JPWO2022185695A1 - - Google Patents

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Publication number
JPWO2022185695A1
JPWO2022185695A1 JP2023503589A JP2023503589A JPWO2022185695A1 JP WO2022185695 A1 JPWO2022185695 A1 JP WO2022185695A1 JP 2023503589 A JP2023503589 A JP 2023503589A JP 2023503589 A JP2023503589 A JP 2023503589A JP WO2022185695 A1 JPWO2022185695 A1 JP WO2022185695A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023503589A
Other languages
Japanese (ja)
Other versions
JPWO2022185695A5 (https=
JP7790422B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022185695A1 publication Critical patent/JPWO2022185695A1/ja
Publication of JPWO2022185695A5 publication Critical patent/JPWO2022185695A5/ja
Application granted granted Critical
Publication of JP7790422B2 publication Critical patent/JP7790422B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/026—Coplanar striplines [CPS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023503589A 2021-03-03 2021-12-27 高周波回路 Active JP7790422B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021033122 2021-03-03
JP2021033122 2021-03-03
PCT/JP2021/048525 WO2022185695A1 (ja) 2021-03-03 2021-12-27 高周波回路

Publications (3)

Publication Number Publication Date
JPWO2022185695A1 true JPWO2022185695A1 (https=) 2022-09-09
JPWO2022185695A5 JPWO2022185695A5 (https=) 2023-11-28
JP7790422B2 JP7790422B2 (ja) 2025-12-23

Family

ID=83153959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023503589A Active JP7790422B2 (ja) 2021-03-03 2021-12-27 高周波回路

Country Status (5)

Country Link
US (1) US12557208B2 (https=)
JP (1) JP7790422B2 (https=)
CN (1) CN116918462A (https=)
DE (1) DE112021007188T5 (https=)
WO (1) WO2022185695A1 (https=)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637416A (ja) * 1992-07-14 1994-02-10 Fujitsu Ltd プリント配線板
JP2001135899A (ja) * 1999-11-05 2001-05-18 Mitsubishi Electric Corp 高周波プリント配線板及びその製造方法
JP2004014800A (ja) * 2002-06-06 2004-01-15 Mitsubishi Electric Corp 多層配線基板
JP2012129350A (ja) * 2010-12-15 2012-07-05 Hitachi Ltd 多層プリント基板
JP2013239511A (ja) * 2012-05-14 2013-11-28 Mitsubishi Electric Corp 多層基板、プリント回路基板、半導体パッケージ基板、半導体パッケージ、半導体チップ、半導体デバイス、情報処理装置および通信装置
JP2015050678A (ja) * 2013-09-03 2015-03-16 日本電信電話株式会社 高周波伝送線路
US9159625B1 (en) * 2011-01-27 2015-10-13 Amkor Technology, Inc. Semiconductor device
WO2016047492A1 (ja) * 2014-09-22 2016-03-31 株式会社フジクラ プリント配線板
JP2017011046A (ja) * 2015-06-19 2017-01-12 ホシデン株式会社 多層プリント配線板及び多層プリント配線板とコネクタとの接続構造
CN107969065A (zh) * 2017-11-02 2018-04-27 四川九洲电器集团有限责任公司 一种印刷电路板
US20180124917A1 (en) * 2012-12-17 2018-05-03 Lockheed Martin Corporation System and method for improving isolation in high-density laminated printed circuit boards
JP2018200982A (ja) * 2017-05-29 2018-12-20 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器
JP2019029609A (ja) * 2017-08-03 2019-02-21 日立化成株式会社 配線基板及びその製造方法
WO2020090672A1 (ja) * 2018-10-29 2020-05-07 株式会社村田製作所 アンテナ装置、アンテナモジュール、通信装置およびレーダ装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2605654B2 (ja) 1995-03-31 1997-04-30 日本電気株式会社 複合マイクロ波回路モジュール及びその製造方法
US9807869B2 (en) * 2014-11-21 2017-10-31 Amphenol Corporation Mating backplane for high speed, high density electrical connector
KR102908325B1 (ko) * 2020-12-10 2026-01-05 삼성전기주식회사 인쇄회로기판
CN115499997A (zh) * 2021-06-18 2022-12-20 中兴智能科技南京有限公司 屏蔽结构及电路板

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637416A (ja) * 1992-07-14 1994-02-10 Fujitsu Ltd プリント配線板
JP2001135899A (ja) * 1999-11-05 2001-05-18 Mitsubishi Electric Corp 高周波プリント配線板及びその製造方法
JP2004014800A (ja) * 2002-06-06 2004-01-15 Mitsubishi Electric Corp 多層配線基板
JP2012129350A (ja) * 2010-12-15 2012-07-05 Hitachi Ltd 多層プリント基板
US9159625B1 (en) * 2011-01-27 2015-10-13 Amkor Technology, Inc. Semiconductor device
JP2013239511A (ja) * 2012-05-14 2013-11-28 Mitsubishi Electric Corp 多層基板、プリント回路基板、半導体パッケージ基板、半導体パッケージ、半導体チップ、半導体デバイス、情報処理装置および通信装置
US20180124917A1 (en) * 2012-12-17 2018-05-03 Lockheed Martin Corporation System and method for improving isolation in high-density laminated printed circuit boards
JP2015050678A (ja) * 2013-09-03 2015-03-16 日本電信電話株式会社 高周波伝送線路
WO2016047492A1 (ja) * 2014-09-22 2016-03-31 株式会社フジクラ プリント配線板
JP2017011046A (ja) * 2015-06-19 2017-01-12 ホシデン株式会社 多層プリント配線板及び多層プリント配線板とコネクタとの接続構造
JP2018200982A (ja) * 2017-05-29 2018-12-20 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器
JP2019029609A (ja) * 2017-08-03 2019-02-21 日立化成株式会社 配線基板及びその製造方法
CN107969065A (zh) * 2017-11-02 2018-04-27 四川九洲电器集团有限责任公司 一种印刷电路板
WO2020090672A1 (ja) * 2018-10-29 2020-05-07 株式会社村田製作所 アンテナ装置、アンテナモジュール、通信装置およびレーダ装置

Also Published As

Publication number Publication date
US20240138055A1 (en) 2024-04-25
CN116918462A (zh) 2023-10-20
US20240237192A9 (en) 2024-07-11
DE112021007188T5 (de) 2023-12-21
JP7790422B2 (ja) 2025-12-23
WO2022185695A1 (ja) 2022-09-09
US12557208B2 (en) 2026-02-17

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