CN116918462A - 高频电路 - Google Patents

高频电路 Download PDF

Info

Publication number
CN116918462A
CN116918462A CN202180094520.1A CN202180094520A CN116918462A CN 116918462 A CN116918462 A CN 116918462A CN 202180094520 A CN202180094520 A CN 202180094520A CN 116918462 A CN116918462 A CN 116918462A
Authority
CN
China
Prior art keywords
insulating layer
wiring
frequency circuit
ground
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180094520.1A
Other languages
English (en)
Chinese (zh)
Inventor
五十岚俊
上田宏
山岸杰
桑山一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of CN116918462A publication Critical patent/CN116918462A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/026—Coplanar striplines [CPS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202180094520.1A 2021-03-03 2021-12-27 高频电路 Pending CN116918462A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021033122 2021-03-03
JP2021-033122 2021-03-03
PCT/JP2021/048525 WO2022185695A1 (ja) 2021-03-03 2021-12-27 高周波回路

Publications (1)

Publication Number Publication Date
CN116918462A true CN116918462A (zh) 2023-10-20

Family

ID=83153959

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180094520.1A Pending CN116918462A (zh) 2021-03-03 2021-12-27 高频电路

Country Status (5)

Country Link
US (1) US12557208B2 (https=)
JP (1) JP7790422B2 (https=)
CN (1) CN116918462A (https=)
DE (1) DE112021007188T5 (https=)
WO (1) WO2022185695A1 (https=)

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637416A (ja) * 1992-07-14 1994-02-10 Fujitsu Ltd プリント配線板
JP2605654B2 (ja) 1995-03-31 1997-04-30 日本電気株式会社 複合マイクロ波回路モジュール及びその製造方法
JP3654095B2 (ja) 1999-11-05 2005-06-02 三菱電機株式会社 高周波プリント配線板及びその製造方法
JP2004014800A (ja) 2002-06-06 2004-01-15 Mitsubishi Electric Corp 多層配線基板
JP2012129350A (ja) 2010-12-15 2012-07-05 Hitachi Ltd 多層プリント基板
US9159625B1 (en) 2011-01-27 2015-10-13 Amkor Technology, Inc. Semiconductor device
JP5950683B2 (ja) 2012-05-14 2016-07-13 三菱電機株式会社 多層基板、プリント回路基板、半導体パッケージ基板、半導体パッケージ、半導体チップ、半導体デバイス、情報処理装置および通信装置
US9860985B1 (en) 2012-12-17 2018-01-02 Lockheed Martin Corporation System and method for improving isolation in high-density laminated printed circuit boards
JP6013296B2 (ja) 2013-09-03 2016-10-25 日本電信電話株式会社 高周波伝送線路
JP6190345B2 (ja) 2014-09-22 2017-08-30 株式会社フジクラ プリント配線板
US9807869B2 (en) * 2014-11-21 2017-10-31 Amphenol Corporation Mating backplane for high speed, high density electrical connector
JP6600176B2 (ja) 2015-06-19 2019-10-30 ホシデン株式会社 多層プリント配線板及び多層プリント配線板とコネクタとの接続構造
JP2018200982A (ja) * 2017-05-29 2018-12-20 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板の製造方法及び電子機器
JP2019029609A (ja) 2017-08-03 2019-02-21 日立化成株式会社 配線基板及びその製造方法
CN107969065B (zh) 2017-11-02 2020-12-08 四川九洲电器集团有限责任公司 一种印刷电路板
DE112019004921T5 (de) 2018-10-29 2021-06-17 Murata Manufacturing Co., Ltd. Antennenvorrichtung, antennenmodul, kommunikationsvorrichtung und radarvorrichtung
KR102908325B1 (ko) * 2020-12-10 2026-01-05 삼성전기주식회사 인쇄회로기판
CN115499997A (zh) * 2021-06-18 2022-12-20 中兴智能科技南京有限公司 屏蔽结构及电路板

Also Published As

Publication number Publication date
US20240138055A1 (en) 2024-04-25
US20240237192A9 (en) 2024-07-11
DE112021007188T5 (de) 2023-12-21
JP7790422B2 (ja) 2025-12-23
WO2022185695A1 (ja) 2022-09-09
US12557208B2 (en) 2026-02-17
JPWO2022185695A1 (https=) 2022-09-09

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