JP7739463B2 - 配線基板 - Google Patents

配線基板

Info

Publication number
JP7739463B2
JP7739463B2 JP2023570947A JP2023570947A JP7739463B2 JP 7739463 B2 JP7739463 B2 JP 7739463B2 JP 2023570947 A JP2023570947 A JP 2023570947A JP 2023570947 A JP2023570947 A JP 2023570947A JP 7739463 B2 JP7739463 B2 JP 7739463B2
Authority
JP
Japan
Prior art keywords
conductor
crystallites
via conductor
layer
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023570947A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023127705A1 (https=
JPWO2023127705A5 (https=
Inventor
裕明 佐野
登志文 東
晃 井本
貴史 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023127705A1 publication Critical patent/JPWO2023127705A1/ja
Publication of JPWO2023127705A5 publication Critical patent/JPWO2023127705A5/ja
Application granted granted Critical
Publication of JP7739463B2 publication Critical patent/JP7739463B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2023570947A 2021-12-28 2022-12-22 配線基板 Active JP7739463B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021215303 2021-12-28
JP2021215303 2021-12-28
PCT/JP2022/047494 WO2023127705A1 (ja) 2021-12-28 2022-12-22 配線基板

Publications (3)

Publication Number Publication Date
JPWO2023127705A1 JPWO2023127705A1 (https=) 2023-07-06
JPWO2023127705A5 JPWO2023127705A5 (https=) 2024-09-06
JP7739463B2 true JP7739463B2 (ja) 2025-09-16

Family

ID=86999222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023570947A Active JP7739463B2 (ja) 2021-12-28 2022-12-22 配線基板

Country Status (5)

Country Link
US (1) US20250120016A1 (https=)
EP (1) EP4460156A1 (https=)
JP (1) JP7739463B2 (https=)
CN (1) CN118511657A (https=)
WO (1) WO2023127705A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277852A (ja) 2002-03-25 2003-10-02 Kyocera Corp 銅メタライズ組成物およびセラミック配線基板
JP2004134378A (ja) 2002-07-17 2004-04-30 Ngk Spark Plug Co Ltd 銅ペーストとそれを用いた配線基板
JP2005243789A (ja) 2004-02-25 2005-09-08 Kyocera Corp セラミック電子部品の製法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7207867B2 (ja) 2018-05-30 2023-01-18 京セラ株式会社 配線基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277852A (ja) 2002-03-25 2003-10-02 Kyocera Corp 銅メタライズ組成物およびセラミック配線基板
JP2004134378A (ja) 2002-07-17 2004-04-30 Ngk Spark Plug Co Ltd 銅ペーストとそれを用いた配線基板
JP2005243789A (ja) 2004-02-25 2005-09-08 Kyocera Corp セラミック電子部品の製法

Also Published As

Publication number Publication date
WO2023127705A1 (ja) 2023-07-06
US20250120016A1 (en) 2025-04-10
EP4460156A1 (en) 2024-11-06
JPWO2023127705A1 (https=) 2023-07-06
CN118511657A (zh) 2024-08-16

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