JP7658992B2 - 複合材料、半導体パッケージ及び複合材料の製造方法 - Google Patents

複合材料、半導体パッケージ及び複合材料の製造方法 Download PDF

Info

Publication number
JP7658992B2
JP7658992B2 JP2022571545A JP2022571545A JP7658992B2 JP 7658992 B2 JP7658992 B2 JP 7658992B2 JP 2022571545 A JP2022571545 A JP 2022571545A JP 2022571545 A JP2022571545 A JP 2022571545A JP 7658992 B2 JP7658992 B2 JP 7658992B2
Authority
JP
Japan
Prior art keywords
composite material
layer
thickness
percent
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022571545A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022138711A1 (https=
JPWO2022138711A5 (https=
Inventor
徹 前田
美紀 宮永
大介 近藤
慧 平井
正幸 伊藤
伸一 山形
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALMT Corp
Sumitomo Electric Industries Ltd
Original Assignee
ALMT Corp
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ALMT Corp, Sumitomo Electric Industries Ltd filed Critical ALMT Corp
Publication of JPWO2022138711A1 publication Critical patent/JPWO2022138711A1/ja
Publication of JPWO2022138711A5 publication Critical patent/JPWO2022138711A5/ja
Application granted granted Critical
Publication of JP7658992B2 publication Critical patent/JP7658992B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Engineering (AREA)
JP2022571545A 2020-12-24 2021-12-22 複合材料、半導体パッケージ及び複合材料の製造方法 Active JP7658992B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020214612 2020-12-24
JP2020214612 2020-12-24
PCT/JP2021/047541 WO2022138711A1 (ja) 2020-12-24 2021-12-22 複合材料、半導体パッケージ及び複合材料の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022138711A1 JPWO2022138711A1 (https=) 2022-06-30
JPWO2022138711A5 JPWO2022138711A5 (https=) 2024-07-30
JP7658992B2 true JP7658992B2 (ja) 2025-04-08

Family

ID=82159785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022571545A Active JP7658992B2 (ja) 2020-12-24 2021-12-22 複合材料、半導体パッケージ及び複合材料の製造方法

Country Status (6)

Country Link
US (1) US12451407B2 (https=)
JP (1) JP7658992B2 (https=)
KR (1) KR102860491B1 (https=)
CN (1) CN116648315A (https=)
DE (1) DE112021006684T5 (https=)
WO (1) WO2022138711A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117531833B (zh) * 2024-01-10 2024-04-02 太原理工大学 一种大厚比镁/钛复合板脉冲电流辅助轧制复合方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007115731A (ja) 2005-10-18 2007-05-10 Eiki Tsushima クラッド材およびその製造方法、クラッド材の成型方法、クラッド材を用いた放熱基板
JP2007142126A (ja) 2005-11-18 2007-06-07 Allied Material Corp 複合材料及び半導体搭載用放熱基板、及びそれを用いたセラミックパッケージ
WO2015182385A1 (ja) 2014-05-29 2015-12-03 株式会社アライドマテリアル ヒートスプレッダとその製造方法
JP6732395B1 (ja) 2019-08-29 2020-07-29 Jfe精密株式会社 放熱板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06268117A (ja) * 1993-03-15 1994-09-22 Sumitomo Electric Ind Ltd 半導体装置用放熱基板およびその製造方法
JP2005340560A (ja) * 2004-05-28 2005-12-08 Kyocera Corp 電子部品収納用パッケージおよび電子装置
JP4227610B2 (ja) * 2005-10-03 2009-02-18 京セラ株式会社 放熱基体の製造方法
US10347559B2 (en) * 2011-03-16 2019-07-09 Momentive Performance Materials Inc. High thermal conductivity/low coefficient of thermal expansion composites
JP6455896B1 (ja) 2017-11-18 2019-01-23 Jfe精密株式会社 放熱板及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007115731A (ja) 2005-10-18 2007-05-10 Eiki Tsushima クラッド材およびその製造方法、クラッド材の成型方法、クラッド材を用いた放熱基板
JP2007142126A (ja) 2005-11-18 2007-06-07 Allied Material Corp 複合材料及び半導体搭載用放熱基板、及びそれを用いたセラミックパッケージ
WO2015182385A1 (ja) 2014-05-29 2015-12-03 株式会社アライドマテリアル ヒートスプレッダとその製造方法
JP6732395B1 (ja) 2019-08-29 2020-07-29 Jfe精密株式会社 放熱板

Also Published As

Publication number Publication date
DE112021006684T5 (de) 2023-10-26
US12451407B2 (en) 2025-10-21
KR102860491B1 (ko) 2025-09-16
CN116648315A (zh) 2023-08-25
KR20230122028A (ko) 2023-08-22
WO2022138711A1 (ja) 2022-06-30
US20240304514A1 (en) 2024-09-12
JPWO2022138711A1 (https=) 2022-06-30

Similar Documents

Publication Publication Date Title
US6129993A (en) Heat spreader and method of making the same
EP1944116A1 (en) Cladding material and its fabrication method, method for molding cladding material, and heat sink using cladding material
JP6024477B2 (ja) ヒートシンク付パワーモジュール用基板の製造方法
WO2015053316A1 (ja) ヒートシンク付パワーモジュール用基板及びその製造方法
CN110383468A (zh) 带散热片的功率模块用基板
JP6201827B2 (ja) 放熱板付パワーモジュール用基板の製造方法
CN114365276A (zh) 散热板、半导体封装及半导体模块
JP7658992B2 (ja) 複合材料、半導体パッケージ及び複合材料の製造方法
JP7640558B2 (ja) 複合材料、ヒートスプレッダ及び半導体パッケージ
JP6754973B2 (ja) グラファイト放熱板
JP2022178275A (ja) 放熱板および半導体パッケージ
WO2022172856A1 (ja) 複合材料、ヒートスプレッダ及び半導体パッケージ
JP2018041868A (ja) 放熱基板
JP7700510B2 (ja) 放熱板および半導体パッケージ
JP7630771B2 (ja) 放熱板および半導体パッケージ
WO2022172855A1 (ja) 複合材料、ヒートスプレッダ及び半導体パッケージ
JP2018041867A (ja) 放熱基板、及び放熱基板の製造方法
KR102945417B1 (ko) 복합 재료, 히트 스프레더 및 반도체 패키지
JP7709872B2 (ja) 接合体、その製造方法、および電極埋設部材
WO2025115552A1 (ja) 複合材料、ヒートスプレッダ、および半導体パッケージ
JP2024114530A (ja) 複合材料、ヒートスプレッダ、および半導体パッケージ
JP6784863B1 (ja) 放熱板
JPH11297908A (ja) ヒ―トスプレッダおよびこれを用いた半導体装置ならびにヒ―トスプレッダの製造方法
HK1121989B (en) Cladding material and its fabrication method, method for molding cladding material, and heat sink using cladding material

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230427

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240722

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240722

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250311

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250327

R150 Certificate of patent or registration of utility model

Ref document number: 7658992

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150