CN115427187A - 加工系统 - Google Patents

加工系统 Download PDF

Info

Publication number
CN115427187A
CN115427187A CN202080100025.2A CN202080100025A CN115427187A CN 115427187 A CN115427187 A CN 115427187A CN 202080100025 A CN202080100025 A CN 202080100025A CN 115427187 A CN115427187 A CN 115427187A
Authority
CN
China
Prior art keywords
light
processing
processing system
energy beam
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080100025.2A
Other languages
English (en)
Chinese (zh)
Inventor
上野和树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN115427187A publication Critical patent/CN115427187A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B23K26/342—Build-up welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/36—Process control of energy beam parameters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90—Means for process control, e.g. cameras or sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Analytical Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Powder Metallurgy (AREA)
CN202080100025.2A 2020-04-22 2020-04-22 加工系统 Pending CN115427187A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/017292 WO2021214899A1 (ja) 2020-04-22 2020-04-22 加工システム

Publications (1)

Publication Number Publication Date
CN115427187A true CN115427187A (zh) 2022-12-02

Family

ID=78270563

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080100025.2A Pending CN115427187A (zh) 2020-04-22 2020-04-22 加工系统

Country Status (5)

Country Link
US (1) US20230158607A1 (https=)
EP (1) EP4140633A4 (https=)
JP (2) JP7647745B2 (https=)
CN (1) CN115427187A (https=)
WO (1) WO2021214899A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120079893A (zh) * 2025-04-30 2025-06-03 湖南云箭集团有限公司 多光束融合的沉积系统及其方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7515722B2 (ja) * 2021-06-29 2024-07-12 三菱電機株式会社 加工ヘッド及び付加製造装置
JP2024113260A (ja) * 2023-02-09 2024-08-22 株式会社豊田中央研究所 造形装置およびレーザ加工ヘッド

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5763853A (en) * 1994-04-20 1998-06-09 Hitachi Construction Machinery Co., Ltd. Laser processing apparatus, laser processing method and dam bar processing method
CN102348530A (zh) * 2009-06-29 2012-02-08 西进商事株式会社 激光照射装置和激光加工方法
CN104025257A (zh) * 2011-10-24 2014-09-03 株式会社尼康 照明光学系统、曝光装置以及组件制造方法
CN107803585A (zh) * 2016-09-07 2018-03-16 村田机械株式会社 激光加工机及激光加工方法
CN108778610A (zh) * 2016-03-31 2018-11-09 株式会社村谷机械制作所 激光加工装置和激光加工方法
CN110621426A (zh) * 2017-03-31 2019-12-27 株式会社尼康 处理方法及处理系统
CN110709195A (zh) * 2017-03-31 2020-01-17 株式会社尼康 造型系统及造型方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2814521B2 (ja) * 1989-02-28 1998-10-22 株式会社ニコン 位置検出装置
JP4395217B2 (ja) * 1999-05-17 2010-01-06 株式会社アマダエンジニアリングセンター レーザ溶接用複合ヘッド
EP1396556A1 (en) * 2002-09-06 2004-03-10 ALSTOM (Switzerland) Ltd Method for controlling the microstructure of a laser metal formed hard layer
JP2005106797A (ja) 2003-09-09 2005-04-21 Univ Of Fukui 測定装置、測定システムおよび測定方法
JP4615238B2 (ja) * 2004-03-30 2011-01-19 株式会社ブイ・テクノロジー レーザ加工装置
US8674257B2 (en) * 2008-02-11 2014-03-18 Applied Materials, Inc. Automatic focus and emissivity measurements for a substrate system
US10258982B2 (en) 2014-04-23 2019-04-16 Japan Science And Technology Agency Combined-blade open flow path device and joined body thereof
JP6218770B2 (ja) * 2014-06-23 2017-10-25 三菱電機株式会社 レーザ加工装置
JP6809952B2 (ja) * 2017-03-23 2021-01-06 住友重機械工業株式会社 レーザ加工装置
JP6535821B2 (ja) * 2017-05-16 2019-06-26 Dmg森精機株式会社 付加加工用ヘッドおよび加工機械

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5763853A (en) * 1994-04-20 1998-06-09 Hitachi Construction Machinery Co., Ltd. Laser processing apparatus, laser processing method and dam bar processing method
CN102348530A (zh) * 2009-06-29 2012-02-08 西进商事株式会社 激光照射装置和激光加工方法
CN104025257A (zh) * 2011-10-24 2014-09-03 株式会社尼康 照明光学系统、曝光装置以及组件制造方法
CN108778610A (zh) * 2016-03-31 2018-11-09 株式会社村谷机械制作所 激光加工装置和激光加工方法
CN107803585A (zh) * 2016-09-07 2018-03-16 村田机械株式会社 激光加工机及激光加工方法
CN110621426A (zh) * 2017-03-31 2019-12-27 株式会社尼康 处理方法及处理系统
CN110709195A (zh) * 2017-03-31 2020-01-17 株式会社尼康 造型系统及造型方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120079893A (zh) * 2025-04-30 2025-06-03 湖南云箭集团有限公司 多光束融合的沉积系统及其方法

Also Published As

Publication number Publication date
WO2021214899A1 (ja) 2021-10-28
JPWO2021214899A1 (https=) 2021-10-28
JP2025087784A (ja) 2025-06-10
JP7647745B2 (ja) 2025-03-18
US20230158607A1 (en) 2023-05-25
EP4140633A4 (en) 2024-01-10
EP4140633A1 (en) 2023-03-01

Similar Documents

Publication Publication Date Title
JP7639823B2 (ja) 加工システム
JP7736112B2 (ja) 加工システム
JP2025087784A (ja) 加工システム
JP7400803B2 (ja) 加工システム及び加工方法
CN115415552B (zh) 造型系统、造型方法及计算机程序
WO2021149683A1 (ja) 加工システム
JP2024038158A (ja) 加工システム及び光学装置
WO2022107238A1 (ja) 撮像ヘッド、制御システム及び加工システム
JP7571801B2 (ja) 造形システム
WO2023042341A1 (ja) 造形システム
EP4501521A1 (en) Processing device
WO2022157914A1 (ja) 加工方法
JP7619435B2 (ja) 造形装置及び造形方法
JP7786586B2 (ja) 造形システム
WO2024201896A1 (ja) 情報処理方法、情報処理装置、造形方法、造形装置、表示方法及び表示装置
WO2025027849A1 (ja) 造形システムおよび造形方法
WO2025203621A1 (ja) 付加加工装置、粉体供給方法、および粉体供給装置
CN119300948A (zh) 加工系统

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20221202

WD01 Invention patent application deemed withdrawn after publication