DE112021006684T5 - Verbundmaterial, Halbleiterbaugruppe, und Verfahren zur Herstellung von Verbundmaterial - Google Patents

Verbundmaterial, Halbleiterbaugruppe, und Verfahren zur Herstellung von Verbundmaterial Download PDF

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Publication number
DE112021006684T5
DE112021006684T5 DE112021006684.6T DE112021006684T DE112021006684T5 DE 112021006684 T5 DE112021006684 T5 DE 112021006684T5 DE 112021006684 T DE112021006684 T DE 112021006684T DE 112021006684 T5 DE112021006684 T5 DE 112021006684T5
Authority
DE
Germany
Prior art keywords
composite material
layer
thickness
layers
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021006684.6T
Other languages
German (de)
English (en)
Inventor
Toru Maeda
Miki Miyanaga
Daisuke Kondo
Kei Hirai
Masayuki Ito
Shin-ichi Yamagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALMT Corp
Sumitomo Electric Industries Ltd
Original Assignee
ALMT Corp
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ALMT Corp, Sumitomo Electric Industries Ltd filed Critical ALMT Corp
Publication of DE112021006684T5 publication Critical patent/DE112021006684T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Engineering (AREA)
DE112021006684.6T 2020-12-24 2021-12-22 Verbundmaterial, Halbleiterbaugruppe, und Verfahren zur Herstellung von Verbundmaterial Pending DE112021006684T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020214612 2020-12-24
JP2020-214612 2020-12-24
PCT/JP2021/047541 WO2022138711A1 (ja) 2020-12-24 2021-12-22 複合材料、半導体パッケージ及び複合材料の製造方法

Publications (1)

Publication Number Publication Date
DE112021006684T5 true DE112021006684T5 (de) 2023-10-26

Family

ID=82159785

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021006684.6T Pending DE112021006684T5 (de) 2020-12-24 2021-12-22 Verbundmaterial, Halbleiterbaugruppe, und Verfahren zur Herstellung von Verbundmaterial

Country Status (6)

Country Link
US (1) US12451407B2 (https=)
JP (1) JP7658992B2 (https=)
KR (1) KR102860491B1 (https=)
CN (1) CN116648315A (https=)
DE (1) DE112021006684T5 (https=)
WO (1) WO2022138711A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117531833B (zh) * 2024-01-10 2024-04-02 太原理工大学 一种大厚比镁/钛复合板脉冲电流辅助轧制复合方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019096654A (ja) 2017-11-18 2019-06-20 Jfe精密株式会社 放熱板及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06268117A (ja) * 1993-03-15 1994-09-22 Sumitomo Electric Ind Ltd 半導体装置用放熱基板およびその製造方法
JP2005340560A (ja) * 2004-05-28 2005-12-08 Kyocera Corp 電子部品収納用パッケージおよび電子装置
JP4227610B2 (ja) * 2005-10-03 2009-02-18 京セラ株式会社 放熱基体の製造方法
JP3862737B1 (ja) * 2005-10-18 2006-12-27 栄樹 津島 クラッド材およびその製造方法、クラッド材の成型方法、クラッド材を用いた放熱基板
JP2007142126A (ja) * 2005-11-18 2007-06-07 Allied Material Corp 複合材料及び半導体搭載用放熱基板、及びそれを用いたセラミックパッケージ
US10347559B2 (en) * 2011-03-16 2019-07-09 Momentive Performance Materials Inc. High thermal conductivity/low coefficient of thermal expansion composites
US10215512B2 (en) 2014-05-29 2019-02-26 A.L.M.T. Corp. Heat spreader and method for manufacturing the same
JP6732395B1 (ja) * 2019-08-29 2020-07-29 Jfe精密株式会社 放熱板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019096654A (ja) 2017-11-18 2019-06-20 Jfe精密株式会社 放熱板及びその製造方法

Also Published As

Publication number Publication date
US12451407B2 (en) 2025-10-21
KR102860491B1 (ko) 2025-09-16
CN116648315A (zh) 2023-08-25
KR20230122028A (ko) 2023-08-22
WO2022138711A1 (ja) 2022-06-30
JP7658992B2 (ja) 2025-04-08
US20240304514A1 (en) 2024-09-12
JPWO2022138711A1 (https=) 2022-06-30

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R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023373000

Ipc: H10W0040250000