JPWO2021214899A5 - - Google Patents

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Publication number
JPWO2021214899A5
JPWO2021214899A5 JP2022516540A JP2022516540A JPWO2021214899A5 JP WO2021214899 A5 JPWO2021214899 A5 JP WO2021214899A5 JP 2022516540 A JP2022516540 A JP 2022516540A JP 2022516540 A JP2022516540 A JP 2022516540A JP WO2021214899 A5 JPWO2021214899 A5 JP WO2021214899A5
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JP
Japan
Prior art keywords
light
processing system
energy beam
optical system
condensing optical
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JP2022516540A
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English (en)
Japanese (ja)
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JPWO2021214899A1 (https=
JP7647745B2 (ja
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Priority claimed from PCT/JP2020/017292 external-priority patent/WO2021214899A1/ja
Publication of JPWO2021214899A1 publication Critical patent/JPWO2021214899A1/ja
Publication of JPWO2021214899A5 publication Critical patent/JPWO2021214899A5/ja
Priority to JP2025032878A priority Critical patent/JP2025087784A/ja
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Publication of JP7647745B2 publication Critical patent/JP7647745B2/ja
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JP2022516540A 2020-04-22 2020-04-22 加工システム Active JP7647745B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025032878A JP2025087784A (ja) 2020-04-22 2025-03-03 加工システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/017292 WO2021214899A1 (ja) 2020-04-22 2020-04-22 加工システム

Related Child Applications (1)

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JP2025032878A Division JP2025087784A (ja) 2020-04-22 2025-03-03 加工システム

Publications (3)

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JPWO2021214899A1 JPWO2021214899A1 (https=) 2021-10-28
JPWO2021214899A5 true JPWO2021214899A5 (https=) 2023-03-27
JP7647745B2 JP7647745B2 (ja) 2025-03-18

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ID=78270563

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JP2022516540A Active JP7647745B2 (ja) 2020-04-22 2020-04-22 加工システム
JP2025032878A Withdrawn JP2025087784A (ja) 2020-04-22 2025-03-03 加工システム

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JP2025032878A Withdrawn JP2025087784A (ja) 2020-04-22 2025-03-03 加工システム

Country Status (5)

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US (1) US20230158607A1 (https=)
EP (1) EP4140633A4 (https=)
JP (2) JP7647745B2 (https=)
CN (1) CN115427187A (https=)
WO (1) WO2021214899A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7515722B2 (ja) * 2021-06-29 2024-07-12 三菱電機株式会社 加工ヘッド及び付加製造装置
JP2024113260A (ja) * 2023-02-09 2024-08-22 株式会社豊田中央研究所 造形装置およびレーザ加工ヘッド
CN120079893B (zh) * 2025-04-30 2025-09-23 湖南云箭集团有限公司 多光束融合的沉积系统及其方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2814521B2 (ja) * 1989-02-28 1998-10-22 株式会社ニコン 位置検出装置
US5763853A (en) * 1994-04-20 1998-06-09 Hitachi Construction Machinery Co., Ltd. Laser processing apparatus, laser processing method and dam bar processing method
JP4395217B2 (ja) * 1999-05-17 2010-01-06 株式会社アマダエンジニアリングセンター レーザ溶接用複合ヘッド
EP1396556A1 (en) * 2002-09-06 2004-03-10 ALSTOM (Switzerland) Ltd Method for controlling the microstructure of a laser metal formed hard layer
JP2005106797A (ja) 2003-09-09 2005-04-21 Univ Of Fukui 測定装置、測定システムおよび測定方法
JP4615238B2 (ja) * 2004-03-30 2011-01-19 株式会社ブイ・テクノロジー レーザ加工装置
US8674257B2 (en) * 2008-02-11 2014-03-18 Applied Materials, Inc. Automatic focus and emissivity measurements for a substrate system
JP4611431B1 (ja) * 2009-06-29 2011-01-12 西進商事株式会社 レーザー照射装置及びレーザー加工方法
CN107390477B (zh) * 2011-10-24 2020-02-14 株式会社尼康 照明系统、曝光装置及制造、图像形成、照明与曝光方法
US10258982B2 (en) 2014-04-23 2019-04-16 Japan Science And Technology Agency Combined-blade open flow path device and joined body thereof
JP6218770B2 (ja) * 2014-06-23 2017-10-25 三菱電機株式会社 レーザ加工装置
WO2017170890A1 (ja) * 2016-03-31 2017-10-05 株式会社村谷機械製作所 レーザ加工装置及びレーザ加工方法
JP6801312B2 (ja) 2016-09-07 2020-12-16 村田機械株式会社 レーザ加工機、及びレーザ加工方法
JP6809952B2 (ja) * 2017-03-23 2021-01-06 住友重機械工業株式会社 レーザ加工装置
JP7099443B2 (ja) * 2017-03-31 2022-07-12 株式会社ニコン 造形システム及び造形方法
EP3610971A4 (en) * 2017-03-31 2021-02-17 Nikon Corporation PROCESSING METHOD AND PROCESSING SYSTEM
JP6535821B2 (ja) * 2017-05-16 2019-06-26 Dmg森精機株式会社 付加加工用ヘッドおよび加工機械

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