KR20240134397A - 점착제, 점착 테이프, 및, 전자 기기 부품 또는 차재 부품을 고정하는 방법 - Google Patents

점착제, 점착 테이프, 및, 전자 기기 부품 또는 차재 부품을 고정하는 방법 Download PDF

Info

Publication number
KR20240134397A
KR20240134397A KR1020247029011A KR20247029011A KR20240134397A KR 20240134397 A KR20240134397 A KR 20240134397A KR 1020247029011 A KR1020247029011 A KR 1020247029011A KR 20247029011 A KR20247029011 A KR 20247029011A KR 20240134397 A KR20240134397 A KR 20240134397A
Authority
KR
South Korea
Prior art keywords
adhesive
meth
acrylate
derived
monomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247029011A
Other languages
English (en)
Korean (ko)
Inventor
아야 아다치
노리유키 우치다
사토시 도이
유키 이와이
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20240134397A publication Critical patent/KR20240134397A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/354—Applications of adhesives in processes or use of adhesives in the form of films or foils for automotive applications
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C09J2400/243—Presence of a foam in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2493/00—Presence of natural resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Laminated Bodies (AREA)
KR1020247029011A 2018-06-19 2019-05-30 점착제, 점착 테이프, 및, 전자 기기 부품 또는 차재 부품을 고정하는 방법 Pending KR20240134397A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018116222 2018-06-19
JPJP-P-2018-116222 2018-06-19
KR1020207025270A KR20210022521A (ko) 2018-06-19 2019-05-30 점착제, 점착 테이프, 및, 전자 기기 부품 또는 차재 부품을 고정하는 방법
PCT/JP2019/021534 WO2019244595A1 (ja) 2018-06-19 2019-05-30 粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020207025270A Division KR20210022521A (ko) 2018-06-19 2019-05-30 점착제, 점착 테이프, 및, 전자 기기 부품 또는 차재 부품을 고정하는 방법

Publications (1)

Publication Number Publication Date
KR20240134397A true KR20240134397A (ko) 2024-09-09

Family

ID=68982831

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020247029011A Pending KR20240134397A (ko) 2018-06-19 2019-05-30 점착제, 점착 테이프, 및, 전자 기기 부품 또는 차재 부품을 고정하는 방법
KR1020207025270A Ceased KR20210022521A (ko) 2018-06-19 2019-05-30 점착제, 점착 테이프, 및, 전자 기기 부품 또는 차재 부품을 고정하는 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020207025270A Ceased KR20210022521A (ko) 2018-06-19 2019-05-30 점착제, 점착 테이프, 및, 전자 기기 부품 또는 차재 부품을 고정하는 방법

Country Status (6)

Country Link
US (1) US20210395575A1 (enExample)
JP (2) JP7797093B2 (enExample)
KR (2) KR20240134397A (enExample)
CN (1) CN111868194A (enExample)
TW (1) TWI862497B (enExample)
WO (1) WO2019244595A1 (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7386609B2 (ja) * 2018-12-27 2023-11-27 日東電工株式会社 粘着剤組成物
DE202019100588U1 (de) * 2019-01-31 2019-02-07 Certoplast Technische Klebebänder Gmbh Klebeband, insbesondere Wickelband
CN119193055A (zh) * 2019-12-18 2024-12-27 积水化学工业株式会社 粘接剂、胶带、电器产品、车载部件及固定方法
JP7784837B2 (ja) * 2020-07-09 2025-12-12 積水化学工業株式会社 粘着テープ
CN115803404B (zh) * 2020-10-28 2025-03-25 积水化学工业株式会社 粘合带
JP7599985B2 (ja) * 2021-02-12 2024-12-16 日本カーバイド工業株式会社 粘着剤組成物及び粘着シート
JP7128390B1 (ja) * 2021-03-22 2022-08-30 積水化学工業株式会社 粘着テープ、電子機器部品又は車載機器部品の固定方法、及び、電子機器又は車載機器の製造方法
TWI891992B (zh) * 2021-03-29 2025-08-01 日商三菱化學股份有限公司 黏著劑組成物、及使用其而成之黏著劑、黏著片、及疊層體
JP7826127B2 (ja) * 2021-06-23 2026-03-09 積水化学工業株式会社 粘着テープ
JP2023003414A (ja) * 2021-06-23 2023-01-11 積水化学工業株式会社 粘着テープ、電子機器及び車載部材
TW202313889A (zh) * 2021-06-23 2023-04-01 日商積水化學工業股份有限公司 黏著帶
JP7723510B2 (ja) * 2021-06-23 2025-08-14 積水化学工業株式会社 粘着テープ
WO2022270567A1 (ja) * 2021-06-23 2022-12-29 積水化学工業株式会社 粘着テープ
JP2023003416A (ja) * 2021-06-23 2023-01-11 積水化学工業株式会社 粘着テープ、電化製品、車載部材及び固定方法
CN116867868A (zh) * 2021-06-23 2023-10-10 积水化学工业株式会社 粘合剂组合物及粘合带
TW202311481A (zh) * 2021-08-30 2023-03-16 日商三菱化學股份有限公司 黏著片材、積層片材及可撓性圖像顯示裝置
JP7807217B2 (ja) * 2021-11-29 2026-01-27 日本カーバイド工業株式会社 粘着剤組成物及び粘着テープ
JP7321329B1 (ja) * 2022-07-04 2023-08-04 日東電工株式会社 粘着シート
JP7387824B1 (ja) * 2022-07-04 2023-11-28 日東電工株式会社 粘着シート
JP7308342B1 (ja) * 2022-09-13 2023-07-13 日東電工株式会社 粘着シート
JP2024094179A (ja) * 2022-12-27 2024-07-09 ライオン・スペシャリティ・ケミカルズ株式会社 粘着剤組成物及びそれを用いた粘着シート
WO2024190594A1 (ja) * 2023-03-14 2024-09-19 綜研化学株式会社 粘着剤組成物および粘着剤層の製造方法
JP7387216B1 (ja) 2023-07-11 2023-11-28 サイデン化学株式会社 再剥離用粘着剤組成物及び粘着シート
DE102023118445A1 (de) 2023-07-12 2025-01-16 Tesa Se Elektrisch leitfähiges Klebeband mit hohem biogenem Kohlenstoffanteil
JP7622796B1 (ja) 2023-10-27 2025-01-28 ａｒｔｉｅｎｃｅ株式会社 粘着剤組成物および粘着シート

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015021067A (ja) 2013-07-19 2015-02-02 Dic株式会社 熱伝導性粘着テープ、物品及び画像表示装置
JP2015052050A (ja) 2013-09-06 2015-03-19 帝人株式会社 耐熱性粘着テープ用基材及びそれからなる耐熱性粘着テープ
JP2015120876A (ja) 2013-11-22 2015-07-02 日東電工株式会社 両面粘着シート

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4447485A (en) * 1981-08-04 1984-05-08 Mitsubishi Plastics Industries Limited Adhesive tape and process for its production
JPS58189274A (ja) * 1982-04-28 1983-11-04 Kanzaki Paper Mfg Co Ltd 感圧接着剤組成物
US20100151241A1 (en) * 2008-04-14 2010-06-17 3M Innovative Properties Company 2-Octyl (Meth)acrylate Adhesive Composition
US20100167614A1 (en) * 2008-12-24 2010-07-01 3M Innovative Properties Company Microsphere pressure sensitive adhesive composition
JP2013001761A (ja) * 2011-06-14 2013-01-07 Nitto Denko Corp 粘着剤組成物、粘着剤層、および粘着シート
JP6125789B2 (ja) * 2012-10-04 2017-05-10 日本カーバイド工業株式会社 粘着剤組成物、粘着シート及び光学用積層シート
KR102269728B1 (ko) * 2013-03-15 2021-06-28 쓰리엠 이노베이티브 프로퍼티즈 캄파니 바이오-기반 알코올의 (메트)아크릴레이트 및 그의 중합체를 제조하는 방법
US9475967B2 (en) * 2013-04-15 2016-10-25 3M Innovative Properties Company Adhesives comprising crosslinker with (meth)acrylate group and olefin group and methods
WO2015056499A1 (ja) * 2013-10-15 2015-04-23 日東電工株式会社 粘着シート
WO2015098727A1 (ja) * 2013-12-27 2015-07-02 積水化学工業株式会社 光学用粘着剤、光学用粘着テープ及び積層体
TWI784925B (zh) * 2015-03-11 2022-12-01 日商住友化學股份有限公司 附黏著劑層之光學構件
JP2018127504A (ja) * 2015-06-15 2018-08-16 綜研化学株式会社 偏光板用粘着剤組成物および粘着剤層付き偏光板
WO2017047269A1 (ja) * 2015-09-18 2017-03-23 日東電工株式会社 粘着シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015021067A (ja) 2013-07-19 2015-02-02 Dic株式会社 熱伝導性粘着テープ、物品及び画像表示装置
JP2015052050A (ja) 2013-09-06 2015-03-19 帝人株式会社 耐熱性粘着テープ用基材及びそれからなる耐熱性粘着テープ
JP2015120876A (ja) 2013-11-22 2015-07-02 日東電工株式会社 両面粘着シート

Also Published As

Publication number Publication date
JP2024166298A (ja) 2024-11-28
TWI862497B (zh) 2024-11-21
US20210395575A1 (en) 2021-12-23
JP7797093B2 (ja) 2026-01-13
TW202000836A (zh) 2020-01-01
JPWO2019244595A1 (ja) 2021-05-13
KR20210022521A (ko) 2021-03-03
CN111868194A (zh) 2020-10-30
WO2019244595A1 (ja) 2019-12-26

Similar Documents

Publication Publication Date Title
JP7797093B2 (ja) 粘着剤、粘着テープ、及び、電子機器部品又は車載部品を固定する方法
JP7132452B2 (ja) 粘着剤組成物、粘着テープ、電子機器部品又は車載部品の固定方法、及び、電子機器部品又は車載部品の製造方法
JP2019218458A (ja) 粘着テープ
KR102544311B1 (ko) 점착 테이프, 전자 기기 부품 또는 차재 기기 부품의 고정 방법, 및 전자 기기 또는 차재 기기의 제조 방법
JP7128390B1 (ja) 粘着テープ、電子機器部品又は車載機器部品の固定方法、及び、電子機器又は車載機器の製造方法
WO2022202778A1 (ja) 粘着テープ、電子機器部品又は車載機器部品の固定方法、及び、電子機器又は車載機器の製造方法
JP2023003414A (ja) 粘着テープ、電子機器及び車載部材
KR20240023013A (ko) 점착제 조성물 및 점착 테이프
WO2022270567A1 (ja) 粘着テープ
JP7723510B2 (ja) 粘着テープ
JP7826127B2 (ja) 粘着テープ
WO2022202774A1 (ja) 粘着テープ、電子機器部品又は車載機器部品の固定方法、及び、電子機器又は車載機器の製造方法

Legal Events

Date Code Title Description
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902