JPWO2022138711A5 - - Google Patents
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- JPWO2022138711A5 JPWO2022138711A5 JP2022571545A JP2022571545A JPWO2022138711A5 JP WO2022138711 A5 JPWO2022138711 A5 JP WO2022138711A5 JP 2022571545 A JP2022571545 A JP 2022571545A JP 2022571545 A JP2022571545 A JP 2022571545A JP WO2022138711 A5 JPWO2022138711 A5 JP WO2022138711A5
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- JP
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- Prior art keywords
- composite material
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- 239000002131 composite material Substances 0.000 claims description 68
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 12
- 229910052750 molybdenum Inorganic materials 0.000 claims 12
- 239000011733 molybdenum Substances 0.000 claims 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 8
- 229910052802 copper Inorganic materials 0.000 claims 8
- 239000010949 copper Substances 0.000 claims 8
- 239000004065 semiconductor Substances 0.000 claims 6
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020214612 | 2020-12-24 | ||
| JP2020214612 | 2020-12-24 | ||
| PCT/JP2021/047541 WO2022138711A1 (ja) | 2020-12-24 | 2021-12-22 | 複合材料、半導体パッケージ及び複合材料の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022138711A1 JPWO2022138711A1 (https=) | 2022-06-30 |
| JPWO2022138711A5 true JPWO2022138711A5 (https=) | 2024-07-30 |
| JP7658992B2 JP7658992B2 (ja) | 2025-04-08 |
Family
ID=82159785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022571545A Active JP7658992B2 (ja) | 2020-12-24 | 2021-12-22 | 複合材料、半導体パッケージ及び複合材料の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12451407B2 (https=) |
| JP (1) | JP7658992B2 (https=) |
| KR (1) | KR102860491B1 (https=) |
| CN (1) | CN116648315A (https=) |
| DE (1) | DE112021006684T5 (https=) |
| WO (1) | WO2022138711A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117531833B (zh) * | 2024-01-10 | 2024-04-02 | 太原理工大学 | 一种大厚比镁/钛复合板脉冲电流辅助轧制复合方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06268117A (ja) * | 1993-03-15 | 1994-09-22 | Sumitomo Electric Ind Ltd | 半導体装置用放熱基板およびその製造方法 |
| JP2005340560A (ja) * | 2004-05-28 | 2005-12-08 | Kyocera Corp | 電子部品収納用パッケージおよび電子装置 |
| JP4227610B2 (ja) * | 2005-10-03 | 2009-02-18 | 京セラ株式会社 | 放熱基体の製造方法 |
| JP3862737B1 (ja) * | 2005-10-18 | 2006-12-27 | 栄樹 津島 | クラッド材およびその製造方法、クラッド材の成型方法、クラッド材を用いた放熱基板 |
| JP2007142126A (ja) * | 2005-11-18 | 2007-06-07 | Allied Material Corp | 複合材料及び半導体搭載用放熱基板、及びそれを用いたセラミックパッケージ |
| US10347559B2 (en) * | 2011-03-16 | 2019-07-09 | Momentive Performance Materials Inc. | High thermal conductivity/low coefficient of thermal expansion composites |
| US10215512B2 (en) | 2014-05-29 | 2019-02-26 | A.L.M.T. Corp. | Heat spreader and method for manufacturing the same |
| JP6455896B1 (ja) | 2017-11-18 | 2019-01-23 | Jfe精密株式会社 | 放熱板及びその製造方法 |
| JP6732395B1 (ja) * | 2019-08-29 | 2020-07-29 | Jfe精密株式会社 | 放熱板 |
-
2021
- 2021-12-22 KR KR1020237021003A patent/KR102860491B1/ko active Active
- 2021-12-22 CN CN202180087005.0A patent/CN116648315A/zh active Pending
- 2021-12-22 US US18/268,333 patent/US12451407B2/en active Active
- 2021-12-22 JP JP2022571545A patent/JP7658992B2/ja active Active
- 2021-12-22 WO PCT/JP2021/047541 patent/WO2022138711A1/ja not_active Ceased
- 2021-12-22 DE DE112021006684.6T patent/DE112021006684T5/de active Pending
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