TWI898078B - 聚醯亞胺前驅體、樹脂組成物、聚醯亞胺、聚醯亞胺成形體及可撓性印刷電路基板 - Google Patents

聚醯亞胺前驅體、樹脂組成物、聚醯亞胺、聚醯亞胺成形體及可撓性印刷電路基板

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Publication number
TWI898078B
TWI898078B TW110141870A TW110141870A TWI898078B TW I898078 B TWI898078 B TW I898078B TW 110141870 A TW110141870 A TW 110141870A TW 110141870 A TW110141870 A TW 110141870A TW I898078 B TWI898078 B TW I898078B
Authority
TW
Taiwan
Prior art keywords
polyimide
units derived
structural units
diamine
mol
Prior art date
Application number
TW110141870A
Other languages
English (en)
Chinese (zh)
Other versions
TW202229004A (zh
Inventor
前野智亮
川端泰典
Original Assignee
日商力森諾科股份有限公司
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Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202229004A publication Critical patent/TW202229004A/zh
Application granted granted Critical
Publication of TWI898078B publication Critical patent/TWI898078B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW110141870A 2020-11-10 2021-11-10 聚醯亞胺前驅體、樹脂組成物、聚醯亞胺、聚醯亞胺成形體及可撓性印刷電路基板 TWI898078B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2020/041929 2020-11-10
PCT/JP2020/041929 WO2022101984A1 (ja) 2020-11-10 2020-11-10 ポリイミド前駆体、ポリイミド、及びフレキシブル基板

Publications (2)

Publication Number Publication Date
TW202229004A TW202229004A (zh) 2022-08-01
TWI898078B true TWI898078B (zh) 2025-09-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW110141870A TWI898078B (zh) 2020-11-10 2021-11-10 聚醯亞胺前驅體、樹脂組成物、聚醯亞胺、聚醯亞胺成形體及可撓性印刷電路基板

Country Status (5)

Country Link
US (1) US20230391955A1 (https=)
JP (2) JP7677346B2 (https=)
CN (1) CN116457391A (https=)
TW (1) TWI898078B (https=)
WO (2) WO2022101984A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12247116B2 (en) * 2021-12-01 2025-03-11 Ticona Llc Antenna module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6306586B2 (ja) * 2012-08-24 2018-04-04 クローダ インターナショナル パブリック リミティド カンパニー ポリイミド組成物
JP2018174286A (ja) * 2017-03-31 2018-11-08 新日鉄住金化学株式会社 多層回路基板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010256532A (ja) * 2009-04-23 2010-11-11 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及びこれを用いたレジストパターンの形成方法
JP5879971B2 (ja) * 2011-11-28 2016-03-08 宇部興産株式会社 ポリイミド溶液組成物
JP2013155329A (ja) * 2012-01-31 2013-08-15 T & K Toka Co Ltd 溶剤可溶性ポリイミド樹脂及びその製造方法、並びに前記ポリイミド樹脂を含有するポリイミド組成物、ポリイミドフィルム、及びコーティング物品
JPWO2014148441A1 (ja) * 2013-03-18 2017-02-16 旭化成株式会社 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法
JP2015127117A (ja) * 2013-12-27 2015-07-09 新日鉄住金化学株式会社 金属張積層体及び回路基板
JP6638654B2 (ja) * 2014-12-04 2020-01-29 コニカミノルタ株式会社 ポリイミドフィルムとその製造方法、フレキシブルプリント基板、フレキシブルディスプレイ用基材、フレキシブルディスプレイ用前面板、ｌｅｄ照明装置及び有機エレクトロルミネッセンス表示装置
JP2016188298A (ja) * 2015-03-30 2016-11-04 新日鉄住金化学株式会社 ポリイミド、樹脂フィルム、金属張積層体及び回路基板
JP6825368B2 (ja) * 2016-01-05 2021-02-03 荒川化学工業株式会社 銅張積層体及びプリント配線板
JP7479781B2 (ja) * 2017-02-28 2024-05-09 日鉄ケミカル＆マテリアル株式会社 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板
TWI788596B (zh) * 2018-10-12 2023-01-01 日商尤尼吉可股份有限公司 聚醯亞胺薄膜及包含其之軟性銅箔積層板
JP7203409B2 (ja) * 2018-10-25 2023-01-13 ユニチカ株式会社 ビスマレイミド
TWI855057B (zh) * 2019-04-19 2024-09-11 美商設計者分子公司 高分子量撓性可固化聚醯亞胺

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6306586B2 (ja) * 2012-08-24 2018-04-04 クローダ インターナショナル パブリック リミティド カンパニー ポリイミド組成物
JP2018174286A (ja) * 2017-03-31 2018-11-08 新日鉄住金化学株式会社 多層回路基板

Also Published As

Publication number Publication date
WO2022102616A1 (ja) 2022-05-19
CN116457391A (zh) 2023-07-18
JP7677346B2 (ja) 2025-05-15
US20230391955A1 (en) 2023-12-07
JP2025087874A (ja) 2025-06-10
JPWO2022102616A1 (https=) 2022-05-19
WO2022101984A1 (ja) 2022-05-19
TW202229004A (zh) 2022-08-01

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