TW202445727A - 半導體晶片之清洗方法及半導體裝置之製造方法 - Google Patents

半導體晶片之清洗方法及半導體裝置之製造方法 Download PDF

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Publication number
TW202445727A
TW202445727A TW113115719A TW113115719A TW202445727A TW 202445727 A TW202445727 A TW 202445727A TW 113115719 A TW113115719 A TW 113115719A TW 113115719 A TW113115719 A TW 113115719A TW 202445727 A TW202445727 A TW 202445727A
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TW
Taiwan
Prior art keywords
semiconductor
circuit layer
semiconductor chip
semiconductor wafer
film
Prior art date
Application number
TW113115719A
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English (en)
Chinese (zh)
Inventor
出口央視
牧野龍也
甲斐誠二
白坂敏明
諸崎友人
青柳元
佐佐木一博
木下健宏
直田耕治
Original Assignee
日商力森諾科股份有限公司
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Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202445727A publication Critical patent/TW202445727A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/30—Cleaning after the substrates have been singulated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

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  • Cleaning Or Drying Semiconductors (AREA)
  • Dicing (AREA)
TW113115719A 2023-05-01 2024-04-26 半導體晶片之清洗方法及半導體裝置之製造方法 TW202445727A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-075732 2023-05-01
JP2023075732 2023-05-01

Publications (1)

Publication Number Publication Date
TW202445727A true TW202445727A (zh) 2024-11-16

Family

ID=93333002

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113115719A TW202445727A (zh) 2023-05-01 2024-04-26 半導體晶片之清洗方法及半導體裝置之製造方法

Country Status (5)

Country Link
JP (3) JP7794362B2 (https=)
KR (1) KR20260002717A (https=)
CN (1) CN121002620A (https=)
TW (1) TW202445727A (https=)
WO (1) WO2024228364A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001197431A (ja) 2000-11-02 2001-07-19 Sony Corp 情報処理装置および情報処理方法、並びにプログラム格納媒体
JP2010093273A (ja) 2009-11-13 2010-04-22 Casio Computer Co Ltd 半導体装置の製造方法
JP5830250B2 (ja) 2011-02-15 2015-12-09 日東電工株式会社 半導体装置の製造方法
JP6390034B2 (ja) 2014-08-01 2018-09-19 リンテック株式会社 粘着シート
JP2016039186A (ja) 2014-08-05 2016-03-22 株式会社ディスコ ウエーハの加工方法
JP6899252B2 (ja) 2017-05-10 2021-07-07 株式会社ディスコ 加工方法
JP6961387B2 (ja) * 2017-05-19 2021-11-05 日東電工株式会社 ダイシングダイボンドフィルム
JP6519759B2 (ja) 2017-05-26 2019-05-29 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
JP2020188154A (ja) 2019-05-15 2020-11-19 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂被覆基板および素子チップの製造方法
CN111739854B (zh) 2020-07-06 2022-03-29 绍兴同芯成集成电路有限公司 一种开窗孔双面电镀厚铜膜
JP2022096079A (ja) 2020-12-17 2022-06-29 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
KR20240005909A (ko) 2021-05-28 2024-01-12 미쓰이 가가쿠 토세로 가부시키가이샤 백그라인드용 점착성 필름 및 전자 장치의 제조 방법
JP7488231B2 (ja) 2021-09-16 2024-05-21 古河電気工業株式会社 半導体加工用テープ、及び半導体チップの製造方法

Also Published As

Publication number Publication date
JP2026066333A (ja) 2026-04-16
JP7819808B2 (ja) 2026-02-25
JP2026009401A (ja) 2026-01-19
WO2024228364A1 (ja) 2024-11-07
KR20260002717A (ko) 2026-01-06
CN121002620A (zh) 2025-11-21
JPWO2024228364A1 (https=) 2024-11-07
JP7794362B2 (ja) 2026-01-06

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