JP7647745B2 - 加工システム - Google Patents

加工システム Download PDF

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Publication number
JP7647745B2
JP7647745B2 JP2022516540A JP2022516540A JP7647745B2 JP 7647745 B2 JP7647745 B2 JP 7647745B2 JP 2022516540 A JP2022516540 A JP 2022516540A JP 2022516540 A JP2022516540 A JP 2022516540A JP 7647745 B2 JP7647745 B2 JP 7647745B2
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JP
Japan
Prior art keywords
light
processing
processing system
optical system
workpiece
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JP2022516540A
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English (en)
Japanese (ja)
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JPWO2021214899A1 (https=
JPWO2021214899A5 (https=
Inventor
和樹 上野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of JPWO2021214899A1 publication Critical patent/JPWO2021214899A1/ja
Publication of JPWO2021214899A5 publication Critical patent/JPWO2021214899A5/ja
Priority to JP2025032878A priority Critical patent/JP2025087784A/ja
Application granted granted Critical
Publication of JP7647745B2 publication Critical patent/JP7647745B2/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34Laser welding for purposes other than joining
    • B23K26/342Build-up welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20Direct sintering or melting
    • B22F10/28Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/36Process control of energy beam parameters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90Means for process control, e.g. cameras or sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Analytical Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Powder Metallurgy (AREA)
JP2022516540A 2020-04-22 2020-04-22 加工システム Active JP7647745B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025032878A JP2025087784A (ja) 2020-04-22 2025-03-03 加工システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/017292 WO2021214899A1 (ja) 2020-04-22 2020-04-22 加工システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025032878A Division JP2025087784A (ja) 2020-04-22 2025-03-03 加工システム

Publications (3)

Publication Number Publication Date
JPWO2021214899A1 JPWO2021214899A1 (https=) 2021-10-28
JPWO2021214899A5 JPWO2021214899A5 (https=) 2023-03-27
JP7647745B2 true JP7647745B2 (ja) 2025-03-18

Family

ID=78270563

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022516540A Active JP7647745B2 (ja) 2020-04-22 2020-04-22 加工システム
JP2025032878A Withdrawn JP2025087784A (ja) 2020-04-22 2025-03-03 加工システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025032878A Withdrawn JP2025087784A (ja) 2020-04-22 2025-03-03 加工システム

Country Status (5)

Country Link
US (1) US20230158607A1 (https=)
EP (1) EP4140633A4 (https=)
JP (2) JP7647745B2 (https=)
CN (1) CN115427187A (https=)
WO (1) WO2021214899A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7515722B2 (ja) * 2021-06-29 2024-07-12 三菱電機株式会社 加工ヘッド及び付加製造装置
JP2024113260A (ja) * 2023-02-09 2024-08-22 株式会社豊田中央研究所 造形装置およびレーザ加工ヘッド
CN120079893B (zh) * 2025-04-30 2025-09-23 湖南云箭集团有限公司 多光束融合的沉积系统及其方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005106797A (ja) 2003-09-09 2005-04-21 Univ Of Fukui 測定装置、測定システムおよび測定方法
JP2005279761A (ja) 2004-03-30 2005-10-13 V Technology Co Ltd レーザ加工方法およびレーザ加工装置
JP2005537934A (ja) 2002-09-06 2005-12-15 アルストム テクノロジー リミテッド レーザー金属成形による硬い層の微細構造の制御方法
JP2016026881A (ja) 2014-06-23 2016-02-18 三菱電機株式会社 レーザ加工装置
WO2017170890A1 (ja) 2016-03-31 2017-10-05 株式会社村谷機械製作所 レーザ加工装置及びレーザ加工方法
JP2018039028A (ja) 2016-09-07 2018-03-15 村田機械株式会社 レーザ加工機、及びレーザ加工方法
WO2018181344A1 (ja) 2017-03-31 2018-10-04 株式会社ニコン 処理方法及び処理システム
JP2018158361A (ja) 2017-03-23 2018-10-11 住友重機械工業株式会社 レーザ加工装置
JP6535821B2 (ja) 2017-05-16 2019-06-26 Dmg森精機株式会社 付加加工用ヘッドおよび加工機械

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2814521B2 (ja) * 1989-02-28 1998-10-22 株式会社ニコン 位置検出装置
US5763853A (en) * 1994-04-20 1998-06-09 Hitachi Construction Machinery Co., Ltd. Laser processing apparatus, laser processing method and dam bar processing method
JP4395217B2 (ja) * 1999-05-17 2010-01-06 株式会社アマダエンジニアリングセンター レーザ溶接用複合ヘッド
US8674257B2 (en) * 2008-02-11 2014-03-18 Applied Materials, Inc. Automatic focus and emissivity measurements for a substrate system
JP4611431B1 (ja) * 2009-06-29 2011-01-12 西進商事株式会社 レーザー照射装置及びレーザー加工方法
CN107390477B (zh) * 2011-10-24 2020-02-14 株式会社尼康 照明系统、曝光装置及制造、图像形成、照明与曝光方法
US10258982B2 (en) 2014-04-23 2019-04-16 Japan Science And Technology Agency Combined-blade open flow path device and joined body thereof
JP7099443B2 (ja) * 2017-03-31 2022-07-12 株式会社ニコン 造形システム及び造形方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537934A (ja) 2002-09-06 2005-12-15 アルストム テクノロジー リミテッド レーザー金属成形による硬い層の微細構造の制御方法
JP2005106797A (ja) 2003-09-09 2005-04-21 Univ Of Fukui 測定装置、測定システムおよび測定方法
JP2005279761A (ja) 2004-03-30 2005-10-13 V Technology Co Ltd レーザ加工方法およびレーザ加工装置
JP2016026881A (ja) 2014-06-23 2016-02-18 三菱電機株式会社 レーザ加工装置
WO2017170890A1 (ja) 2016-03-31 2017-10-05 株式会社村谷機械製作所 レーザ加工装置及びレーザ加工方法
JP2018039028A (ja) 2016-09-07 2018-03-15 村田機械株式会社 レーザ加工機、及びレーザ加工方法
JP2018158361A (ja) 2017-03-23 2018-10-11 住友重機械工業株式会社 レーザ加工装置
WO2018181344A1 (ja) 2017-03-31 2018-10-04 株式会社ニコン 処理方法及び処理システム
JP6535821B2 (ja) 2017-05-16 2019-06-26 Dmg森精機株式会社 付加加工用ヘッドおよび加工機械

Also Published As

Publication number Publication date
WO2021214899A1 (ja) 2021-10-28
JPWO2021214899A1 (https=) 2021-10-28
JP2025087784A (ja) 2025-06-10
CN115427187A (zh) 2022-12-02
US20230158607A1 (en) 2023-05-25
EP4140633A4 (en) 2024-01-10
EP4140633A1 (en) 2023-03-01

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