JP7677362B2 - 貫通電極基板および半導体装置 - Google Patents

貫通電極基板および半導体装置 Download PDF

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Publication number
JP7677362B2
JP7677362B2 JP2023031648A JP2023031648A JP7677362B2 JP 7677362 B2 JP7677362 B2 JP 7677362B2 JP 2023031648 A JP2023031648 A JP 2023031648A JP 2023031648 A JP2023031648 A JP 2023031648A JP 7677362 B2 JP7677362 B2 JP 7677362B2
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Prior art keywords
hole
metal layer
shape
electrode substrate
substrate
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JP2023031648A
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Japanese (ja)
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JP2023075206A (ja
Inventor
悟 倉持
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority claimed from JP2022093190A external-priority patent/JP7239045B2/ja
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Priority to JP2023031648A priority Critical patent/JP7677362B2/ja
Publication of JP2023075206A publication Critical patent/JP2023075206A/ja
Priority to JP2025075422A priority patent/JP2025111734A/ja
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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2023031648A 2022-06-08 2023-03-02 貫通電極基板および半導体装置 Active JP7677362B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023031648A JP7677362B2 (ja) 2022-06-08 2023-03-02 貫通電極基板および半導体装置
JP2025075422A JP2025111734A (ja) 2022-06-08 2025-04-30 貫通電極基板および半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022093190A JP7239045B2 (ja) 2020-12-02 2022-06-08 貫通電極基板および半導体装置
JP2023031648A JP7677362B2 (ja) 2022-06-08 2023-03-02 貫通電極基板および半導体装置

Related Parent Applications (1)

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JP2022093190A Division JP7239045B2 (ja) 2020-12-02 2022-06-08 貫通電極基板および半導体装置

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JP2025075422A Division JP2025111734A (ja) 2022-06-08 2025-04-30 貫通電極基板および半導体装置

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JP2023075206A JP2023075206A (ja) 2023-05-30
JP7677362B2 true JP7677362B2 (ja) 2025-05-15

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JP2023031648A Active JP7677362B2 (ja) 2022-06-08 2023-03-02 貫通電極基板および半導体装置
JP2025075422A Withdrawn JP2025111734A (ja) 2022-06-08 2025-04-30 貫通電極基板および半導体装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025111734A (ja) * 2022-06-08 2025-07-30 大日本印刷株式会社 貫通電極基板および半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014139963A (ja) 2013-01-21 2014-07-31 Ngk Spark Plug Co Ltd ガラス基板の製造方法
JP2015146410A (ja) 2014-02-04 2015-08-13 大日本印刷株式会社 ガラスインターポーザー基板、ガラスインターポーザー基板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04154187A (ja) * 1990-10-18 1992-05-27 Mitsubishi Materials Corp スルーホール配線板の構造及びその製造方法
JP2003218518A (ja) * 2002-01-28 2003-07-31 Tokuyama Corp 回路基板の製造方法
JP6056386B2 (ja) * 2012-11-02 2017-01-11 凸版印刷株式会社 貫通電極付き配線基板及びその製造方法
JP6250309B2 (ja) * 2013-06-14 2017-12-20 日本特殊陶業株式会社 多層配線基板の製造方法
US9517963B2 (en) * 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
JP7610400B2 (ja) * 2020-12-11 2025-01-08 日本放送協会 配信サーバ、受信装置、動画配信システム、及びプログラム
JP7677362B2 (ja) * 2022-06-08 2025-05-15 大日本印刷株式会社 貫通電極基板および半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014139963A (ja) 2013-01-21 2014-07-31 Ngk Spark Plug Co Ltd ガラス基板の製造方法
JP2015146410A (ja) 2014-02-04 2015-08-13 大日本印刷株式会社 ガラスインターポーザー基板、ガラスインターポーザー基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025111734A (ja) * 2022-06-08 2025-07-30 大日本印刷株式会社 貫通電極基板および半導体装置

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JP2023075206A (ja) 2023-05-30

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