JP7794362B2 - 半導体チップの洗浄方法及び半導体装置の製造方法 - Google Patents

半導体チップの洗浄方法及び半導体装置の製造方法

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Publication number
JP7794362B2
JP7794362B2 JP2025518141A JP2025518141A JP7794362B2 JP 7794362 B2 JP7794362 B2 JP 7794362B2 JP 2025518141 A JP2025518141 A JP 2025518141A JP 2025518141 A JP2025518141 A JP 2025518141A JP 7794362 B2 JP7794362 B2 JP 7794362B2
Authority
JP
Japan
Prior art keywords
semiconductor
cleaning
circuit layer
semiconductor chips
adhesive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025518141A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024228364A5 (https=
JPWO2024228364A1 (https=
Inventor
央視 出口
竜也 牧野
誠二 甲斐
敏明 白坂
友人 諸崎
元 青柳
一博 佐々木
健宏 木下
耕治 直田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2024228364A1 publication Critical patent/JPWO2024228364A1/ja
Publication of JPWO2024228364A5 publication Critical patent/JPWO2024228364A5/ja
Priority to JP2025188267A priority Critical patent/JP7819808B2/ja
Application granted granted Critical
Publication of JP7794362B2 publication Critical patent/JP7794362B2/ja
Priority to JP2026020196A priority patent/JP2026066333A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/30—Cleaning after the substrates have been singulated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Dicing (AREA)
JP2025518141A 2023-05-01 2024-04-25 半導体チップの洗浄方法及び半導体装置の製造方法 Active JP7794362B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2025188267A JP7819808B2 (ja) 2023-05-01 2025-11-07 半導体チップの洗浄方法及び半導体装置の製造方法
JP2026020196A JP2026066333A (ja) 2023-05-01 2026-02-10 半導体チップの洗浄方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023075732 2023-05-01
JP2023075732 2023-05-01
PCT/JP2024/016316 WO2024228364A1 (ja) 2023-05-01 2024-04-25 半導体チップの洗浄方法及び半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025188267A Division JP7819808B2 (ja) 2023-05-01 2025-11-07 半導体チップの洗浄方法及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2024228364A1 JPWO2024228364A1 (https=) 2024-11-07
JPWO2024228364A5 JPWO2024228364A5 (https=) 2025-10-08
JP7794362B2 true JP7794362B2 (ja) 2026-01-06

Family

ID=93333002

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2025518141A Active JP7794362B2 (ja) 2023-05-01 2024-04-25 半導体チップの洗浄方法及び半導体装置の製造方法
JP2025188267A Active JP7819808B2 (ja) 2023-05-01 2025-11-07 半導体チップの洗浄方法及び半導体装置の製造方法
JP2026020196A Pending JP2026066333A (ja) 2023-05-01 2026-02-10 半導体チップの洗浄方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2025188267A Active JP7819808B2 (ja) 2023-05-01 2025-11-07 半導体チップの洗浄方法及び半導体装置の製造方法
JP2026020196A Pending JP2026066333A (ja) 2023-05-01 2026-02-10 半導体チップの洗浄方法

Country Status (5)

Country Link
JP (3) JP7794362B2 (https=)
KR (1) KR20260002717A (https=)
CN (1) CN121002620A (https=)
TW (1) TW202445727A (https=)
WO (1) WO2024228364A1 (https=)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010093273A (ja) 2009-11-13 2010-04-22 Casio Computer Co Ltd 半導体装置の製造方法
JP2012169484A (ja) 2011-02-15 2012-09-06 Nitto Denko Corp 半導体装置の製造方法
JP2016034993A (ja) 2014-08-01 2016-03-17 リンテック株式会社 粘着シート
JP2016039186A (ja) 2014-08-05 2016-03-22 株式会社ディスコ ウエーハの加工方法
JP2018190902A (ja) 2017-05-10 2018-11-29 株式会社ディスコ 加工方法
JP2018200957A (ja) 2017-05-26 2018-12-20 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
CN111739854A (zh) 2020-07-06 2020-10-02 绍兴同芯成集成电路有限公司 一种开窗孔双面电镀厚铜膜
JP2020188154A (ja) 2019-05-15 2020-11-19 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂被覆基板および素子チップの製造方法
JP2022096079A (ja) 2020-12-17 2022-06-29 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
WO2022250130A1 (ja) 2021-05-28 2022-12-01 三井化学東セロ株式会社 バックグラインド用粘着性フィルムおよび電子装置の製造方法
JP2023043724A (ja) 2021-09-16 2023-03-29 古河電気工業株式会社 半導体加工用テープ、及び半導体チップの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001197431A (ja) 2000-11-02 2001-07-19 Sony Corp 情報処理装置および情報処理方法、並びにプログラム格納媒体
JP6961387B2 (ja) * 2017-05-19 2021-11-05 日東電工株式会社 ダイシングダイボンドフィルム

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010093273A (ja) 2009-11-13 2010-04-22 Casio Computer Co Ltd 半導体装置の製造方法
JP2012169484A (ja) 2011-02-15 2012-09-06 Nitto Denko Corp 半導体装置の製造方法
JP2016034993A (ja) 2014-08-01 2016-03-17 リンテック株式会社 粘着シート
JP2016039186A (ja) 2014-08-05 2016-03-22 株式会社ディスコ ウエーハの加工方法
JP2018190902A (ja) 2017-05-10 2018-11-29 株式会社ディスコ 加工方法
JP2018200957A (ja) 2017-05-26 2018-12-20 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
JP2020188154A (ja) 2019-05-15 2020-11-19 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂被覆基板および素子チップの製造方法
CN111739854A (zh) 2020-07-06 2020-10-02 绍兴同芯成集成电路有限公司 一种开窗孔双面电镀厚铜膜
JP2022096079A (ja) 2020-12-17 2022-06-29 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
WO2022250130A1 (ja) 2021-05-28 2022-12-01 三井化学東セロ株式会社 バックグラインド用粘着性フィルムおよび電子装置の製造方法
JP2023043724A (ja) 2021-09-16 2023-03-29 古河電気工業株式会社 半導体加工用テープ、及び半導体チップの製造方法

Also Published As

Publication number Publication date
JP2026066333A (ja) 2026-04-16
JP7819808B2 (ja) 2026-02-25
JP2026009401A (ja) 2026-01-19
WO2024228364A1 (ja) 2024-11-07
KR20260002717A (ko) 2026-01-06
CN121002620A (zh) 2025-11-21
JPWO2024228364A1 (https=) 2024-11-07
TW202445727A (zh) 2024-11-16

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