JP7746298B2 - 超音波溶接システム、その使用方法、および溶接された導電性ピンを含む関連被加工物 - Google Patents

超音波溶接システム、その使用方法、および溶接された導電性ピンを含む関連被加工物

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Publication number
JP7746298B2
JP7746298B2 JP2022572295A JP2022572295A JP7746298B2 JP 7746298 B2 JP7746298 B2 JP 7746298B2 JP 2022572295 A JP2022572295 A JP 2022572295A JP 2022572295 A JP2022572295 A JP 2022572295A JP 7746298 B2 JP7746298 B2 JP 7746298B2
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JP
Japan
Prior art keywords
conductive pin
workpiece
sonotrode
ultrasonic welding
welding system
Prior art date
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Active
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JP2022572295A
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English (en)
Japanese (ja)
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JP2023527970A5 (https=
JP2023527970A (ja
JPWO2021247414A5 (https=
Inventor
ジェイ． カッパーサイト、セオドア
ジェイ． マッカートニー、リチャード
ナイアエシュ、オミッド
Original Assignee
クリック アンド ソッファ インダストリーズ、インク．
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Publication of JP2023527970A publication Critical patent/JP2023527970A/ja
Publication of JP2023527970A5 publication Critical patent/JP2023527970A5/ja
Publication of JPWO2021247414A5 publication Critical patent/JPWO2021247414A5/ja
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Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP2022572295A 2020-06-03 2021-05-28 超音波溶接システム、その使用方法、および溶接された導電性ピンを含む関連被加工物 Active JP7746298B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063034345P 2020-06-03 2020-06-03
US63/034,345 2020-06-03
PCT/US2021/034847 WO2021247414A1 (en) 2020-06-03 2021-05-28 Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins

Publications (4)

Publication Number Publication Date
JP2023527970A JP2023527970A (ja) 2023-07-03
JP2023527970A5 JP2023527970A5 (https=) 2024-05-28
JPWO2021247414A5 JPWO2021247414A5 (https=) 2024-05-28
JP7746298B2 true JP7746298B2 (ja) 2025-09-30

Family

ID=78816841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022572295A Active JP7746298B2 (ja) 2020-06-03 2021-05-28 超音波溶接システム、その使用方法、および溶接された導電性ピンを含む関連被加工物

Country Status (6)

Country Link
US (3) US11850676B2 (https=)
EP (1) EP4161726A4 (https=)
JP (1) JP7746298B2 (https=)
KR (1) KR20230019842A (https=)
CN (1) CN115697615A (https=)
WO (1) WO2021247414A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11850676B2 (en) * 2020-06-03 2023-12-26 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins
DE212022000141U1 (de) * 2021-11-19 2024-02-16 Lg Energy Solution, Ltd. Ultraschallschweißvorrichtung
WO2024220203A1 (en) * 2023-04-18 2024-10-24 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems, sonotrodes and conductive pins for such systems, and related methods and workpieces
CN120981314A (zh) * 2023-04-19 2025-11-18 库利克和索夫工业公司 用于导电引脚的超声焊接系统和相关方法
US20250187103A1 (en) * 2023-12-07 2025-06-12 Kulicke And Soffa Industries, Inc. Conductive pins, power modules, ultrasonic welding systems, and methods of using the same
US20260014641A1 (en) * 2024-07-11 2026-01-15 Kulicke And Soffa Industries, Inc. Sonotrodes for ultrasonic welding systems, ultrasonic welding systems, and related methods

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US20140370663A1 (en) 2013-06-18 2014-12-18 Infineon Technologies Ag Method for Producing a Semiconductor Module
JP2015198250A (ja) 2014-03-31 2015-11-09 ゼミクロン エレクトローニク ゲーエムベーハー ウント コンパニー カーゲー 接続要素を溶接によってパワー半導体モジュールの基板に接続する装置及びそれに関連する方法
JP2016072305A (ja) 2014-09-26 2016-05-09 富士電機株式会社 半導体装置の製造装置及び半導体装置
US20200164460A1 (en) 2018-11-28 2020-05-28 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems and methods of using the same
CN112367772A (zh) 2020-10-28 2021-02-12 安徽瑞迪微电子有限公司 Igbt功率模块端子压焊方法

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Publication number Publication date
WO2021247414A1 (en) 2021-12-09
US11850676B2 (en) 2023-12-26
JP2023527970A (ja) 2023-07-03
US20240359255A1 (en) 2024-10-31
US12070814B2 (en) 2024-08-27
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