CN116648315A - 复合材料、半导体封装件、以及复合材料的制造方法 - Google Patents

复合材料、半导体封装件、以及复合材料的制造方法 Download PDF

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Publication number
CN116648315A
CN116648315A CN202180087005.0A CN202180087005A CN116648315A CN 116648315 A CN116648315 A CN 116648315A CN 202180087005 A CN202180087005 A CN 202180087005A CN 116648315 A CN116648315 A CN 116648315A
Authority
CN
China
Prior art keywords
composite material
layer
thickness
copper
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180087005.0A
Other languages
English (en)
Chinese (zh)
Inventor
前田徹
宫永美纪
近藤大介
平井慧
伊藤正幸
山形伸一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALMT Corp
Sumitomo Electric Industries Ltd
Original Assignee
ALMT Corp
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ALMT Corp, Sumitomo Electric Industries Ltd filed Critical ALMT Corp
Publication of CN116648315A publication Critical patent/CN116648315A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Engineering (AREA)
CN202180087005.0A 2020-12-24 2021-12-22 复合材料、半导体封装件、以及复合材料的制造方法 Pending CN116648315A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020214612 2020-12-24
JP2020-214612 2020-12-24
PCT/JP2021/047541 WO2022138711A1 (ja) 2020-12-24 2021-12-22 複合材料、半導体パッケージ及び複合材料の製造方法

Publications (1)

Publication Number Publication Date
CN116648315A true CN116648315A (zh) 2023-08-25

Family

ID=82159785

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180087005.0A Pending CN116648315A (zh) 2020-12-24 2021-12-22 复合材料、半导体封装件、以及复合材料的制造方法

Country Status (6)

Country Link
US (1) US12451407B2 (https=)
JP (1) JP7658992B2 (https=)
KR (1) KR102860491B1 (https=)
CN (1) CN116648315A (https=)
DE (1) DE112021006684T5 (https=)
WO (1) WO2022138711A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117531833A (zh) * 2024-01-10 2024-02-09 太原理工大学 一种大厚比镁/钛复合板脉冲电流辅助轧制复合方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06268117A (ja) * 1993-03-15 1994-09-22 Sumitomo Electric Ind Ltd 半導体装置用放熱基板およびその製造方法
JP2005340560A (ja) * 2004-05-28 2005-12-08 Kyocera Corp 電子部品収納用パッケージおよび電子装置
JP4227610B2 (ja) 2005-10-03 2009-02-18 京セラ株式会社 放熱基体の製造方法
JP3862737B1 (ja) * 2005-10-18 2006-12-27 栄樹 津島 クラッド材およびその製造方法、クラッド材の成型方法、クラッド材を用いた放熱基板
JP2007142126A (ja) 2005-11-18 2007-06-07 Allied Material Corp 複合材料及び半導体搭載用放熱基板、及びそれを用いたセラミックパッケージ
US10347559B2 (en) * 2011-03-16 2019-07-09 Momentive Performance Materials Inc. High thermal conductivity/low coefficient of thermal expansion composites
US10215512B2 (en) 2014-05-29 2019-02-26 A.L.M.T. Corp. Heat spreader and method for manufacturing the same
JP6455896B1 (ja) * 2017-11-18 2019-01-23 Jfe精密株式会社 放熱板及びその製造方法
JP6732395B1 (ja) 2019-08-29 2020-07-29 Jfe精密株式会社 放熱板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117531833A (zh) * 2024-01-10 2024-02-09 太原理工大学 一种大厚比镁/钛复合板脉冲电流辅助轧制复合方法
CN117531833B (zh) * 2024-01-10 2024-04-02 太原理工大学 一种大厚比镁/钛复合板脉冲电流辅助轧制复合方法
US12370774B2 (en) 2024-01-10 2025-07-29 Taiyuan University Of Technology Pulse current-assisted roll bonding method for magnesium/titanium composite plate with large thickness ratio

Also Published As

Publication number Publication date
US12451407B2 (en) 2025-10-21
KR20230122028A (ko) 2023-08-22
KR102860491B1 (ko) 2025-09-16
JP7658992B2 (ja) 2025-04-08
JPWO2022138711A1 (https=) 2022-06-30
WO2022138711A1 (ja) 2022-06-30
DE112021006684T5 (de) 2023-10-26
US20240304514A1 (en) 2024-09-12

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