) * 2022-12-22 2024-07-04 Dic株式会社 粘着剤組成物、粘着層、及び粘着シート
JP2024094179A (ja) * 2022-12-27 2024-07-09 ライオン・スペシャリティ・ケミカルズ株式会社 粘着剤組成物及びそれを用いた粘着シート
CN120418374A (zh) * 2023-02-27 2025-08-01 东友精细化工有限公司 粘着剂组合物、粘着片和包含其的显示器
JP2024126596A (ja) * 2023-03-07 2024-09-20 日榮新化株式会社 両面粘着テープ
CN120813663A (zh) * 2023-03-14 2025-10-17 综研化学株式会社 粘合剂组合物以及粘合剂层的制造方法
JP7387216B1 (ja) 2023-07-11 2023-11-28 サイデン化学株式会社 再剥離用粘着剤組成物及び粘着シート
DE102023118445A1 (de) 2023-07-12 2025-01-16 Tesa Se Elektrisch leitfähiges Klebeband mit hohem biogenem Kohlenstoffanteil
JP7622796B1 (ja) 2023-10-27 2025-01-28 ａｒｔｉｅｎｃｅ株式会社 粘着剤組成物および粘着シート
WO2025244115A1 (ja) * 2024-05-23 2025-11-27 積水化学工業株式会社 粘着剤組成物、及び、粘着テープ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189274A (ja) * 1982-04-28 1983-11-04 Kanzaki Paper Mfg Co Ltd 感圧接着剤組成物
TW200951195A (en) * 2008-04-14 2009-12-16 3M Innovative Properties Co 2-octyl (meth) acrylate adhesive composition
CN105121579A (zh) * 2013-04-15 2015-12-02 3M创新有限公司 包含具有(甲基)丙烯酸酯基团和烯烃基团的交联剂的粘合剂以及方法
TW201702344A (zh) * 2015-06-15 2017-01-16 綜研化學股份有限公司 偏光板用的黏著劑組成物、黏著劑層及黏著片以及附黏著劑層的偏光板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4447485A (en) * 1981-08-04 1984-05-08 Mitsubishi Plastics Industries Limited Adhesive tape and process for its production
BRPI0918319A2 (pt) 2008-12-24 2017-05-30 3M Innovative Properties Co adesivos e composição adesiva sensível à pressão
JP2013001761A (ja) * 2011-06-14 2013-01-07 Nitto Denko Corp 粘着剤組成物、粘着剤層、および粘着シート
JP6125789B2 (ja) * 2012-10-04 2017-05-10 日本カーバイド工業株式会社 粘着剤組成物、粘着シート及び光学用積層シート
US9908837B2 (en) 2013-03-15 2018-03-06 3M Innovative Properties Company Method for preparing (meth)acrylates of biobased alcohols and polymers thereof
JP2015021067A (ja) 2013-07-19 2015-02-02 Dic株式会社 熱伝導性粘着テープ、物品及び画像表示装置
JP6100654B2 (ja) 2013-09-06 2017-03-22 帝人株式会社 耐熱性粘着テープ用基材及びそれからなる耐熱性粘着テープ
WO2015056499A1 (ja) * 2013-10-15 2015-04-23 日東電工株式会社 粘着シート
JP6367598B2 (ja) 2013-11-22 2018-08-01 日東電工株式会社 両面粘着シート
WO2015098727A1 (ja) * 2013-12-27 2015-07-02 積水化学工業株式会社 光学用粘着剤、光学用粘着テープ及び積層体
JP6758869B2 (ja) * 2015-03-11 2020-09-23 住友化学株式会社 粘着剤組成物、粘着剤層、及び粘着剤層付光学部材
WO2017047269A1 (ja) * 2015-09-18 2017-03-23 日東電工株式会社 粘着シート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189274A (ja) * 1982-04-28 1983-11-04 Kanzaki Paper Mfg Co Ltd 感圧接着剤組成物
TW200951195A (en) * 2008-04-14 2009-12-16 3M Innovative Properties Co 2-octyl (meth) acrylate adhesive composition
CN105121579A (zh) * 2013-04-15 2015-12-02 3M创新有限公司 包含具有(甲基)丙烯酸酯基团和烯烃基团的交联剂的粘合剂以及方法
TW201702344A (zh) * 2015-06-15 2017-01-16 綜研化學股份有限公司 偏光板用的黏著劑組成物、黏著劑層及黏著片以及附黏著劑層的偏光板

Also Published As

Publication number Publication date
KR20210022521A (ko) 2021-03-03
US20210395575A1 (en) 2021-12-23
JPWO2019244595A1 (ja) 2021-05-13
KR20240134397A (ko) 2024-09-09
JP2024166298A (ja) 2024-11-28
CN111868194A (zh) 2020-10-30
JP7797093B2 (ja) 2026-01-13
TW202000836A (zh) 2020-01-01
WO2019244595A1 (ja) 2019-12-26

Similar Documents

Publication Publication Date Title
JP7797093B2 (ja) 粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法
JP7128390B1 (ja) 粘着テープ、電子機器部品又は車載機器部品の固定方法、及び、電子機器又は車載機器の製造方法
JP7084539B2 (ja) 粘着テープ、電子機器部品又は車載部品の固定方法、及び、電子機器部品又は車載部品の製造方法
JP7128389B1 (ja) 粘着テープ、電子機器部品又は車載機器部品の固定方法、及び、電子機器又は車載機器の製造方法
JP2019218458A (ja) 粘着テープ
JP2023003413A (ja) 粘着テープ
CN116867868A (zh) 粘合剂组合物及粘合带
KR102544311B1 (ko) 점착 테이프, 전자 기기 부품 또는 차재 기기 부품의 고정 방법, 및 전자 기기 또는 차재 기기의 제조 방법
WO2022270567A1 (ja) 粘着テープ
JP7826127B2 (ja) 粘着テープ
TW202313889A (zh) 黏著帶
JP7723510B2 (ja) 粘着テープ
JP2023003414A (ja) 粘着テープ、電子機器及び車載部材