JPWO2023127705A1 - - Google Patents

Info

Publication number
JPWO2023127705A1
JPWO2023127705A1 JP2023570947A JP2023570947A JPWO2023127705A1 JP WO2023127705 A1 JPWO2023127705 A1 JP WO2023127705A1 JP 2023570947 A JP2023570947 A JP 2023570947A JP 2023570947 A JP2023570947 A JP 2023570947A JP WO2023127705 A1 JPWO2023127705 A1 JP WO2023127705A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023570947A
Other languages
Japanese (ja)
Other versions
JP7739463B2 (ja
JPWO2023127705A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023127705A1 publication Critical patent/JPWO2023127705A1/ja
Publication of JPWO2023127705A5 publication Critical patent/JPWO2023127705A5/ja
Application granted granted Critical
Publication of JP7739463B2 publication Critical patent/JP7739463B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2023570947A 2021-12-28 2022-12-22 配線基板 Active JP7739463B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021215303 2021-12-28
JP2021215303 2021-12-28
PCT/JP2022/047494 WO2023127705A1 (ja) 2021-12-28 2022-12-22 配線基板

Publications (3)

Publication Number Publication Date
JPWO2023127705A1 true JPWO2023127705A1 (https=) 2023-07-06
JPWO2023127705A5 JPWO2023127705A5 (https=) 2024-09-06
JP7739463B2 JP7739463B2 (ja) 2025-09-16

Family

ID=86999222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023570947A Active JP7739463B2 (ja) 2021-12-28 2022-12-22 配線基板

Country Status (5)

Country Link
US (1) US20250120016A1 (https=)
EP (1) EP4460156A1 (https=)
JP (1) JP7739463B2 (https=)
CN (1) CN118511657A (https=)
WO (1) WO2023127705A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277852A (ja) * 2002-03-25 2003-10-02 Kyocera Corp 銅メタライズ組成物およびセラミック配線基板
JP2004134378A (ja) * 2002-07-17 2004-04-30 Ngk Spark Plug Co Ltd 銅ペーストとそれを用いた配線基板
JP2005243789A (ja) * 2004-02-25 2005-09-08 Kyocera Corp セラミック電子部品の製法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7207867B2 (ja) 2018-05-30 2023-01-18 京セラ株式会社 配線基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277852A (ja) * 2002-03-25 2003-10-02 Kyocera Corp 銅メタライズ組成物およびセラミック配線基板
JP2004134378A (ja) * 2002-07-17 2004-04-30 Ngk Spark Plug Co Ltd 銅ペーストとそれを用いた配線基板
JP2005243789A (ja) * 2004-02-25 2005-09-08 Kyocera Corp セラミック電子部品の製法

Also Published As

Publication number Publication date
WO2023127705A1 (ja) 2023-07-06
JP7739463B2 (ja) 2025-09-16
US20250120016A1 (en) 2025-04-10
EP4460156A1 (en) 2024-11-06
CN118511657A (zh) 2024-08-16

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