JP7677346B2 - ポリイミド前駆体、ポリイミド、及びフレキシブルプリント回路基板 - Google Patents

ポリイミド前駆体、ポリイミド、及びフレキシブルプリント回路基板 Download PDF

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Publication number
JP7677346B2
JP7677346B2 JP2022561936A JP2022561936A JP7677346B2 JP 7677346 B2 JP7677346 B2 JP 7677346B2 JP 2022561936 A JP2022561936 A JP 2022561936A JP 2022561936 A JP2022561936 A JP 2022561936A JP 7677346 B2 JP7677346 B2 JP 7677346B2
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Prior art keywords
polyimide
diamine
mol
less
structural units
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Japanese (ja)
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JPWO2022102616A1 (https=
Inventor
智亮 前野
泰典 川端
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2022102616A1 publication Critical patent/JPWO2022102616A1/ja
Priority to JP2025037518A priority Critical patent/JP2025087874A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022561936A 2020-11-10 2021-11-09 ポリイミド前駆体、ポリイミド、及びフレキシブルプリント回路基板 Active JP7677346B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025037518A JP2025087874A (ja) 2020-11-10 2025-03-10 ポリイミド前駆体、ポリイミド、及びフレキシブルプリント回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2020/041929 2020-11-10
PCT/JP2020/041929 WO2022101984A1 (ja) 2020-11-10 2020-11-10 ポリイミド前駆体、ポリイミド、及びフレキシブル基板
PCT/JP2021/041200 WO2022102616A1 (ja) 2020-11-10 2021-11-09 ポリイミド前駆体、ポリイミド、及びフレキシブルプリント回路基板

Related Child Applications (1)

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JP2025037518A Division JP2025087874A (ja) 2020-11-10 2025-03-10 ポリイミド前駆体、ポリイミド、及びフレキシブルプリント回路基板

Publications (2)

Publication Number Publication Date
JPWO2022102616A1 JPWO2022102616A1 (https=) 2022-05-19
JP7677346B2 true JP7677346B2 (ja) 2025-05-15

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JP2022561936A Active JP7677346B2 (ja) 2020-11-10 2021-11-09 ポリイミド前駆体、ポリイミド、及びフレキシブルプリント回路基板
JP2025037518A Pending JP2025087874A (ja) 2020-11-10 2025-03-10 ポリイミド前駆体、ポリイミド、及びフレキシブルプリント回路基板

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JP2025037518A Pending JP2025087874A (ja) 2020-11-10 2025-03-10 ポリイミド前駆体、ポリイミド、及びフレキシブルプリント回路基板

Country Status (5)

Country Link
US (1) US20230391955A1 (https=)
JP (2) JP7677346B2 (https=)
CN (1) CN116457391A (https=)
TW (1) TWI898078B (https=)
WO (2) WO2022101984A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12247116B2 (en) * 2021-12-01 2025-03-11 Ticona Llc Antenna module

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010256532A (ja) 2009-04-23 2010-11-11 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及びこれを用いたレジストパターンの形成方法
JP2013112735A (ja) 2011-11-28 2013-06-10 Ube Industries Ltd ポリイミド溶液組成物
JP2013155329A (ja) 2012-01-31 2013-08-15 T & K Toka Co Ltd 溶剤可溶性ポリイミド樹脂及びその製造方法、並びに前記ポリイミド樹脂を含有するポリイミド組成物、ポリイミドフィルム、及びコーティング物品
WO2014148441A1 (ja) 2013-03-18 2014-09-25 旭化成イーマテリアルズ株式会社 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法
JP2015127117A (ja) 2013-12-27 2015-07-09 新日鉄住金化学株式会社 金属張積層体及び回路基板
JP2015526561A (ja) 2012-08-24 2015-09-10 クローダ インターナショナル パブリック リミティド カンパニー ポリイミド組成物
WO2016088641A1 (ja) 2014-12-04 2016-06-09 コニカミノルタ株式会社 ポリイミドフィルムとその製造方法、フレキシブルプリント基板、フレキシブルディスプレイ用基材、フレキシブルディスプレイ用前面板、ｌｅｄ照明装置及び有機エレクトロルミネッセンス表示装置
JP2016188298A (ja) 2015-03-30 2016-11-04 新日鉄住金化学株式会社 ポリイミド、樹脂フィルム、金属張積層体及び回路基板
JP2018140544A (ja) 2017-02-28 2018-09-13 新日鉄住金化学株式会社 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板
JP2018174286A (ja) 2017-03-31 2018-11-08 新日鉄住金化学株式会社 多層回路基板
JP2020076072A (ja) 2018-10-12 2020-05-21 ユニチカ株式会社 ポリイミドフィルム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6825368B2 (ja) * 2016-01-05 2021-02-03 荒川化学工業株式会社 銅張積層体及びプリント配線板
JP7203409B2 (ja) * 2018-10-25 2023-01-13 ユニチカ株式会社 ビスマレイミド
TWI855057B (zh) * 2019-04-19 2024-09-11 美商設計者分子公司 高分子量撓性可固化聚醯亞胺

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010256532A (ja) 2009-04-23 2010-11-11 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及びこれを用いたレジストパターンの形成方法
JP2013112735A (ja) 2011-11-28 2013-06-10 Ube Industries Ltd ポリイミド溶液組成物
JP2013155329A (ja) 2012-01-31 2013-08-15 T & K Toka Co Ltd 溶剤可溶性ポリイミド樹脂及びその製造方法、並びに前記ポリイミド樹脂を含有するポリイミド組成物、ポリイミドフィルム、及びコーティング物品
JP2015526561A (ja) 2012-08-24 2015-09-10 クローダ インターナショナル パブリック リミティド カンパニー ポリイミド組成物
WO2014148441A1 (ja) 2013-03-18 2014-09-25 旭化成イーマテリアルズ株式会社 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法
JP2015127117A (ja) 2013-12-27 2015-07-09 新日鉄住金化学株式会社 金属張積層体及び回路基板
WO2016088641A1 (ja) 2014-12-04 2016-06-09 コニカミノルタ株式会社 ポリイミドフィルムとその製造方法、フレキシブルプリント基板、フレキシブルディスプレイ用基材、フレキシブルディスプレイ用前面板、ｌｅｄ照明装置及び有機エレクトロルミネッセンス表示装置
JP2016188298A (ja) 2015-03-30 2016-11-04 新日鉄住金化学株式会社 ポリイミド、樹脂フィルム、金属張積層体及び回路基板
JP2018140544A (ja) 2017-02-28 2018-09-13 新日鉄住金化学株式会社 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板
JP2018174286A (ja) 2017-03-31 2018-11-08 新日鉄住金化学株式会社 多層回路基板
JP2020076072A (ja) 2018-10-12 2020-05-21 ユニチカ株式会社 ポリイミドフィルム

Also Published As

Publication number Publication date
WO2022102616A1 (ja) 2022-05-19
CN116457391A (zh) 2023-07-18
US20230391955A1 (en) 2023-12-07
JP2025087874A (ja) 2025-06-10
JPWO2022102616A1 (https=) 2022-05-19
WO2022101984A1 (ja) 2022-05-19
TW202229004A (zh) 2022-08-01
TWI898078B (zh) 2025-09-21

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