JP7643644B2 - 伸縮デバイス - Google Patents
伸縮デバイス Download PDFInfo
- Publication number
- JP7643644B2 JP7643644B2 JP2024530735A JP2024530735A JP7643644B2 JP 7643644 B2 JP7643644 B2 JP 7643644B2 JP 2024530735 A JP2024530735 A JP 2024530735A JP 2024530735 A JP2024530735 A JP 2024530735A JP 7643644 B2 JP7643644 B2 JP 7643644B2
- Authority
- JP
- Japan
- Prior art keywords
- stretchable
- elastic
- wire
- wiring
- expandable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 238000006073 displacement reaction Methods 0.000 claims description 9
- 239000012815 thermoplastic material Substances 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 239000004020 conductor Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 8
- 239000010410 layer Substances 0.000 description 6
- 239000013008 thixotropic agent Substances 0.000 description 6
- 238000004364 calculation method Methods 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022106362 | 2022-06-30 | ||
| JP2022106362 | 2022-06-30 | ||
| PCT/JP2023/022959 WO2024004783A1 (ja) | 2022-06-30 | 2023-06-21 | 伸縮デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024004783A1 JPWO2024004783A1 (https=) | 2024-01-04 |
| JPWO2024004783A5 JPWO2024004783A5 (https=) | 2025-02-28 |
| JP7643644B2 true JP7643644B2 (ja) | 2025-03-11 |
Family
ID=89382262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024530735A Active JP7643644B2 (ja) | 2022-06-30 | 2023-06-21 | 伸縮デバイス |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250120012A1 (https=) |
| JP (1) | JP7643644B2 (https=) |
| CN (1) | CN119452737A (https=) |
| WO (1) | WO2024004783A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025173538A1 (ja) * | 2024-02-13 | 2025-08-21 | 株式会社村田製作所 | 伸縮性デバイス |
| WO2025249078A1 (ja) * | 2024-05-27 | 2025-12-04 | 株式会社村田製作所 | 伸縮性デバイス |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009081929A1 (ja) | 2007-12-26 | 2009-07-02 | Fujikura Ltd. | 実装基板及びその製造方法 |
| WO2017065270A1 (ja) | 2015-10-16 | 2017-04-20 | 国立研究開発法人科学技術振興機構 | 応力緩和基板及びテキスタイル型デバイス |
| JP2017143257A (ja) | 2016-02-05 | 2017-08-17 | 日本メクトロン株式会社 | 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法 |
| JP2018186214A (ja) | 2017-04-27 | 2018-11-22 | セイコーエプソン株式会社 | 伸縮性回路基板およびひずみセンサー |
| JP2019029514A (ja) | 2017-07-31 | 2019-02-21 | セイコーエプソン株式会社 | 配線デバイスおよびひずみセンサー |
| WO2022070624A1 (ja) | 2020-09-29 | 2022-04-07 | 株式会社村田製作所 | 伸縮性実装基板及び伸縮性実装基板の製造方法 |
-
2023
- 2023-06-21 WO PCT/JP2023/022959 patent/WO2024004783A1/ja not_active Ceased
- 2023-06-21 CN CN202380050370.3A patent/CN119452737A/zh active Pending
- 2023-06-21 JP JP2024530735A patent/JP7643644B2/ja active Active
-
2024
- 2024-12-17 US US18/983,657 patent/US20250120012A1/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009081929A1 (ja) | 2007-12-26 | 2009-07-02 | Fujikura Ltd. | 実装基板及びその製造方法 |
| WO2017065270A1 (ja) | 2015-10-16 | 2017-04-20 | 国立研究開発法人科学技術振興機構 | 応力緩和基板及びテキスタイル型デバイス |
| JP2017143257A (ja) | 2016-02-05 | 2017-08-17 | 日本メクトロン株式会社 | 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法 |
| JP2018186214A (ja) | 2017-04-27 | 2018-11-22 | セイコーエプソン株式会社 | 伸縮性回路基板およびひずみセンサー |
| JP2019029514A (ja) | 2017-07-31 | 2019-02-21 | セイコーエプソン株式会社 | 配線デバイスおよびひずみセンサー |
| WO2022070624A1 (ja) | 2020-09-29 | 2022-04-07 | 株式会社村田製作所 | 伸縮性実装基板及び伸縮性実装基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN119452737A (zh) | 2025-02-14 |
| JPWO2024004783A1 (https=) | 2024-01-04 |
| WO2024004783A1 (ja) | 2024-01-04 |
| US20250120012A1 (en) | 2025-04-10 |
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