JP7790422B2 - 高周波回路 - Google Patents

高周波回路

Info

Publication number
JP7790422B2
JP7790422B2 JP2023503589A JP2023503589A JP7790422B2 JP 7790422 B2 JP7790422 B2 JP 7790422B2 JP 2023503589 A JP2023503589 A JP 2023503589A JP 2023503589 A JP2023503589 A JP 2023503589A JP 7790422 B2 JP7790422 B2 JP 7790422B2
Authority
JP
Japan
Prior art keywords
wiring
insulating layer
shield via
ground
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023503589A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022185695A5 (https=
JPWO2022185695A1 (https=
Inventor
俊 五十嵐
宏 上田
傑 山岸
一郎 桑山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of JPWO2022185695A1 publication Critical patent/JPWO2022185695A1/ja
Publication of JPWO2022185695A5 publication Critical patent/JPWO2022185695A5/ja
Application granted granted Critical
Publication of JP7790422B2 publication Critical patent/JP7790422B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/026—Coplanar striplines [CPS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023503589A 2021-03-03 2021-12-27 高周波回路 Active JP7790422B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021033122 2021-03-03
JP2021033122 2021-03-03
PCT/JP2021/048525 WO2022185695A1 (ja) 2021-03-03 2021-12-27 高周波回路

Publications (3)

Publication Number Publication Date
JPWO2022185695A1 JPWO2022185695A1 (https=) 2022-09-09
JPWO2022185695A5 JPWO2022185695A5 (https=) 2023-11-28
JP7790422B2 true JP7790422B2 (ja) 2025-12-23

Family

ID=83153959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023503589A Active JP7790422B2 (ja) 2021-03-03 2021-12-27 高周波回路

Country Status (5)

Country Link
US (1) US12557208B2 (https=)
JP (1) JP7790422B2 (https=)
CN (1) CN116918462A (https=)
DE (1) DE112021007188T5 (https=)
WO (1) WO2022185695A1 (https=)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001135899A (ja) 1999-11-05 2001-05-18 Mitsubishi Electric Corp 高周波プリント配線板及びその製造方法
JP2004014800A (ja) 2002-06-06 2004-01-15 Mitsubishi Electric Corp 多層配線基板
JP2012129350A (ja) 2010-12-15 2012-07-05 Hitachi Ltd 多層プリント基板
JP2013239511A (ja) 2012-05-14 2013-11-28 Mitsubishi Electric Corp 多層基板、プリント回路基板、半導体パッケージ基板、半導体パッケージ、半導体チップ、半導体デバイス、情報処理装置および通信装置
JP2015050678A (ja) 2013-09-03 2015-03-16 日本電信電話株式会社 高周波伝送線路
WO2016047492A1 (ja) 2014-09-22 2016-03-31 株式会社フジクラ プリント配線板
JP2017011046A (ja) 2015-06-19 2017-01-12 ホシデン株式会社 多層プリント配線板及び多層プリント配線板とコネクタとの接続構造
CN107969065A (zh) 2017-11-02 2018-04-27 四川九洲电器集团有限责任公司 一种印刷电路板
US20180124917A1 (en) 2012-12-17 2018-05-03 Lockheed Martin Corporation System and method for improving isolation in high-density laminated printed circuit boards
JP2018200982A (ja) 2017-05-29 2018-12-20 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器
JP2019029609A (ja) 2017-08-03 2019-02-21 日立化成株式会社 配線基板及びその製造方法
WO2020090672A1 (ja) 2018-10-29 2020-05-07 株式会社村田製作所 アンテナ装置、アンテナモジュール、通信装置およびレーダ装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637416A (ja) * 1992-07-14 1994-02-10 Fujitsu Ltd プリント配線板
JP2605654B2 (ja) 1995-03-31 1997-04-30 日本電気株式会社 複合マイクロ波回路モジュール及びその製造方法
US9159625B1 (en) 2011-01-27 2015-10-13 Amkor Technology, Inc. Semiconductor device
US9807869B2 (en) * 2014-11-21 2017-10-31 Amphenol Corporation Mating backplane for high speed, high density electrical connector
KR102908325B1 (ko) * 2020-12-10 2026-01-05 삼성전기주식회사 인쇄회로기판
CN115499997A (zh) * 2021-06-18 2022-12-20 中兴智能科技南京有限公司 屏蔽结构及电路板

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001135899A (ja) 1999-11-05 2001-05-18 Mitsubishi Electric Corp 高周波プリント配線板及びその製造方法
JP2004014800A (ja) 2002-06-06 2004-01-15 Mitsubishi Electric Corp 多層配線基板
JP2012129350A (ja) 2010-12-15 2012-07-05 Hitachi Ltd 多層プリント基板
JP2013239511A (ja) 2012-05-14 2013-11-28 Mitsubishi Electric Corp 多層基板、プリント回路基板、半導体パッケージ基板、半導体パッケージ、半導体チップ、半導体デバイス、情報処理装置および通信装置
US20180124917A1 (en) 2012-12-17 2018-05-03 Lockheed Martin Corporation System and method for improving isolation in high-density laminated printed circuit boards
JP2015050678A (ja) 2013-09-03 2015-03-16 日本電信電話株式会社 高周波伝送線路
WO2016047492A1 (ja) 2014-09-22 2016-03-31 株式会社フジクラ プリント配線板
JP2017011046A (ja) 2015-06-19 2017-01-12 ホシデン株式会社 多層プリント配線板及び多層プリント配線板とコネクタとの接続構造
JP2018200982A (ja) 2017-05-29 2018-12-20 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器
JP2019029609A (ja) 2017-08-03 2019-02-21 日立化成株式会社 配線基板及びその製造方法
CN107969065A (zh) 2017-11-02 2018-04-27 四川九洲电器集团有限责任公司 一种印刷电路板
WO2020090672A1 (ja) 2018-10-29 2020-05-07 株式会社村田製作所 アンテナ装置、アンテナモジュール、通信装置およびレーダ装置

Also Published As

Publication number Publication date
US20240138055A1 (en) 2024-04-25
CN116918462A (zh) 2023-10-20
US20240237192A9 (en) 2024-07-11
DE112021007188T5 (de) 2023-12-21
WO2022185695A1 (ja) 2022-09-09
US12557208B2 (en) 2026-02-17
JPWO2022185695A1 (https=) 2022-09-09

Similar Documents

Publication Publication Date Title
US6388208B1 (en) Multi-connection via with electrically isolated segments
EP2952074B1 (en) Pcb having offset differential signal routing
KR100839307B1 (ko) 인쇄 회로 기판을 위한 우선적 접지 및 바이어 진출 구조물
US7750249B2 (en) Multilayer printed circuit board and method of manufacturing same
US8134086B2 (en) Electrical isolating structure for conductors in a substrate
EP2785155B1 (en) Circuit board and electronic device
US20180177490A1 (en) Ultrasound probe
US12389532B2 (en) High-frequency circuit
US20200245451A1 (en) Printed circuit boards with non-functional features
US7907418B2 (en) Circuit board including stubless signal paths and method of making same
JP7790422B2 (ja) 高周波回路
JP6996948B2 (ja) 高周波伝送線路
WO2022114205A1 (ja) 多層基板及び電子機器
EP4507459A1 (en) Circuit board and circuit board assembly
WO2017052815A1 (en) Impedance matching interconnect
JP6146071B2 (ja) プリント基板、プリント基板ユニット、及びプリント基板の製造方法
JP7768019B2 (ja) シールドフラットケーブル
JP7823488B2 (ja) シールドフラットケーブル
CN218587412U (zh) 多层基板
JP5306551B1 (ja) 多層回路基板
CN119729994A (zh) 配线板装置及其线路模块
JPWO2022185695A5 (https=)
WO2026070212A1 (ja) 配線基板および実装構造体
WO2025253847A1 (ja) 差動伝送線路及び電子機器
WO2022270294A1 (ja) 多層基板、多層基板モジュール及び電子機器

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230803

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240722

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250701

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250825

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20251111

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251124

R150 Certificate of patent or registration of utility model

Ref document number: 7790422

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150